Robot blade having multiple sensors for multiple different alignment tasks

1 . A method for transferring a wafer in a semiconductor manufacturing process, applied through a controller, comprising:

aligning a blade of a robot with the wafer using a first sensor of the blade;

positioning the wafer on the blade with chunking;

cleaning the wafer using a gas delivered through a gas outlet in the blade;

aligning the blade with a wafer holder using a second sensor of the blade; and

positioning the wafer on the wafer holder after lifting the wafer off from the blade,

wherein the positioning the wafer on the blade with chunking includes selectively applying a first chunking force through a first electrode embedded in the blade that generates a first amount of electrostatic charge, and applying a second chunking force through a second electrode embedded in the blade that generates a second amount of electrostatic charge, the first amount capable of being different from the second amount.

2 . The method of claim 1 , wherein the positioning the wafer on the blade with chunking includes selectively applying the first chunking force on a first portion of the wafer and applying the second chunking force on a second portion of the wafer, the first chunking force being sufficient to affix the first portion of the wafer to the blade, and the second chunking force being deficient to affix the second portion of the wafer to the blade.

3 . The method of claim 1 , comprising controlling an amount of the first chunking force by varying the first amount of electrostatic charge generated by the first electrode.

4 . The method of claim 1 , wherein the positioning the wafer on the blade with chunking includes applying a vacuum chunking force through an internal space in a column structure on a surface of the blade.

5 . The method of claim 4 , wherein the applying the vacuum chunking force includes selectively applying a first chunking force on a first portion of the wafer through a first internal space in a first column structure that corresponds to the first portion of the wafer and applying a second chunking force on a second portion of the wafer through a second internal space in a second column structure that corresponds to the second portion of the wafer.

6 . The method of claim 5 , wherein the first chunking force is different from the second chunking force.

7 . The method of claim 6 , wherein the first chunking force is sufficient to affix the first portion of the wafer to the blade, and the second chunking force is deficient to affix the second portion of the wafer to the blade.

8 . The method of claim 1 , wherein the positioning the wafer on the blade with chunking includes positioning the wafer on the blade with a first portion of the wafer closer to the blade than a second portion of the wafer; and

wherein the cleaning the wafer using the gas includes delivering the gas in a direction toward the second portion of the wafer.

9 . A method for transferring a wafer in a semiconductor manufacturing process, applied through a controller, comprising:

aligning a blade of a robot with the wafer using at least two first sensors on a first surface of the blade;

positioning the wafer on the blade with chunking;

aligning the blade with a wafer holder using a second sensor on a second surface of the blade opposite to the first surface; and

positioning the wafer on the wafer holder after lifting the wafer off from the blade,

wherein the positioning the wafer on the blade with chunking includes selectively applying a first chunking force through a first electrode embedded in the blade that generates a first amount of electrostatic charge, and applying a second chunking force through a second electrode embedded in the blade that generates a second amount of electrostatic charge, the first amount capable of being different from the second amount.

10 . The method of claim 9 , wherein the aligning the blade of the robot with the wafer using at least two first sensors on the first surface of the blade includes aligning the blade of the robot with the wafer using three first sensors on the first surface of the blade.

11 . The method of claim 9 , wherein the positioning the wafer on the blade with chunking includes applying one or more of an electrostatic chunking force or a vacuum chunking force.

12 . The method of claim 9 , wherein the positioning the wafer on the blade with chunking includes positioning the wafer on a plurality of column structures on a first surface of the blade.

13 . The method of claim 12 , wherein the positioning the wafer on the blade with chunking includes applying a vacuum chunking force through an internal space in one or more column structures of the plurality of column structures.

14 . The method of claim 13 , wherein the applying the vacuum chunking force includes applying a first vacuum chunking force through a first internal space of a first column structure that corresponds to a center portion of the wafer and applying a second vacuum chunking force through a second internal space of a second column structure that corresponds to an peripheral portion of the wafer, the first vacuum chunking force greater than the second vacuum chunking force.

15 . The method of claim 14 , wherein the second chunking force is insufficient to affix the peripheral portion of the wafer to the second column structure.

16 . A method for transferring a work piece in a semiconductor manufacturing process, applied through a controller, comprising:

receiving the work piece on a first surface of a blade; and

aligning the blade with the work piece using at least two first sensors on the first surface of the blade and aligning the blade with a work piece holder using a second sensor on a second surface of the blade opposite to the first surface;

chunking the work piece on the first surface of the blade using a first source of chunking force through a first electrode embedded under the first surface of the blade and a second source of chunking force through a second electrode embedded under the first surface of the blade, the first source of chunking force generating a first amount of chunking force of electrostatic charge generated by the first electrode on a first surface region of the first surface, the second source of chunking force generating a second amount of chunking force of electrostatic charge generated by the second electrode on a second surface region of the first surface, the first amount different from the second amount.

17 . The method of claim 16 , wherein the first source of chunking force and the second source of chunking force are a first vacuum channel and a second vacuum channel, respectively, each having an opening on the first surface.

18 . The method of claim 16 , wherein the chunking the work piece using the first source of chunking force and the second source of chunking force generates a gap between the work piece and the first surface of the blade, and

the method further comprises cleaning the work piece by delivering a gas toward the gap.

19 . The method of claim 16 , comprising aligning the blade with the work piece using at least two first sensors on the first surface of the blade positioning the work piece on the first surface of the blade with chunking includes applying a vacuum chunking force through an internal space in a column structure on a surface of the blade.

20 . The method of claim 19 , comprising aligning the blade with a wafer holder using a second sensor on a second surface of the blade opposite to the first surface wherein the applying the vacuum chunking force includes selectively applying a first chunking force on a first portion of the work piece through a first internal space in a first column structure that corresponds to the first portion of the work piece and applying a second chunking force on a second portion of the wafer through a second internal space in a second column structure that corresponds to the second portion of the work piece.