Substrate processing apparatus and method
A substrate processing apparatus includes: a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate; and a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure. The plurality of pins include a plurality of first pins in the first region and are configured to be elevated at the same time, and a plurality of second pins in the second region and are configured to be elevated at the same time. In operation, the first pins are elevated and adsorb the substrate first, and then, the second pins are elevated and adsorb the substrate.
1 . A substrate processing apparatus comprising:
a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate;
a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure, wherein the plurality of pins include a plurality of first pins in the first region configured to be elevated at a same time, and a plurality of second pins in the second region configured to be elevated at a same time; and
a controller configured to cause:
the plurality of first pins to be elevated to adsorb the substrate before the plurality of second pins are elevated to adsorb the substrate, and
the plurality of pins to be lowered after both the plurality of first pins and the plurality of second pins adsorb the substrate,
wherein each of the plurality of pins includes a through hole configured to be provided with the negative pressure, and a pressure space disposed around and fluidly isolated from the through hole and configured to provide positive-or-negative pressure.
2 . The substrate processing apparatus of claim 1 , wherein each of the plurality of pins includes a sub-pin configured to contact the substrate and to be elevated and lowered, a support member fixed in the stage below the sub-pin, the through hole penetrating the sub-pin and the support member, and the pressure space configured to provide the positive-or-negative pressure to the sub-pin.
3 . The substrate processing apparatus of claim 2 , wherein a height of the plurality of pins above the stage is controllable by releasing the positive-or-negative pressure provided by the pressure space to the sub-pins of the plurality of pins such that the plurality of pins are in contact with the substrate.
4 . A substrate processing apparatus, comprising:
a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate;
a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure, wherein each of the plurality of pins includes a sub-pin, a through hole configured to be provided with the negative pressure, and a pressure space configured to provide positive-or-negative pressure to the sub-pin, wherein the plurality of pins include a plurality of first pins in the first region, and a plurality of second pins in the second region;
a vacuum pump fluidly connected to the through holes of the plurality of pins and configured to provide the negative pressure to adsorb the substrate;
a first pump fluidly connected to the pressure spaces of the plurality of first pins and configured to provide the positive-or-negative pressure to elevate or lower the plurality of first pins at a same time; and
a second pump fluidly connected to the pressure spaces of the plurality of second pins and configured to provide the positive-or-negative pressure to elevate or lower the plurality of second pins at a same time.
5 . The substrate processing apparatus of claim 2 , wherein each of the plurality of pins further includes an adsorption member above the sub-pin and positioned to contact the substrate.
6 . The substrate processing apparatus of claim 1 , wherein the plurality of first pins is three first pins.
7 . The substrate processing apparatus of claim 1 , wherein a number of the plurality of second pins is greater than a number of the plurality of first pins.
8 . The substrate processing apparatus of claim 4 , wherein, in operation, the plurality of pins are configured to be lowered after the plurality of first pins and the plurality of second pins are elevated and adsorb the substrate.
9 . The substrate processing apparatus of claim 8 , wherein:
in operation, the plurality of first pins and the plurality of second pins are configured to be provided with the negative pressure when the plurality of pins are lowered, and
the substrate is configured to be in contact with a surface of the stage when the substrate is adsorbed by the plurality of first pins and the plurality of second pins.
10 . A substrate processing apparatus comprising:
a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate;
a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure, wherein each of the plurality of pins includes a sub-pin, a through hole configured to be provided with the negative pressure, and a pressure space configured to provide positive-or-negative pressure to the sub-pin, wherein the plurality of pins include a plurality of first pins in the first region, and a plurality of second pins in the second region;
a first pump configured to provide positive pressure of the positive-or-negative pressure to the pressure spaces of the plurality of first pins and/or the plurality of second pins; and
a second pump configured to provide negative pressure of the positive-or-negative pressure to the pressure spaces of the plurality of first pins and/or the plurality of second pins.
11 . The substrate processing apparatus of claim 10 , wherein:
the first pump is configured to provide the positive-or-negative pressure as the positive pressure of the positive-or-negative pressure by injecting a liquid, and
the second pump is configured to provide the positive-or-negative pressure as the negative pressure of the positive-or-negative pressure by releasing a liquid.
12 . The substrate processing apparatus of claim 4 , wherein a height of the plurality of pins above the stage is controllable by releasing the positive-or-negative pressure provided by the pressure space to the sub-pins of the plurality of pins such that the plurality of pins are in contact with the substrate.
13 . The substrate processing apparatus of claim 4 , wherein a number of the plurality of second pins is greater than a number of the plurality of first pins.
14 . The substrate processing apparatus of claim 4 , wherein, for each of the plurality of pins, the pressure space is disposed around and fluidly isolated from the through hole.
15 . The substrate processing apparatus of claim 4 , wherein:
the first pump is configured to provide the positive-or-negative pressure by injecting or releasing a liquid, and
the second pump is configured to provide the positive-or-negative pressure by injecting or releasing a liquid.
16 . The substrate processing apparatus of claim 12 , wherein, for each of the plurality of pins, the pressure space is disposed around and fluidly isolated from the through hole.
17 . The substrate processing apparatus of claim 10 , wherein a height of the plurality of pins above the stage is controllable by releasing the positive-or-negative pressure provided by the pressure space to the sub-pins of the plurality of pins such that the plurality of pins are in contact with the substrate.
18 . The substrate processing apparatus of claim 10 , wherein a number of the plurality of second pins is greater than a number of the plurality of first pins.
19 . The substrate processing apparatus of claim 10 , wherein, for each of the plurality of pins, the pressure space is disposed around and fluidly isolated from the through hole.
20 . The substrate processing apparatus of claim 10 , wherein, in operation, the plurality of pins are configured to be lowered after the plurality of first pins and the plurality of second pins are elevated and adsorb the substrate.