Semiconductor device
This semiconductor device includes a first switching element, a second switching element, and a resin layer that seals each switching element. The semiconductor device includes: a power supply electrode which is formed on the surface of the resin layer and of which at least a part overlaps the first switching element when viewed from a z direction; and a power supply via conductor that electrically connects the first switching element and the power supply electrode through the resin layer in the z direction.
1 . A semiconductor device, comprising:
a switching element;
a specified element;
a resin layer that encapsulates the switching element and the specified element, a thickness-wise direction of the resin layer conforming to a height-wise direction of the semiconductor device;
an external electrode formed on a surface of the resin layer, at least a portion of the external electrode overlapping the switching element as viewed in the height-wise direction; and
an element drive via conductor extending through the resin layer in the height-wise direction to electrically connect the switching element and the external electrode,
wherein
the switching element includes a first switching element,
the specified element includes a second switching element connected in series to the first switching element,
an output electrode is formed on the surface of the resin layer,
the semiconductor device further comprises:
an output via conductor disposed in the resin layer, wherein the output via conductor electrically connects the output electrode, the first switching element, and the second switching element,
the first switching element and the second switching element are spaced apart in a direction orthogonal to the height-wise direction,
as viewed in the height-wise direction, the output electrode is disposed between the first switching element and the second switching element, and
the output via conductor is crank-shaped and extends so as to include at least two bending points.
2 . The semiconductor device according to claim 1 , further comprising:
a support layer that supports the switching element and the specified element, wherein
the resin layer is formed on the support layer,
the switching element includes an element main surface that faces in a direction opposite from the support layer in the height-wise direction,
the element main surface includes a first drive electrode, a second drive electrode, and a control electrode, and
the support layer and the surface of the resin layer on which the external electrode is formed are disposed at opposite sides of the resin layer in the height-wise direction.
3 . The semiconductor device according to claim 2 , wherein the support layer includes a first metal layer on which the switching element is mounted, a second metal layer on which the specified element is mounted, and an insulation layer that electrically insulates the first metal layer and the second metal layer.
4 . The semiconductor device according to claim 1 , wherein
as viewed in the height-wise direction, the element drive via conductor is disposed to overlap the external electrode and the switching element, and
the element drive via conductor extends in the height-wise direction.
5 . The semiconductor device according to claim 1 , wherein
each of the first switching element and the second switching element includes a first drive electrode, a second drive electrode, and a control electrode,
the output via conductor includes:
a first output via conductor that connects the second drive electrode of the first switching element and the output electrode; and
a second output via conductor that connects the first drive electrode of the second switching element and the output electrode, and
the first output via conductor and the second output via conductor are spaced apart in an arrangement direction of the first switching element and the second switching element.
6 . The semiconductor device according to claim 5 , wherein
the resin layer includes
an element encapsulation layer that encapsulates the first switching element and the second switching element, and
a surface-side resin layer formed on the element encapsulation layer,
the first output via conductor includes
a first element connection via electrically connected to the second drive electrode of the first switching element,
a first electrode connection via connected to the output electrode, and
a first via connection wire that connects the first element connection via and the first electrode connection via,
the second output via conductor includes
a second element connection via electrically connected to the first drive electrode of the second switching element,
a second electrode connection via connected to the output electrode, and
a second via connection wire that connects the second element connection via and the second electrode connection via,
the first element connection via and the second element connection via extend through the element encapsulation layer in the height-wise direction,
the first electrode connection via and the second electrode connection via extend through the surface-side resin layer in the height-wise direction, and
the first via connection wire and the second via connection wire are disposed on the element encapsulation layer.
7 . The semiconductor device according to claim 1 , further comprising:
a support layer that supports the first switching element and the second switching element, wherein
the resin layer is formed on the support layer,
the support layer includes a metal layer on which the second switching element is mounted,
the external electrode includes a ground electrode spaced apart from the output electrode in a direction orthogonal to the height-wise direction, the ground electrode being an electrode connected to ground,
the element drive via conductor includes a ground via conductor that electrically connects the second switching element and the ground electrode,
the ground electrode includes an extension extending out from the second switching element toward a side opposite from the output electrode and overlapping the metal layer as viewed in the height-wise direction, and
the semiconductor device further comprises a connection via conductor formed in a portion of the resin layer that overlaps with the extension as viewed in the height-wise direction, the connection via conductor extending through the resin layer in the height-wise direction to connect the extension and the metal layer.
8 . The semiconductor device according to claim 1 , wherein the first switching element and the second switching element are formed from GaN.
9 . The semiconductor device according to claim 1 ,
further comprising a driver configured to control the switching element, wherein
the driver and the switching element are spaced apart from each other in a direction orthogonal to the height-wise direction, and
the semiconductor device further comprises:
an element control via conductor that electrically connects the switching element and the driver, the element control via conductor being embedded in the resin layer.
10 . The semiconductor device according to claim 9 , wherein
the resin layer includes
an element encapsulation layer that encapsulates the switching element, and
a surface-side resin layer formed on the element encapsulation layer,
the switching element includes a control electrode configured to control the switching element,
the element control via conductor includes
a driver control via electrically connected to the driver,
an element control via electrically connected to the control electrode, and
a control connection wire that connects the driver control via and the element control via,
the driver control via extends in the height-wise direction through a portion of the element encapsulation layer that covers the driver in the height-wise direction,
the element control via extends in the height-wise direction through a portion of the element encapsulation layer that covers the switching element in the height-wise direction, and
the control connection wire is disposed on the element encapsulation layer.
11 . The semiconductor device according to claim 10 , wherein
the external electrode includes a driver connection electrode electrically connected to the driver, and
the semiconductor device further comprises:
a driver via conductor provided in the resin layer, wherein the driver via conductor electrically connects the driver connection electrode and the driver.
12 . The semiconductor device according to claim 11 , wherein
the driver connection electrode is disposed not to overlap the driver as viewed in the height-wise direction, and
the driver via conductor is crank-shaped.
13 . The semiconductor device according to claim 12 , wherein
the driver via conductor includes
a driver connection via electrically connected to the driver,
a driver electrode connection via connected to the driver connection electrode, and
a via connection wire that connects the driver connection via and the driver electrode connection via,
the driver connection via extends through the element encapsulation layer in the height-wise direction,
the driver electrode connection via extends through the surface-side resin layer in the height-wise direction, and
the via connection wire is disposed on the element encapsulation layer.