Semiconductor device and method of manufacture
Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.
1 . A semiconductor device comprising:
a first dielectric layer over a semiconductor substrate;
a first metallization layer within the first dielectric layer, the first metallization layer comprising a first line of a power grid surrounding completely on all sides a signal connector in a top down view, wherein the first line extends within a first plane, the first plane being parallel with a major surface of the semiconductor substrate; and
a bond pad metal trace in electrical connection with the signal connector.
2 . The semiconductor device of claim 1 , wherein the first metallization layer comprises a second line parallel with the first line.
3 . The semiconductor device of claim 2 , wherein the first line fully overlaps the second line.
4 . The semiconductor device of claim 2 , wherein the first line has an offset overlap from the second line.
5 . The semiconductor device of claim 1 , wherein the bond pad metal trace has a width of between about 0.36 μm and about 10.8 μm.
6 . The semiconductor device of claim 1 , further comprising a bond pad via in physical contact with both the signal connector and the bond pad metal trace.
7 . The semiconductor device of claim 1 , further comprising a semiconductor die bonded to the bond pad metal trace.
8 . A semiconductor device comprising:
a dielectric layer over a substrate;
a first power line and a signal pad in the dielectric layer, wherein the signal pad is parallel with the substrate and is surrounded completely on all sides in a top down view by the first power line; and
a via and a signal connector in electrical connection with the signal pad.
9 . The semiconductor device of claim 8 , further comprising a semiconductor die bonded to the signal connector.
10 . The semiconductor device of claim 9 , wherein the semiconductor die is bonded using a dielectric-to-dielectric and metal-to-metal bond.
11 . The semiconductor device of claim 10 , wherein the first power line is electrically connected to the semiconductor die.
12 . The semiconductor device of claim 8 , wherein the first power line is located within a top metal layer of a plurality of metallization layers.
13 . The semiconductor device of claim 8 , further comprising a second power line parallel with the first power line.
14 . The semiconductor device of claim 13 , wherein the second power line surrounds completely on all sides in a top down view a second signal pad different from the signal pad.
15 . A semiconductor device comprising:
a first metallization layer over and separated from a first semiconductor substrate, the first metallization layer comprising a power grid with a first line and a signal connector, the first line surrounding the signal connector completely on all sides and having a first width in a first direction, the signal connector having a second width less than the first width in the first direction; and
a bond pad metal trace in electrical connection with the signal connector.
16 . The semiconductor device of claim 15 , wherein the first width is between about 0.36 μm and about 10.8 μm.
17 . The semiconductor device of claim 15 , wherein the second width is between about 0.36 μm and about 10.8 μm.
18 . The semiconductor device of claim 15 , wherein the first line has an overlap length of between about 4.05 μm and about 50 μm.
19 . The semiconductor device of claim 15 , wherein the power grid comprises a second line parallel with the first line, the first line and the second line having coterminous sides.
20 . The semiconductor device of claim 19 , wherein the first line is separated from the second line by a distance of about 0.45 μm.