Semiconductor package with flip chip solder joint capsules
A semiconductor package includes a leadframe forming a plurality of leads with a die attach site, a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints, a set of solder joint capsules covering each of the set of solder joints against the leadframe, a clip mounted to the leadframe over the semiconductor die with a clip solder joint. The solder joint capsules restrict flow of the solder joints of the semiconductor die contacts in the flip chip configuration such that the solder remains in place if remelted during later clip solder reflow.
1 . A semiconductor package comprising:
a sensor coil coupling a first lead to a second lead;
a plurality of leads other than the first and second leads;
a semiconductor die including a set of die contacts electrically connected to respective ones of the plurality of leads other than the first and second leads in a flip chip configuration, the semiconductor die extending over the sensor coil; and
a clip soldered to the first and second leads, the clip extending over only a portion of, and not electrically connected to, the semiconductor die.
2 . The semiconductor package of claim 1 , wherein a solder joint capsule surrounds each electrical connection of one of the set of die contacts to one of the plurality of leads other than the first and second leads.
3 . The semiconductor package of claim 1 , wherein the plurality of leads other than the first and second leads form spaces in a die attach site between solder joints attaching the die contacts and the leads other than the first and second leads.
4 . The semiconductor package of claim 1 , further comprising a dielectric mold compound at least partially covering the first and second leads and the plurality of leads other than the first and second leads and covering, the semiconductor die, and the clip.
5 . The semiconductor package of claim 4 , wherein the first and second leads and the plurality of leads other than the first and second leads are bent in a common direction outside the dielectric mold compound and shaped as cantilevered leads.
6 . The semiconductor package of claim 1 , wherein each of the die contacts includes a metal pillar extending from an opening in a dielectric layer on an active side of the semiconductor die, through a solder joint capsule, and to one of the plurality of leads other than the first and second leads.
7 . The semiconductor package of claim 6 , further comprising a dielectric mold compound covering the set of solder joints of the flip chip configuration, the set of solder joint capsules, and the metal pillars, wherein the dielectric mold compound contacts each of the metal pillars adjacent to the dielectric layer on the active side of the semiconductor die.
8 . A semiconductor package comprising:
a leadframe forming a plurality of leads with a die attach site;
a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of joints formed from solder having a first melting temperature;
a set of solder joint capsules covering each of the set of solder joints; and
a clip mounted to the leadframe over the semiconductor die with a clip solder joint formed from solder having a second melting temperature higher than the first melting temperature.
9 . A semiconductor package comprising:
a leadframe forming a plurality of leads with a die attach site, wherein the plurality of leads includes sensor coil leads and a plurality of die leads, and wherein the leadframe includes a first sensor coil between the sensor coil leads;
a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints;
a set of solder joint capsules covering each of the set of solder joints against the leadframe; and
a clip mounted to the leadframe over the semiconductor die with a clip solder joint, wherein the clip includes a second sensor coil, the second sensor coil forming a parallel conductive path with the first sensor coil via the clip solder joint;
wherein the plurality of die leads are physically and electrically separated from the first sensor coil and the second sensor coil;
wherein the semiconductor die is positioned between the first sensor coil and the second sensor coil with a first gap separating the semiconductor die from the first sensor coil and a second gap separating the semiconductor die from the second sensor coil; and
wherein the semiconductor die includes a sensor operable to detect magnetic fields created by electrical current through the first sensor coil and the second sensor coil, the semiconductor die operable to output a signal representative of the detected magnetic fields via the die leads.
10 . The semiconductor package of claim 9 , wherein the first sensor coil is a first partial turn sensor coil and wherein the second sensor coil is a second partial turn sensor coil.
11 . A semiconductor package comprising:
a sensor coil between sensor coil leads;
a plurality of leads spaced from the sensor coil leads;
a semiconductor die including a set of die contacts mounted to the plurality of leads spaced from the sensor coil leads in a flip chip configuration with each die contact of the set of die contacts electrically connected to one of the plurality of leads spaced from the sensor coil leads via a solder joint, the semiconductor die extending over the sensor coil; and
a clip soldered to at least one of the sensor coil leads, the clip extending over only a portion of, and not electrically connected to, the semiconductor die.
12 . The semiconductor package of claim 11 , further including an individual solder joint capsule completely covering each of the respective solder joints between the die contacts and the plurality of leads spaced from the sensor coil leads.
13 . The semiconductor package of claim 12 , wherein each solder joint capsule is formed from epoxy polymer flux.
14 . The semiconductor package of claim 12 ,
wherein the solder joints between the die contacts and the plurality of leads spaced from the sensor coil leads are formed of solder that reflows at a first temperature, and
wherein a solder joint between the clip solder and at least one of the sensor coil leads is formed of solder that reflows at a second temperature, the second temperature being higher than the first temperature.
15 . The semiconductor package of claim 14 , wherein each solder joint capsule is formed from epoxy polymer flux.
16 . The semiconductor package of claim 14 , wherein the plurality of leads spaced from the sensor coil leads are bent in a common direction outside the dielectric mold compound.
17 . The semiconductor package of claim 12 , further comprising a dielectric mold compound covering the solder joints, the set of solder joint capsules and at least partially covering the sensor coil leads, the plurality of leads spaced from the sensor coil leads and the semiconductor die.
18 . The semiconductor package of claim 12 , wherein each of the die contacts includes a metal pillar extending from an opening of a dielectric layer on an active side of the semiconductor die, through one of the solder joint capsules, and to one of the set of solder joints.
19 . The semiconductor package of claim 18 , further comprising a dielectric mold compound covering the solder joints, the solder joint capsules, and metal pillars, wherein the dielectric mold compound contacts each of the metal pillars adjacent to the dielectric layer on the active side of the semiconductor die.
20 . The semiconductor package of claim 12 ,
wherein the clip includes a second sensor coil, the second sensor coil forming a parallel conductive path with the first-sensor coil;
wherein the semiconductor die is positioned between the sensor coil and the second sensor coil with a first gap separating the semiconductor die from the sensor coil and a second gap separating the semiconductor die from the second sensor coil; and
wherein the semiconductor die includes a sensor operable to detect magnetic fields created by electrical current through the sensor coil and the second sensor coil, the semiconductor die operable to output a signal representative of the detected magnetic fields via the plurality of leads spaced from the sensor coil leads.
21 . The semiconductor package of claim 11 ,
wherein the solder joints between the die contacts and the plurality of leads spaced from the sensor coil leads are formed of solder that reflows at a first temperature, and
wherein a solder joint between the clip solder and at least one of the sensor coil leads is formed of solder that reflows at a second temperature, the second temperature being higher than the first temperature.
22 . The semiconductor package of claim 11 , further comprising a dielectric mold compound covering the solder joints, the semiconductor die and at least partially covering the plurality of leads spaced from the sensor coil leads.