Semiconductor devices and methods of manufacturing semiconductor devices

1 . An electronic device, comprising:

a first substrate comprising a base;

an electronic component over the first substrate and comprising:

a top side and a bottom side;

a first terminal and a second terminal on the top side, and

a third terminal on the bottom side,

wherein the third terminal is coupled with the first substrate;

a second substrate over the electronic component; and

an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate, wherein the encapsulant comprises a unitary body;

wherein:

a first lead extends into an interior portion of the encapsulant and is coupled with the first substrate;

a second lead of the second substrate is coupled to the first terminal of the electronic component;

the first substrate is separate from the first lead;

a connecting lead couples the first lead to the first substrate, wherein a height of the connecting lead is greater than a width of the connecting lead;

the first lead and the second lead are exposed from the encapsulant;

the first lead and the first substrate are coupled to the connecting lead at the interior portion of the encapsulant;

a top side of the unitary body is above a top side of the connecting lead;

the second substrate comprises a trace, the encapsulant contacts a top side of the trace, and the second lead comprises a vertical protrusion extending from a top side of the trace to the top side of the encapsulant; and

a length of the trace is greater than a height of the vertical protrusion.

2 . The electronic device of claim 1 , further comprising a third lead of the second substrate, coupled with the second terminal, and exposed from a top side of the encapsulant.

3 . The electronic device of claim 1 , wherein the encapsulant is in a cavity between the electronic component and the first lead.

4 . The electronic device of claim 3 , wherein the encapsulant contacts a lateral side of the first lead opposite to the cavity, and wherein the first lead extends over the base of the first substrate.

5 . The electronic device of claim 1 , wherein the base comprises a paddle, and the electronic component is over the paddle, and wherein the encapsulant contacts a lateral side of the paddle opposite to the first lead.

6 . The electronic device of claim 1 , wherein the encapsulant contacts a lateral side of the second lead opposite to the trace.

7 . The electronic device of claim 1 , wherein the second substrate comprises an angled portion between the second lead and the trace.

8 . The electronic device of claim 1 , further comprising a first conductive interface between the first terminal and the second substrate, a second conductive interface between the third terminal and the first substrate, a third conductive interface between a bottom side of the first lead and a top side of the connecting lead, and a fourth conductive interface between a bottom side of the connecting lead and a top side of the first substrate.

9 . The electronic device of claim 1 , wherein the first substrate and the second substrate comprise leadframes.

10 . The electronic device of claim 1 , wherein the first lead and the second lead are exposed from a top side of the encapsulant.

11 . The electronic device of claim 1 , wherein a top side of the first lead and a top side of the second lead are flush with the top side of the unitary body.

12 . The electronic device of claim 1 , wherein the base of the first substrate is exposed from a first side of the unitary body, and the first lead or the second lead are exposed from a second side of the unitary body that is different than the first side of the unitary body.

13 . A method to manufacture an electronic device, comprising:

providing a first substrate comprising a base;

providing an electronic component over the first substrate and comprising:

a top side and a bottom side,

a first terminal and a second terminal on the top side, and

a third terminal on the bottom side,

wherein the third terminal is coupled with the first substrate;

providing a second substrate over the electronic component; and

providing an encapsulant over the first substrate, contacting a lateral side of the electronic component, and contacting the second substrate, wherein the encapsulant comprises a unitary body;

wherein:

a first lead extends into an interior portion of the encapsulant and is coupled with and extends over the base of the first substrate;

a second lead of the second substrate is coupled to the first terminal of the electronic component;

the first substrate is separate from the first lead;

a connecting lead couples the first lead to the first substrate, wherein a height of the connecting lead is greater than a width of the connecting lead;

a third lead of the second substrate is coupled to the second terminal of the electronic component;

the first lead, the second lead, and the third lead are exposed from a top side of the encapsulant;

the first lead and the first substrate are coupled to the connecting lead at the interior portion of the encapsulant;

a top side of the unitary body is above a top side of the connecting lead;

the second substrate comprises a trace, the encapsulant contacts a top side of the trace,

the second lead comprises a vertical protrusion extending from a top side of the trace to the top side of the encapsulant; and

a length of the trace is greater than a height of the vertical protrusion.

14 . The method of claim 13 , wherein providing the encapsulant comprises:

providing the encapsulant over the first substrate to cover the first lead, the second lead, the third lead, and the electronic component; and

thinning the encapsulant to expose the first lead, the second lead, and the third lead from a top side of the encapsulant.

15 . The method of claim 13 , wherein:

the second substrate comprises a tie bar that couples the first lead and the second lead; and

further comprising removing the tie bar to isolate the first lead from the second lead.

16 . A module device, comprising:

a first module substrate comprising a first dielectric structure and a first conductive structure, wherein a first lateral side of the first module substrate is exposed;

a second module substrate comprising a second dielectric structure and a second conductive structure, wherein a first lateral side of the second module substrate is exposed;

an electronic device between the first module substrate and the second module substrate and coupled with the first conductive structure and the second conductive structure; and

a module encapsulant between the first module substrate and the second module substrate and contacting a lateral side of the electronic device;

wherein a lateral side of the module encapsulant is flush with the first lateral side of the first module substrate and the first lateral side of the second module substrate, and wherein a top side of the module encapsulant contacts a bottom side of the first module substrate, and a bottom side of the module encapsulant contacts a top side of second module substrate;

wherein the electronic device comprises:

a first device substrate comprising a base;

an electronic component over the first device substrate and comprising:

a top side and a bottom side,

a first terminal and a second terminal on the top side, and

a third terminal on the bottom side,

wherein the third terminal is coupled with the first device substrate;

a second device substrate over the electronic component; and

a device encapsulant over the first device substrate and contacting a lateral side of the electronic component and contacting the second device substrate; and

wherein:

a first lead is coupled with the base and extends over the base of the first device substrate;

a second lead of the second device substrate is coupled to the first terminal of the electronic component;

a connecting lead couples the first lead to the first device substrate, wherein a height of the connecting lead is greater than a width of the connecting lead;

the first lead and the second lead are exposed from a top side of the device encapsulant;

the second device substrate comprises a trace, the device encapsulant contacts a top side of the trace, and the second lead comprises a vertical protrusion extending from a top side of the trace to the top side of the device encapsulant; and

a length of the trace is greater than a height of the vertical protrusion.

17 . The module device of claim 16 , further comprising:

a component coupled with the second module substrate and over the electronic device, wherein the component comprises a heat sink, an electromagnetic interference (EMI) shield, or an antenna.