Integrated package and method for making the same

1 . An integrated package, comprising:

a first substrate comprising:

a first interconnection area having a plurality of first interconnection structures; and

a first alignment structure disposed outside the first interconnection area;

a second substrate stacked above the first substrate and comprising:

a second interconnection area having a plurality of second interconnection structures; and

a second alignment structure disposed outside the second interconnection area, wherein the second alignment structure is substantially aligned with the first alignment structure in a stacking direction of the first substrate and the second substrate; and

a connecting element disposed between the first substrate and the second substrate and configured for electrically connecting at least one of the plurality of first interconnection structures with at least one of the plurality of second interconnection structures,

wherein the first alignment structure and the second alignment structure do not overlap the plurality of first interconnection structures, the plurality of second interconnection structures, and the connecting element in the stacking direction, such that the first alignment structure and the second alignment structure are identifiable in an X-ray image in the stacking direction to determine whether the second substrate is aligned with the first substrate.

2 . The integrated package of claim 1 , wherein the first alignment structure comprises a material the same as a material of the plurality of first interconnection structures, and the second alignment structure comprises a material the same as a material of the plurality of second interconnection structures.

3 . The integrated package of claim 1 , wherein the first alignment structure is disposed at a peripheral area of the first substrate, and the second alignment structure is disposed at a peripheral area of the second substrate.

4 . The integrated package of claim 1 , further comprising:

a first electronic component mounted on a top surface of the first substrate and electrically connected with at least one of the plurality of first interconnection structures;

a first encapsulant disposed between the first substrate and the second substrate and encapsulating the first electronic component and the connecting element; and

a first conductive bump disposed on a bottom surface of the first substrate and electrically connected with at least one of the plurality of first interconnection structures.

5 . The integrated package of claim 4 , wherein the connecting element comprises:

a bottom conductive joint electrically connected with at least one of the plurality of first interconnection structures;

a top conductive joint electrically connected with at least one of the plurality of second interconnection structures; and

a conductive ball disposed between the bottom conductive joint and the top conductive joint.

6 . The integrated package of claim 5 , further comprising:

a third substrate stacked above the second substrate and comprising:

a third interconnection area having a plurality of third interconnection structures; and

a third alignment structure disposed outside the third interconnection area, wherein the third alignment structure is substantially aligned with the second alignment structure in a stacking direction of the second substrate and the third substrate.

7 . The integrated package of claim 6 , further comprising:

a second electronic component mounted on a top surface of the third substrate and electrically connected with at least one of the plurality of third interconnection structures;

a second encapsulant disposed on the third substrate and encapsulating the second electronic component; and

a second conductive bump disposed on a bottom surface of the third substrate and configured for electrically connecting at least one of the plurality of second interconnection structures with at least one of the plurality of third interconnection structures.

8 . The integrated package of claim 1 , further comprising:

a first electronic component mounted on a top surface of the first substrate and electrically connected with at least one of the plurality of first interconnection structures;

a first encapsulant disposed on the top surface of the first substrate and encapsulating at least lateral surfaces of the first electronic component and the connecting element; and

a first conductive bump disposed on a bottom surface of the first substrate and electrically connected with at least one of the plurality of first interconnection structures.

9 . The integrated package of claim 8 , wherein the connecting element comprises a solder ball, and the solder ball protrudes from the top surface of the first substrate further than a top surface of the first encapsulant.

10 . The integrated package of claim 9 , further comprising:

a second electronic component mounted on a top surface of the second substrate and electrically connected with at least one of the plurality of second interconnection structures; and

a second encapsulant disposed on the second substrate and encapsulating the second electronic component.

11 . The integrated package of claim 1 , further comprising:

one or more integrated circuit (IC) chips mounted on a top surface of the second substrate and electrically connected with at least one of the plurality of second interconnection structures.

12 . A method for making an integrated package, comprising:

providing a first substrate, wherein the first substrate comprises a first interconnection area having a plurality of first interconnection structures, and a first alignment structure disposed outside the first interconnection area;

forming a connecting element on the first substrate, wherein the connecting element is electrically connected with at least one of the plurality of first interconnection structures;

providing a second substrate, wherein the second substrate comprises a second interconnection area having a plurality of second interconnection structures, and a second alignment structure disposed outside the second interconnection area;

mounting the second substrate over the first substrate with the connecting element, wherein the connecting element is electrically connected with at least one of the plurality of second interconnection structures; and

inspecting the first alignment structure and the second alignment structure using an X-ray inspection tool to determine whether the second substrate is aligned with the first substrate,

wherein the first alignment structure and the second alignment structure do not overlap the plurality of first interconnection structures, the plurality of second interconnection structures, and the connecting element in a stacking direction of the first substrate and the second substrate, such that the first alignment structure and the second alignment structure are identifiable in an X-ray image of the X-ray inspection tool in the stacking direction.

13 . The method of claim 12 , further comprising:

providing a third substrate, wherein the third substrate comprises a third interconnection area having a plurality of third interconnection structures, and a third alignment structure disposed outside the third interconnection area;

mounting the third substrate over the second substrate with a conductive bump, wherein the conductive bump electrically connects at least one of the plurality of second interconnection structures with at least one of the plurality of third interconnection structures; and

inspecting the second alignment structure and the third alignment structure to determine whether the third substrate is aligned with the second substrate.