Semiconductor device package with open sensor cavity
An example semiconductor device package includes a semiconductor die including an environmental sensor on a device side surface mounted to a package substrate; a barrier comprising a polyimide dry film photoresist material surrounding the environmental sensor on the device side surface of the semiconductor die, the barrier having an interior side facing the environmental sensor and having an opposing exterior side; electrical connections between bond pads on the semiconductor die and leads on the package substrate; and mold compound covering portions of the semiconductor die and contacting the exterior side of the barrier, the mold compound covering the electrical connections and portions of the package substrate, with portions of the leads of the package substrate exposed from the mold compound to form terminals of the semiconductor device package, and the environmental sensor in a sensor cavity formed by the barrier and exposed from the mold compound.
1 . A method, comprising:
depositing a dry film photoresist over a semiconductor wafer having semiconductor dies including environmental sensors on a device side surface;
using the dry film photoresist, patterning barriers surrounding the environmental sensors on the device side surface of the semiconductor dies;
singulating the semiconductor wafer to form individual semiconductor dies having a barrier surrounding the environmental sensors on the device side surface of the individual semiconductor dies;
mounting an individual semiconductor die on a die pad of a package substrate;
forming electrical connections between bond pads on the semiconductor die and conductive leads of the package substrate; and
covering portions of the semiconductor die, the electrical connections, and portions of the package substrate with mold compound in a molding process, the barrier preventing mold compound from covering the environmental sensor on the semiconductor die, the barrier forming a sensor cavity surrounding the environmental sensor.
2 . The method of claim 1 , wherein the environmental sensor is exposed from the mold compound in the sensor cavity.
3 . The method of claim 1 wherein mounting the individual semiconductor die on the package substrate further comprises mounting the individual semiconductor die on the die pad of a conductive lead frame.
4 . The method of claim 3 , wherein forming electrical connections further comprises performing wire bonding using bond wire by performing ball bonding to bond pads on the semiconductor die and by performing stitch bonding to leads on the lead frame.
5 . The method of claim 1 , wherein covering portions of the semiconductor die, the electrical connections, and portions of the package substrate with mold compound further comprises molding with thermoset epoxy resin mold compound.
6 . The method of claim 1 , wherein patterning barriers further comprises patterning barriers having a rectangular or square cross section.
7 . The method of claim 1 , wherein patterning barriers further comprises patterning barriers using a grayscale photomask.
8 . The method of claim 7 , wherein patterning barriers further comprises forming barriers having a staggered exterior side in contact with the mold compound, and having interior sides facing the environmental sensor that are at a normal angle relative to the device side surface of the semiconductor die.
9 . The method of claim 1 , wherein the environmental sensor is a relative humidity sensor, a temperature sensor, a pressure sensor or a photosensor.
10 . A method, comprising:
depositing a dry film photoresist over a device side surface of semiconductor dies on a semiconductor wafer;
patterning the dry film photoresist to form barriers on the device side surface of the semiconductor dies, the barriers having interior sides surrounding environmental sensors on the device side surface of the semiconductor dies;
singulating the semiconductor dies from the semiconductor wafer to from individual semiconductor dies;
mounting the individual semiconductor dies on die pads of a metal lead frame, the metal lead frame having leads spaced from the die pads;
connecting bond pads on the device side surface of the semiconductor dies to the leads using bond wires in a wire bonding tool; and
covering a portion of the device side surface of the semiconductor die, the bond wires, and a portion of the lead frame with mold compound, a portion of the leads exposed from the mold compound and forming terminals for a semiconductor device package, the exterior sides of the barriers contacting the mold compound, the interior sides of the barriers surrounding the environmental sensors on the semiconductor dies.
11 . The method of claim 10 , wherein patterning the dry film photoresist to form barriers further comprises patterning to form the barriers with exterior sides and with interior sides that are at a normal angle relative to the device side surface of the semiconductor dies.
12 . The method of claim 10 , wherein patterning the dry film photoresist to form barriers comprises patterning using a grayscale photomask to form the barriers with staggered exterior sides and having interior sides that are at a normal angle relative to the device side surface of the semiconductor dies.