Chip package having a stiffener and an electronic device having the same
View Patent ↗An electronic device includes a package substrate having a top surface and a bottom surface. An integrated circuit (“IC”) die is disposed on the top surface of the package substrate. The electronic device also includes a stiffener having a ring body and a plurality of support members. The ring body is secured to the top surface of the package substrate and circumscribes the IC die. The plurality of support members extend from the ring body to below the bottom surface of the package substrate.
1 . An electronic device, comprising:
a package substrate having a top surface and a bottom surface;
a plurality of solder balls disposed on the bottom surface of the package substrate;
an integrated circuit (“IC”) die disposed on the top surface of the package substrate; and
a stiffener having a ring body and a plurality of support members, the ring body secured to the top surface of the package substrate and circumscribing the IC die, the plurality of support members extending from the ring body below the plurality of solder balls disposed on the bottom surface of the package substrate.
2 . The electronic device of claim 1 , wherein the ring body comprises a rectangular shape defined by two long peripheral edges and two short peripheral edges.
3 . The electronic device of claim 2 , wherein the plurality of support members are positioned along the two long peripheral edges.
4 . The electronic device of claim 2 , wherein the plurality of support members are positioned at a location that is within 25% of a distance of one of the long or short peripheral edges from a corner of the ring body.
5 . The electronic device of claim 1 , wherein the ring body extends to a peripheral edge of the package substrate.
6 . The electronic device of claim 1 , wherein a lower end of the plurality of support members includes a shoulder portion and an extension portion below the shoulder portion.
7 . The electronic device of claim 6 , wherein a distance from the top surface of the package substrate to the shoulder portion of each of the plurality of support members is the same.
8 . The electronic device of claim 1 , further comprising a printed circuit board (“PCB”) positioned below the package substrate, wherein a lower end of the stiffener is attached to the PCB.
9 . An electronic device, comprising:
a package substrate having a top surface and a bottom surface;
a plurality of solder balls disposed on the bottom surface of the package substrate;
an integrated circuit (“IC”) die disposed on the top surface of the package substrate;
a stiffener disposed on the package substrate and circumscribing the IC die, the stiffener having a plurality of support members extending below the plurality of solder balls disposed on the package substrate; and
a printed circuit board (“PCB”) connected to the package substrate by the plurality of solder balls, wherein the plurality of support members are configured to provide constant spacing between the package substrate and the PCB.
10 . The electronic device of claim 9 , wherein a lower end of the plurality of support members is attached to the PCB.
11 . The electronic device of claim 10 , wherein the lower end of the plurality of support members includes an extension portion disposed below a top surface of the PCB.
12 . The electronic device of claim 11 , wherein the extension portion is disposed in an aperture formed in the PCB.
13 . The electronic device of claim 12 , wherein the lower end of the plurality of support members includes a shoulder portion contacting the top surface of the PCB.
14 . The electronic device of claim 9 , wherein the plurality of support members are soldered to the PCB.
15 . The electronic device of claim 14 , further comprising a plurality of solder joints connecting the package substrate to the PCB.
16 . The electronic device of claim 9 , wherein the stiffener comprises a rectangular shape defined by two long peripheral edges and two short peripheral edges, and wherein the plurality of support members are positioned at a location that is within 25% of a distance of one of the long or short peripheral edges from a corner of the stiffener.
17 . An electronic device, comprising:
a package substrate having a top surface and a bottom surface;
a plurality of solder balls disposed on the bottom surface of the package substrate;
an integrated circuit (“IC”) die disposed on the top surface of the package substrate;
a stiffener disposed on the package substrate and circumscribing the IC die, the stiffener having a plurality of support members extending below the package substrate; and
a printed circuit board (“PCB”) connected to the package substrate by the plurality of solder balls;
a surface mounted receptacle attached to a top surface of the PCB, wherein a lower end of one of the plurality of support members is attached to the surface mounted receptacle.