Electronic devices and method of manufacturing an electronic devices

1 . An electronic device, comprising:

a substrate comprising:

a substrate first side;

a substrate second side opposite to the substrate first side;

a conductive structure; and

a substrate opening extending through the substrate from the substrate first side to the substrate second side;

a pipe coupled to the substrate first side and comprising:

a pipe wall including an exterior surface and an interior surface defining a pipe passage aligned with the substrate opening; and

a pipe top distal to the substrate first side;

a first electronic component coupled to the conductive structure adjacent to the substrate first side; and

an encapsulant covering the substrate first side, the exterior surface of the pipe wall and covering at least a portion of the first electronic component;

wherein:

the pipe is external to and above the substrate opening at the substrate first side;

the pipe passage and the substrate opening are devoid of the encapsulant;

the encapsulant comprises an upper side;

the pipe passage and the substrate opening form a continuous passage from the substrate second side to the upper side of the encapsulant;

the substrate comprises a substrate lateral side connecting the substrate first side to the substrate second side; and

the pipe is laterally inset from the substrate lateral side so that a portion of the substrate first side extends between the exterior surface of the pipe wall and the substrate lateral side.

2 . The electronic device of claim 1 , wherein:

the continuous passage is an enclosed passage; and

the continuous passage is configured for receiving a mechanical fastener.

3 . The electronic device of claim 1 , wherein:

the pipe top and the upper side of the encapsulant are coplanar; and

the pipe top comprises a surface texture different than that of the interior surface of the pipe.

4 . The electronic device of claim 1 , further comprising:

a coating comprising a non-electrically conducting material on the interior surface of the pipe wall;

wherein:

the pipe comprises an electrically conductive material.

5 . The electronic device of claim 1 , wherein:

the first electronic component comprises:

a component first side coupled to the substrate first side;

a component second side opposite to the component first side; and

a lid coupled to the component second side;

the encapsulant comprises an upper side distal to the substrate first side; and

the lid comprises a lid top side that is exposed from the upper side of the encapsulant.

6 . The electronic device of claim 5 , wherein:

the lid comprises a thermally conductive material; and

the lid top side, the pipe top, and the upper side of the encapsulant are coplanar.

7 . The electronic device of claim 1 , further comprising:

a second electronic component coupled to the substrate first and coupled to the conductive structure;

wherein:

the encapsulant covers the second electronic component.

8 . The electronic device of claim 1 , wherein:

the encapsulant contacts the exterior surface of the pipe wall; and

the pipe top is devoid of the encapsulant.

9 . The electronic device of claim 1 , wherein:

the pipe passage comprises a first diameter;

the substrate opening comprises a second diameter; and

the first diameter is larger than the second diameter.

10 . The electronic device of claim 1 , wherein:

the pipe is coupled to the conductive structure.

11 . An electronic device, comprising:

a substrate comprising a first side, a second side opposite the first side, a lateral side connecting the first side to the second side, a conductive structure, and a substrate opening extending through the substrate;

a first electronic component coupled to the conductive structure adjacent to the first side;

a pipe comprising a pipe top and a pipe wall defining a pipe passage positioned over the substrate opening;

an encapsulant covering at least portions of the first side, at least a portion of the first electronic component, and a portion of the pipe and comprising an upper side;

wherein:

the substrate opening is defined by an opening sidewall;

the pipe is external to and above the substrate opening at the first side of the substrate;

the pipe passage and the substrate opening form a continuous passage enclosed by the pipe wall and the opening sidewall;

the continuous passage extends from the second side of the substrate to the upper side of the encapsulant;

the pipe top is exposed from the upper side of the encapsulant;

the pipe passage and the substrate opening are devoid of the encapsulant;

the pipe is laterally inset from the lateral side of the substrate so that a portion of the first side extends between the pipe wall and the lateral side of the substrate; and

the continuous passage is configured for receiving a mechanical fastener.

12 . The electronic device of claim 11 , wherein:

the first electronic component comprises a component first side proximate to the first side of the substrate and a component second side distal to the first side of the substrate; and

the component second side is exposed from the upper side of the encapsulant.

13 . The electronic device of claim 11 , wherein:

the pipe comprises a conductive material; and

the pipe is coupled to the conductive structure.

14 . The electronic device of claim 11 , further comprising:

a second electronic component coupled to the conductive structure adjacent to the first side;

wherein:

the encapsulant covers the second electronic component;

a portion of the first electronic component is exposed from the upper side of the encapsulant; and

the upper side of the encapsulant, the pipe top, and the portion of the first electronic component are coplanar.

15 . The electronic device of claim 11 , wherein:

the pipe and the encapsulant comprise different materials.

16 . The electronic device of claim 11 , wherein:

the pipe comprises an interior surface; and

the pipe top comprises a different surface texture than that of the interior surface.

17 . A method of manufacturing an electronic device, comprising:

providing a substrate comprising:

a substrate first side;

a substrate second side opposite to the substrate first side;

a substrate lateral side connecting the substrate first side to the substrate second side;

a conductive structure; and

a substrate opening defined by an opening sidewall in the substrate and extending through the substrate from the substrate first side to the substrate second side;

providing a pipe comprising a pipe wall including an exterior surface and an interior surface defining a pipe passage;

coupling the pipe at the substrate first side with the pipe passage positioned external to, above, and aligned with the substrate opening;

coupling a first electronic component to the conductive structure adjacent to the substrate first side; and

providing an encapsulant over the substrate first side, the exterior surface of the pipe wall and over at least a portion of the first electronic component and comprising an upper side;

wherein:

the pipe passage is exposed from the upper side of the encapsulant;

the interior surface of the pipe wall and the substrate opening are devoid of the encapsulant;

the pipe passage and the substrate opening form a continuous passage from the substrate second side to the upper side of the encapsulant;

the continuous passage is enclosed by the interior surface of the pipe and the opening sidewall in the substrate;

the pipe is external to and above the substrate opening at the substrate first side;

the pipe is laterally inset from the substrate lateral side so that portion of the substrate first side extends between the exterior surface of the pipe wall and the substrate lateral side; and

the continuous passage is configured for receiving a mechanical fastener.

18 . The method of claim 17 , wherein:

providing the pipe comprises providing a pipe ceiling at an upper portion of the pipe and covering the pipe passage; and

after providing the encapsulant, the method further comprises:

removing an outer portion encapsulant and the pipe ceiling to form the upper side of the encapsulant and to expose the pipe passage, wherein the continuous passage is configured for receiving a mechanical fixing structure.

19 . The method of claim 17 , wherein:

coupling the first electronic component comprises:

providing the first electronic component comprises providing the first electronic component including a component first side, a component second side opposite to the component first side, and a lid coupled to the component second side; and

coupling the component first side to the conductive structure so that the lid is distal to the substrate first side; and

providing the encapsulant comprises exposing the lid from the upper side of the encapsulant.

20 . The method of claim 17 , wherein:

providing the pipe comprises providing the pipe comprising an electrically conductive material and providing a non-electrically conductive coating on the interior surface of the pipe.