Method for manufacturing semiconductor module

1 . A method for manufacturing a semiconductor module comprising:

arranging an insulating wiring board on a lower die;

arranging a sintering material at a plurality of locations on the insulating wiring board and arranging a semiconductor chip on each of the plurality of sintering materials;

arranging a structure above protruding portions of the sintering materials protruding from a periphery of each of the plurality of semiconductor chips; and

sintering by pressurizing and heating the plurality of sintering materials by means of an upper die through the structure at the protruding portions of the sintering materials and through the semiconductor chips at portions of the sintering materials under the semiconductor chips.

2 . The method for manufacturing a semiconductor module according to claim 1 , wherein the structure is in a sheet form including through holes formed to allow insertion of the semiconductor chips at locations corresponding to each of the plurality of semiconductor chips,

peripheral portions of the through holes being located above the protruding portions when the through holes are arranged to correspond to the semiconductor chips.

3 . The method for manufacturing a semiconductor module according to claim 2 , wherein a single buffer material is arranged above the structure, in which with the plurality of sintering materials, the plurality of semiconductor chips, the structure, and the buffer material contained in a space formed in the upper die, the plurality of sintering materials is sintered by being pressurized and heated by the upper die through the buffer material, the plurality of semiconductor chips, and the structure.

4 . The method for manufacturing a semiconductor module according to claim 3 , wherein the buffer material has a heat resistance of 250° C. or higher, a Poisson's ratio of 0.2 or less, and a hardness of 80 points ±5% on a type A durometer according to JIS K 6253.

5 . The method for manufacturing a semiconductor module according to claim 1 , wherein the structure includes an annular shape formed to allow insertion of the semiconductor chips, and is arranged above the protruding portions when a space surrounded by the structure is arranged to correspond to the semiconductor chips.

6 . The method for manufacturing a semiconductor module according to claim 5 , wherein

the structure is arranged individually above each of the plurality of semiconductor chips;

a buffer material is arranged individually above the plurality of structures;

the upper die including a protrusion at locations corresponding to arrangement positions of the plurality of semiconductor chips is arranged above the lower die so that the plurality of protrusions correspond to the plurality of semiconductor chips; and

the plurality of sintering materials is sintered by being pressurized and heated by the protrusions through the plurality of buffer materials, the plurality of semiconductor chips, and the structure.

7 . The method for manufacturing a semiconductor module according to claim 6 , wherein the buffer materials have a heat resistance of 250° C. or higher, a Poisson's ratio of 0.2 or less, a hardness of 80 points ±5% on a type A durometer according to JIS K 6253, and a thickness of 1.5 mm or more.

8 . The method for manufacturing a semiconductor module according to claim 6 , wherein heights of surfaces of the plurality of semiconductor chips facing a side of the buffer materials are different, a spacer member configured to reduce a difference between the heights is arranged on any of the buffer materials.

9 . The method for manufacturing a semiconductor module according to claim 8 , wherein the difference between the heights is 10 μm or more, the spacer member is arranged above any of the plurality of semiconductor chips that is lower in the height.

10 . The method for manufacturing a semiconductor module according to claim 5 , wherein, before arranging the plurality of semiconductor chips on the plurality of sintering materials, a positioning jig including an opening portion at locations corresponding to arrangement positions of the plurality of semiconductor chips is arranged on the insulating wiring board.

11 . The method for manufacturing a semiconductor module according to claim 1 , wherein the sintering materials are in a paste or sheet form.

12 . The method for manufacturing a semiconductor module according to claim 2 , wherein the sintering materials are in a paste or sheet form.

13 . The method for manufacturing a semiconductor module according to claim 3 , wherein the sintering materials are in a paste or sheet form.

14 . The method for manufacturing a semiconductor module according to claim 4 , wherein the sintering materials are in a paste or sheet form.

15 . The method for manufacturing a semiconductor module according to claim 5 , wherein the sintering materials are in a paste or sheet form.

16 . The method for manufacturing a semiconductor module according to claim 6 , wherein the sintering materials are in a paste or sheet form.

17 . The method for manufacturing a semiconductor module according to claim 7 , wherein the sintering materials are in a paste or sheet form.

18 . The method for manufacturing a semiconductor module according to claim 8 , wherein the sintering materials are in a paste or sheet form.

19 . The method for manufacturing a semiconductor module according to claim 9 , wherein the sintering materials are in a paste or sheet form.

20 . The method for manufacturing a semiconductor module according to claim 10 , wherein the sintering materials are in a paste or sheet form.

21 . The method of claim 1 further comprising:

arranging a protection sheet above the protruding portions of the sintering materials protruding from the periphery of each of the plurality of semiconductor chips; and

arranging the structure above the protection sheet.