Package structure and method for forming the same

1 . A method of forming a package structure, comprising:

forming an interposer, comprising:

forming a plurality of through-substrate via (TSV) structures in a substrate;

forming a base material over the substrate;

forming a plurality of conductive features in the base material, wherein the conductive features are electrically connected to the TSV structures;

forming a signal transmission layer in the base material, wherein the signal transmission layer is isolated from the conductive features; and

forming an electric-optical material in the base material, wherein the electric-optical material overlaps the signal transmission layer;

bonding a control unit and a plurality of computing units to the interposer, wherein the computing units are spaced apart from the control unit, and the computing units are connected to the control unit by the signal transmission layer; and

filling an underfill in a gap between the control unit and the computing units.

2 . The method as claimed in claim 1 , further comprising:

bonding a signal source to the interposer, wherein the signal source is adjacent to the computing units and surrounded by the underfill.

3 . The method as claimed in claim 1 , wherein forming the electric-optical material in the interposer further comprises forming the electric-optical material in contact with the signal transmission layer.

4 . The method as claimed in claim 1 , wherein bonding the control unit and the computing units to the interposer further comprises aligning the control unit and the computing units with a region where the signal transmission layer and the electric-optical material are located in the interposer.

5 . The method as claimed in claim 1 , wherein the computing units are arranged on each side of the control unit.

6 . The method as claimed in claim 1 , wherein a width of the electric-optical material is different from a width of the signal transmission layer.

7 . The method as claimed in claim 1 , wherein the electric-optical material comprises aluminum nitride, hexagonal boron nitride, graphene, or a combination thereof.

8 . A method of forming a package structure, comprising:

forming a first signal transmission layer in a base material;

forming a first electric-optical material on the signal transmission layer, wherein the first electric-optical material overlaps the first signal transmission layer in a vertical direction;

forming a second signal transmission layer and a second electric-optical material in a control unit and a plurality of computing units, wherein the second electric-optical material overlaps the second signal transmission layer in the vertical direction; and

bonding the control unit and the computing units over the base material.

9 . The method as claimed in claim 8 , wherein bonding the control unit and the computing units comprises aligning the first signal transmission layer with the second signal transmission layer in the vertical direction.

10 . The method as claimed in claim 8 , wherein the second electric-optical material is formed in contact with the second signal transmission layer, and located between the second signal transmission layer and the first electric-optical material.

11 . The method as claimed in claim 8 , further comprising:

forming a plurality of semiconductor devices in the control unit and the computing units, wherein the semiconductor devices overlap the second signal transmission layer in the vertical direction.

12 . The method as claimed in claim 8 , wherein the second signal transmission layer comprises a ring-shaped portion and a linear portion adjacent to the ring-shaped portion, and the ring-shaped portion overlaps the second electric-optical material in the vertical direction.

13 . The method as claimed in claim 12 , wherein when viewed in the vertical direction, the second electric-optical material extends beyond an edge of the ring-shaped portion.

14 . The method as claimed in claim 13 , wherein when viewed in the vertical direction, the second electric-optical material has a rectangular profile.

15 . A method of forming a package structure, comprising:

forming a first signal transmission layer and a second signal transmission layer in a base material;

forming an electric-optical material in contact with the second signal transmission layer;

bonding a control unit and a computing unit to the interposer, wherein the computing unit is disposed adjacent to the control unit;

bonding a signal source to the interposer, wherein the computing unit is located between the control unit and the signal source, the signal source overlaps the first signal transmission layer and misaligned with the second signal transmission layer in a first direction.

16 . The method as claimed in claim 15 , wherein the second signal transmission layer is located between the first signal transmission layer and the electric-optical material.

17 . The method as claimed in claim 15 , wherein bonding the control unit and the computing unit to the interposer comprises:

covering the second signal transmission layer and the electric-optical material by the control unit and the computing unit.

18 . The method as claimed in claim 15 , wherein a material of the second signal transmission layer is different from the electric-optical material.

19 . The method as claimed in claim 15 , further comprising:

forming an additional electric-optical material in the control unit and the computing unit, wherein the additional electric-optical material overlaps the electric-optical material in the first direction.

20 . The method as claimed in claim 19 , wherein the additional electric-optical material has a rectangular profile in a top view.