Three-dimensional stack package structure with adhesive layers

1 . A three-dimensional stacked package structure, comprising:

a packaging substrate, comprising a substrate body, a through-hole penetrating through the substrate body along a first direction, a first pad disposed on a first surface of the substrate body, and a second pad on a second surface of the substrate body, wherein the first surface and the second surface of the substrate body are oppositely distributed along the first direction, and wherein the first direction is perpendicular to the first surface;

a stacked structure, located on the first surface of the substrate body, wherein the stacked structure comprises a second storage block and a first storage block located above the second storage block; and

connecting leads, comprising a first lead and a second lead having equal lengths, wherein the first lead is located above the package substrate, wherein a first end of the first lead is electrically connected to the first pad, and a second end of the first lead is electrically connected to the first storage block, wherein the second lead passes through the through-hole, and wherein a first end of the second lead is electrically connected to the second pad, and a second end of the second lead is electrically connected to the second storage block,

wherein the first storage block comprises a first storage chip and a second storage chip which is positioned above the first storage chip along a first direction;

wherein the first storage block further comprises a first bonding layer filled in the gap between the first storage chip and the second storage chip, for bonding the first storage chip and the second storage chip;

wherein the stacked structure further comprises a second adhesive layer located between the second storage block and the packaging substrate;

wherein the first stacked structure further comprises a third adhesive layer located between the first storage block and the second storage block, and thermal expansion coefficient of the second adhesive layer is smaller than thermal expansion coefficient of the third adhesive layer.

2 . The three-dimensional stacked package structure according to claim 1 , wherein a thickness of the stacked structure along the first direction is equal to a thickness of the substrate body along the first direction.

3 . The three-dimensional stacked package structure according to claim 1 , wherein the packaging substrate further comprises:

a third pad, located on the second surface of the substrate body; and

a connection column, located in the substrate body, wherein a first end of the connection column is electrically connected to the first pad, and a second end of the connection column is electrically connected to the third pad.

4 . The three-dimensional stacked package structure according to claim 1 ,

wherein a top surface of the first storage chip is bonded to a top surface of the second storage chip; and

wherein a bottom surface of the second storage chip is electrically connected to the first lead.

5 . The three-dimensional stacked package structure according to claim 4 , wherein the top surface of the first storage chip has a first bonding pad, the top surface of the second storage chip has a second bonding pad, wherein the first bonding pad is electrically connected to the second bonding pad;

wherein the second storage chip further comprises a first connecting pad located on the bottom surface of the second storage chip, wherein a first signal plug penetrates through the second storage chip along the first direction, wherein a first end of the first signal plug is electrically connected to the second bonding pad, a second end of the first signal plug is electrically connected to the first bonding pad, and

wherein the first lead is electrically connected to the first bonding pad.

6 . The three-dimensional stacked package structure according to claim 5 , wherein the first storage chip further comprises:

a first conductive solder pad disposed on a surface of the first bonding pad away from the first signal plug, wherein the first conductive solder pad is bonded to the second bonding pad.

7 . The three-dimensional stacked package structure according to claim 1 ,

wherein the second adhesive layer comprises a groove penetrating the second adhesive layer along the first direction, wherein the groove is aligned with the through-hole along the first direction, and wherein the second lead passes through the groove and the through-hole.

8 . The three-dimensional stacked package structure according to claim 7 , wherein the second storage block comprises:

a plurality of second storage chips, wherein the plurality of second storage chips are stacked along the first direction, and adjacent ones of the plurality of second storage chips are electrically connected, and wherein the second lead is electrically connected to a bottommost storage chip of the second storage block.

9 . The three-dimensional stacked package structure according to claim 8 , wherein the second storage block comprises a third storage chip and a fourth storage chip, wherein the fourth storage chip is located above the third storage chip along the first direction, wherein a top surface of the third storage chip is bonded to a top surface of the fourth storage chip; and

wherein a bottom surface of the third storage chip is electrically connected to the second lead.

10 . The three-dimensional stacked package structure according to claim 9 , wherein the top surface of the third storage chip has a third bonding pad, wherein a top surface of the fourth storage chip has a fourth bonding pad, and wherein the third bonding pad is electrically connected to the fourth bonding pad;

wherein the third storage chip further comprises a second bonding pad located on the bottom surface of the third storage chip, and wherein a second signal plug penetrates through the third storage chip along the first direction, wherein a first end of the second signal plug is electrically connected to the third bonding pad, a second end of the second signal plug is electrically connected to the second bonding pad, wherein the second lead is electrically connected to the second bonding pad, and the second bonding pad is aligned to the through-holes along the first direction.

11 . The three-dimensional stacked package structure according to claim 9 , wherein the three-dimensional stacked package further comprises a plastic encapsulation layer, wherein the plastic encapsulation layer covers at least the stacked structure, the first lead and the second lead.

12 . The three-dimensional stacked package structure according to claim 11 , wherein the second storage block further comprises a fourth adhesive layer filled in the gap between the third storage chip and the fourth storage chip.

13 . The three-dimensional stacked package structure according to claim 12 , wherein a volume of filler in the fourth adhesive layer is smaller than a volume of filler in the plastic encapsulation layer.

14 . The three-dimensional stacked package structure according to claim 12 , wherein a filler content in the fourth adhesive layer is lower than a filler content in the plastic encapsulation layer.