Electronic device and electronic device manufacturing method

1 . An electronic device, comprising:

a substrate being rectangular in a plan view of the electronic device, the substrate including

an insulating plate having a front surface and a rear surface opposite to the front surface, and having two long sides in a long-side direction of the substrate,

a first circuit pattern layer provided on the front surface of the insulating plate, and

a metal plate provided on the rear surface of the insulating plate, the first circuit pattern layer having a first terminal region extending in the long-side direction of the substrate; and

a first terminal having a first bonding region bonded to the first terminal region of the first circuit pattern layer via a first bonding material, the first terminal extending in a short-side direction of the substrate outward from one of the two long sides of the insulating plate, the first bonding region extending in the long-side direction of the substrate, wherein

in the plan view, each of the first terminal region and the first bonding region is rectangular, and has a pair of long sides that extend parallel to the long-side direction of the substrate,

a thickness of the first bonding region of the first terminal is less than a thickness of the first terminal region of the first circuit pattern layer, and

in the long-side direction of the substrate, a length of the first bonding region of the first terminal is greater than or equal to half a length of the first terminal region of the first circuit pattern layer.

2 . The electronic device according to claim 1 , wherein the first terminal region of the first circuit pattern layer is disposed adjacent to the one of the two long sides of the insulating plate.

3 . The electronic device according to claim 2 , wherein a total thickness of the first terminal region of the first circuit pattern layer and the first bonding region of the first terminal is greater than a thickness of the metal plate.

4 . The electronic device according to claim 2 , wherein

the substrate further includes a second circuit pattern layer provided on the front surface of the insulating plate,

the second circuit pattern layer has a second terminal region extending in the long-side direction of the substrate, the second terminal region being located adjacent in the long-side direction of the substrate to the first terminal region of the first circuit pattern layer, and

the electronic device further includes a second terminal having a second bonding region bonded to the second terminal region of the second circuit pattern layer via a second bonding material, the second terminal region extending in the long-side direction of the substrate.

5 . The electronic device according to claim 4 , wherein the second terminal region of the second circuit pattern layer is disposed adjacent to the one of the two long sides of the insulating plate.

6 . The electronic device according to claim 5 , wherein one end of the first terminal region of the first circuit pattern layer and one end the second terminal region of the second circuit pattern layer that face each other in the long-side direction of the substrate are located at the same distance from a center line that is parallel to the short-side direction of the substrate and passes through a center of the substrate in the long-side direction of the substrate.

7 . The electronic device according to claim 6 , wherein in the short-side direction of the substrate, a width of the first terminal region of the first circuit pattern layer is approximately equal to a width of the second terminal region of the second circuit pattern layer.

8 . The electronic device according to claim 7 , wherein

the first circuit pattern layer further has two portions respectively extending in the short-side direction of the substrate from the first terminal region toward the other of the two long sides, and

the second circuit pattern layer further has two portions respectively extending in the short-side direction of the substrate from the second terminal region toward the other of the two long sides of the insulating plate in the plan view.

9 . The electronic device according to claim 8 , wherein the first bonding region of the first terminal and the second bonding region of the second terminal each have a flat plate shape.

10 . The electronic device according to claim 9 , wherein the first terminal including the first bonding region has a flat plate shape as a whole.

11 . An electronic device manufacturing method, comprising:

preparing a substrate being rectangular in a plan view of an electronic device and a first terminal having a first bonding region, the substrate including an insulating plate having a front surface and a rear surface opposite to the front surface and having two long sides in a long-side direction of the substrate, a first circuit pattern layer provided on the front surface of the insulating plate, and a metal plate provided on the rear surface of the insulating plate, the first circuit pattern layer having a first terminal region extending in a long-side direction of the substrate; and

bonding the first bonding region of the first terminal to the first terminal region of the first circuit pattern layer via a first bonding material such that the first terminal extends in a short-side direction of the substrate outward from one of the two long sides of the insulating plate, wherein

in the plan view, each of the first terminal region and the first bonding region is rectangular, and has a pair of long sides that extend parallel to the long-side direction of the substrate,

a thickness of the first bonding region of the first terminal is less than a thickness of the first terminal region of the first circuit pattern layer, and

in the long-side direction of the substrate, a length of the first bonding region of the first terminal is greater than or equal to half a length of the first terminal region of the first circuit pattern layer.