IP Library Granted Patent US 12696822
Granted Patent B2
US 12696822 · App. 18/382,585 · Granted Jul 28, 2026

Power conversion device and manufacturing method therefor

Inventors: Toshifumi Nakamura (Tokyo, JP); Akihiro Sawada (Tokyo, JP); Makoto Matsumoto (Tokyo, JP); Kimihiko Tanaya (Tokyo, JP)
Assignee: Mitsubishi Electric Corporation
H10W90/811H02M1/0009H02M1/143H10W70/048H10W70/475
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Quick Facts
Patent No.
US 12696822
App. No.
18/382,585
Granted
Jul 28, 2026
Kind
B2
Abstract

This power conversion device includes cast resin provided at least between an inner wall of a storage portion and a smoothing capacitor and between the inner wall of the storage portion and a resistor, so as to be formed integrally, and heat dissipation and vibration protection for the smoothing capacitor and the resistor can be made by the cast resin. Thus, a dedicated assembly process for a structure for heat dissipation and vibration protection for the resistor is not needed, so that the cost is reduced. In addition, reliability of heat dissipation and vibration protection for the discharge circuit is ensured more easily as compared to a conventional method of pressing only one surface of the resistor to the housing by means such as screw fastening.

Claims (46)

1 . A power conversion device comprising:

a power module including a power device;

a smoothing capacitor for smoothing input voltage to the power module;

a discharge circuit including a resistor for discharging electric charge stored in the smoothing capacitor;

a wiring plate connected to the power module and the smoothing capacitor;

a housing storing the power module, the smoothing capacitor, the discharge circuit, and the wiring plate; and

cast resin included inside the housing, wherein

the housing has a storage portion storing the smoothing capacitor and the resistor, and

the cast resin is provided at least between an inner wall of the storage portion and the smoothing capacitor and between the inner wall of the storage portion and the resistor, so as to be formed integrally.

2 . The power conversion device according to claim 1 , wherein

the storage portion has an opening,

the wiring plate is fixed to the housing so as to cover at least a part of the opening, and

the cast resin is provided with a gap from the wiring plate.

3 . The power conversion device according to claim 2 , wherein

the discharge circuit is provided at the wiring plate.

4 . The power conversion device according to claim 2 , further comprising a circuit board including a driving circuit for driving the power device and a control circuit for controlling the driving circuit, wherein

the circuit board is fixed to the housing so as to cover a part of the opening of the storage portion,

the discharge circuit is provided at the circuit board, and

the cast resin is provided with a gap from the circuit board.

5 . The power conversion device according to claim 2 , wherein

the wiring plate has one or more through holes at locations opposed to the cast resin.

6 . The power conversion device according to claim 1 , wherein

the smoothing capacitor includes a plurality of capacitors.

7 . The power conversion device according to claim 1 , wherein

the storage portion has an opening, and

the cast resin has, between the smoothing capacitor and the resistor, a small-thickness area where a resin thickness in a direction perpendicular to a direction from the smoothing capacitor toward the resistor and a depth direction of the opening is smaller than the resin thickness in another area.

8 . The power conversion device according to claim 7 , wherein

the storage portion has, between the smoothing capacitor and the resistor, a partition wall extending toward the opening from a bottom located in the depth direction of the storage portion,

a groove extending in a direction from the smoothing capacitor toward the resistor is provided at an opening-side end of the partition wall, and

the small-thickness area is provided at the groove.

9 . The power conversion device according to claim 1 , wherein

the storage portion has an opening, and

the cast resin has, between the smoothing capacitor and the resistor, a small-thickness area where a resin thickness in a depth direction of the opening is smaller than the resin thickness in another area.

10 . The power conversion device according to claim 9 , wherein

the storage portion has, between the smoothing capacitor and the resistor, a partition wall extending toward the opening from a bottom located in the depth direction of the storage portion, and

the small-thickness area is provided on the opening side of the partition wall.

11 . The power conversion device according to claim 9 , wherein

the resin thickness in the small-thickness area is smaller than a maximum thickness of the smoothing capacitor.

12 . The power conversion device according to claim 1 , wherein

the cast resin has a thermal conductivity not less than 0.2 W/m·K.

13 . The power conversion device according to claim 1 , wherein

the wiring plate is a printed board.

14 . A manufacturing method for a power conversion device, comprising the steps of:

preparing a power module including a power device, a smoothing capacitor, a discharge circuit including a resistor, a wiring plate connected to the power module and the smoothing capacitor, a housing having a storage portion, and cast resin that has not been cured;

fixing the wiring plate to the housing so as to cover an opening of the storage portion in a state in which the smoothing capacitor and the resistor are placed inside the storage portion; and

injecting the cast resin into the storage portion from one or more through holes provided in the wiring plate fixed to the housing, so that the cast resin is provided at least between an inner wall of the storage portion and the smoothing capacitor and between the inner wall of the storage portion and the resistor, so as to be formed integrally.