IP Library Granted Patent US 12,697,664
Granted Patent B2
US 12,697,664 · App. 18/701,622 · Granted Aug 4, 2026

Analysis device, analysis method, machining system, and program

Inventor: Akihiro Toyoshima (Osaka, JP)
Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
B23B49/00G06T11/26
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Quick Facts
Patent No.
US 12,697,664
App. No.
18/701,622
Granted
Aug 4, 2026
Kind
B2
Abstract

An analysis device according to the present disclosure analyzes the state of a machining tool. The analysis device includes: an acquisition unit that acquires a measurement result from at least one sensor fitted to the machining tool; a computation unit that performs data processing to the measurement result acquired by the acquisition unit; and an image processing unit that displays a first image and a second image on a display screen, the first image displaying the measurement result acquired by the acquisition unit in time-series, the second image displaying a computation result after the data processing is performed by the computation unit. The image processing unit displays, as the second image, the computation result corresponding to the measurement result for a specific time period in the first image.

Claims (54)

1 . An analysis device that analyzes a state of a machining tool, the analysis device comprising:

a first interface configured to acquire a measurement result from at least one sensor fitted to the machining tool; and

processing circuitry configured to

perform data processing to the measurement result acquired by the first interface;

display a first image and a second image on a display screen, the first image displaying the measurement result acquired by the first interface in time-series, the second image displaying a computation result after the data processing is performed; and

display, as the second image, the computation result corresponding to the measurement result for a specific time period in the first image.

2 . The analysis device according to claim 1 , wherein the processing circuitry is configured to display the first image and the second image on an identical display screen.

3 . The analysis device according to claim 1 , further comprising a second interface configured to accept a user's operation, wherein

when the second interface accepts the specific time period altered by the user's operation, the processing circuitry is configured to display, as the second image, the computation result corresponding to the measurement result for the altered specific time period.

4 . The analysis device according to claim 3 , wherein the second interface is configured to accept, as the specific time period, a time point and a time period that are specified on the first image by the user's operation.

5 . The analysis device according to claim 1 , wherein

the measurement result acquired by the first interface includes tool information about the machining tool, and

the processing circuitry is configured to alter kinds of the measurement result and the computation result that are displayed on the display screen based on the tool information acquired by the first interface.

6 . The analysis device according to claim 1 , wherein, when the first interface acquires the measurement result from a plurality of sensors, the processing circuitry is configured to:

perform data processing of associating a plurality of measurement results acquired by the first interface, and

display computation results associated with the plurality of measurement results in the second image.

7 . The analysis device according to claim 6 , wherein the processing circuitry is configured to display the computation results associated with the plurality of measurement results, in the second image, while showing the computation results in a spatial coordinate system.

8 . The analysis device according to claim 1 , further comprising a storage that stores the measurement result, wherein

when the measurement result is stored in the storage, information about a machining condition is added and is stored as one file, and

when the first interface acquires a plurality of files from the storage by selecting the machining condition, the processing circuitry is configured to array and display the first image and the second image on the display screen for each machining condition.

9 . A machining system comprising:

a machine tool that performs machining using a machining tool that includes at least one sensor; and

an analysis device that analyzes a state of the machining tool that is used in the machine tool,

the analysis device comprising:

an interface configured to acquire a measurement result from the sensor; and

processing circuitry configured to:

perform data processing to the measurement result acquired by the interface;

display a first image and a second image on a display screen, the first image displaying the measurement result acquired by the interface in time-series, the second image displaying a computation result after the data processing is performed; and

display, as the second image, the computation result corresponding to the measurement result for a specific time period in the first image.

10 . An analysis method for analyzing a state of a machining tool, the analysis method comprising:

acquiring a measurement result from at least one sensor fitted to the machining tool;

performing data processing to the acquired measurement result;

displaying, as a first image, the acquired measurement result in time-series; and

displaying, as a second image, a computation result after the data processing is performed to the measurement result for a specific time period specified in the first image.

11 . The analysis method according to claim 10 , further comprising displaying the first image and the second image on an identical display screen.

12 . The analysis method according to claim 10 , further comprising:

accepting a user's operation; and

when the specific time period is altered by the user's operation, displaying, as the second image, the computation result corresponding to the measurement result for the altered specific time period.

13 . The analysis method according to claim 12 , further comprising accepting, as the specific time period, a time point and a time period that are specified on the first image by the user's operation.

14 . The analysis method according to claim 10 , wherein

the acquired measurement result includes tool information about the machining tool, and

the method further includes altering kinds of the measurement result and the computation result that are displayed based on the tool information.

15 . The analysis method according to claim 10 , further comprising, when acquiring the measurement result from a plurality of sensors:

performing data processing of associating a plurality of measurement results, and

displaying computation results associated with the plurality of measurement results in the second image.

16 . The analysis method according to claim 15 , further comprising displaying the computation results associated with the plurality of measurement results, in the second image, while showing the computation results in a spatial coordinate system.

17 . The analysis method according to claim 10 , further comprising:

when the measurement result is stored in a storage, adding and storing information about a machining condition as one file, and

when a plurality of files is acquired from the storage by selecting the machining condition, arraying and displaying the first image and the second image on a display screen for each machining condition.

18 . A non-transitory computer readable medium storing a program which when executed by an analysis device that analyzes a state of a machining tool causes the analysis device to perform a method, the method comprising:

acquiring a measurement result from at least one sensor fitted to the machining tool;

performing data processing to the acquired measurement result;

displaying, as a first image, the acquired measurement result in time-series; and

displaying, as a second image, a computation result after the data processing is performed to the measurement result for a specific time period specified in the first image.