Laser machining system

1 . A laser machining system comprising:

processing circuitry

to control a laser oscillator and a driver and execute machining to cut a workpiece into a first part, a second part, and a remaining material, the laser oscillator being configured to emit a laser beam, the driver being configured to move, along a machining path, an irradiation point at which the workpiece is irradiated with the laser beam;

to determine a time-series signal that is a result of observing a state of the workpiece, on which the machining to cut the workpiece into the first part, the second part, and the remaining material along the machining path is executed, in a time series;

to determine evaluation information, that is a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path on which the machining to cut the workpiece into the first part, the second part, and the remaining material along the machining path is executed, using the time-series signal;

to store contour line evaluation information in which a contour line is associated with the evaluation information for each section of the machining path, the contour line being a boundary between a respective one of the first part and the second part and the remaining material;

to determine a sorting control command based on the contour line evaluation information, the sorting control command being a command for controlling a sorting operation; and

after the machining to cut the workpiece into the first part, the second part, and the remaining material along the machining path is executed, to perform the sorting operation according to the sorting control command including that:

when the contour line evaluation information corresponding to the first part is poor and the contour line evaluation information corresponding to the second part is good, the first part is taken out from a first position where the workpiece is machined and moved to a target position for defective parts and then the second part is taken out from a second position where the workpiece is machined and moved to a target position for non-defective parts, and

the sorting operation for one of the first part and the second part is skipped when the contour line evaluation information for an outer contour line of the one of the first part and the second part indicates that the outer contour line of the one of the first part and the second part is judged to be poor,

wherein, when the first part has the outer contour line, which is a contour of an outer periphery of the first part, and an inner contour line, which is a contour of an inner periphery of the first part, the processing circuitry

determines the evaluation information for each of the outer contour line and the inner contour line, and

determines the sorting control command such that:

(i) when both the state of the machining for the outer contour line and the state of the machining for the inner contour line are judged to be good, the sorting operation is performed in such a manner that the first part is taken out from the first position where the workpiece is machined and moved to the target position for non-defective parts, and

(ii) when the state of the machining for the outer contour line is judged to be good and the state of the machining for the inner contour line is judged to be poor, the sorting operation is performed in such a manner that the first part is taken out from the first position where the workpiece is machined and moved to the target position for defective parts.

2 . The laser machining system according to claim 1 , wherein

the processing circuitry associates the contour line with the evaluation information using position information that is information designating a position on the machining path, and

the position information includes position data and an identifier, the position data being data including a plurality of elements and in which the plurality of elements are associated with a plurality of positions on the machining path on a one-to-one basis, the identifier being information designating one or more of the plurality of elements.

3 . The laser machining system according to claim 2 , wherein

the laser oscillator emits the laser beam based on an oscillator command, and

the processing circuitry moves the irradiation point along the machining path based on a drive command, and determines the oscillator command and the drive command such that the position information is associated with the oscillator command and/or the drive command.

4 . The laser machining system according to claim 3 , wherein

the processing circuitry further generates a machining program and a sorting program,

the processing circuitry determines the oscillator command and the drive command based on the machining program,

the processing circuitry determines the sorting control command based on the sorting program, and

the processing circuitry uses the machining program as the position data.

5 . The laser machining system according to claim 1 , wherein

when the first part has the outer contour line,

the processing circuitry stores the contour line evaluation information in which each of the outer contour line and the inner contour line is associated with the evaluation information.

6 . The laser machining system according to claim 1 , wherein the processing circuitry determines, based on the contour line evaluation information, whether to execute the sorting operation for each part.

7 . The laser machining system according to claim 1 , wherein the processing circuitry judges that the state of the machining for the contour line is good when the remaining material and the respective one of the first part and the second part are separable at the contour line, judges that the state of the machining for the contour line is poor when the remaining material and the respective one of the first part and the second part are inseparable at the contour line, and determines the evaluation information including a result of the judgment.

8 . The laser machining system according to claim 1 , wherein the processing circuitry determines the evaluation information including information indicating an evaluation of the state of the machining in terms of at least one machining defect item among burning, gouging, dross, flaws, upper surface roughness, middle surface roughness, lower surface roughness, oxide film peeling, and fading.

9 . The laser machining system according to claim 1 , wherein the processing circuitry includes at least one of an acoustic sensor, an optical sensor, a camera, a vibration sensor, an acceleration sensor, or a gyro sensor.

10 . The laser machining system according to claim 1 , comprising a display to display information on the sorting operation or information on the machining.

11 . The laser machining system according to claim 1 , wherein the processing circuitry further:

stores a machining signal in which the time-series signal and/or a feature extracted from the time-series signal is associated with the contour line;

determines a sorting judgment result that is a result of determining whether the sorting operation succeeds or fails;

stores a contour line judgment result in which the sorting judgment result is associated with the contour line;

observes state values including the machining signal and the contour line judgment result and related to the machining or the sorting operation;

executes learning for determining the contour line judgment result from the machining signal based on the state values; and

determines the evaluation information from the machining signal based on a result learned.

12 . The laser machining system according to claim 1 , wherein

the processing circuitry further:

stores a machining signal in which the time-series signal and/or a feature extracted from the time-series signal is associated with the contour line; and

observes, as machining state values, values including the machining signal and related to the machining or the sorting operation; and

the processing circuitry further includes a learned learning machine that has performed learning for determining the evaluation information from the machining signal based on values including a sorting judgment result and the machining signal and related to the machining or the sorting operation, the sorting judgment result being a result of determining whether the sorting operation has succeeded or failed.

13 . The laser machining system according to claim 1 , further comprising:

a hand; and

a hand driver, wherein

the processing circuitry determines a hand command based upon the sorting control command, and

the hand driver drives the hand to grip and move the first part and the second part based upon the hand command.

14 . The laser machining system according to claim 1 , wherein

the target position for defective parts includes a position for parts whose defects cannot be alleviated through post-processing, and

the target position for non-defective parts includes a position for parts whose defects can be alleviated through post-processing.