IP Library Granted Patent US 12697763
Granted Patent B2
US 12697763 · App. 18/846,133 · Granted Aug 4, 2026

Three-dimensional network structure and manufacturing method therefor

Inventors: Fumika Kawano (Otsu, JP); Teruyuki Taninaka (Otsu, JP); Daisuke Sakura (Otsu, JP); Shinichi Kobuchi (Osaka, JP)
Assignee: TOYOBO MC CORPORATION
B29C48/05B29C64/118D04H3/011D04H3/03B29K2067/006B29K2995/0012B29K2995/006B29L2031/751B33Y10/00B33Y40/20B33Y80/00
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Quick Facts
Patent No.
US 12697763
App. No.
18/846,133
Granted
Aug 4, 2026
Kind
B2
Abstract

It is provided that: a three-dimensional network structure that exhibits excellent cushioning property and excellent compression recoverability after thermal compression at a usage environmental temperature; and a manufacturing method therefor. A three-dimensional network structure having a three-dimensional random loop-bonded configuration and comprising a continuous filament made from a thermoplastic resin composition, wherein the thermoplastic resin composition contains 70% by mass or higher of a polybutylene adipate terephthalate resin, and an enthalpy of an endothermic peak in which a DSC curve regarding the continuous filament measured by using a differential scanning calorimeter has a minimum value in a range from 30° C. to 70° C. of 2.5 J/g or lower.

Claims (17)

1 . A three-dimensional network structure having a three-dimensional random loop-bonded configuration and comprising a continuous filament made from a thermoplastic resin composition, wherein

the thermoplastic resin composition contains 70% by mass or higher of a polybutylene adipate terephthalate resin, and

an enthalpy of an endothermic peak in which a differential scanning calorimetry curve regarding the continuous filament measured by using a differential scanning calorimeter has a minimum value in a range from 30° C. to 70° C. of 2.5 J/g or lower.

2 . The three-dimensional network structure according to claim 1 , wherein the polybutylene adipate terephthalate resin contains an adipic acid unit and a terephthalic acid unit, and a molar ratio of the terephthalic acid unit to the adipic acid unit is 1.0 or higher and 3.0 or lower.

3 . The three-dimensional network structure according to claim 2 , wherein the three-dimensional network structure has a 40° C. compressive residual strain of 25% or lower.

4 . The three-dimensional network structure according to claim 2 , wherein the three-dimensional network structure has a 40° C. compressive residual strain of 15% or lower and a 70° C. compressive residual strain of 30% or lower.

5 . The three-dimensional network structure according to claim 1 , wherein the polybutylene adipate terephthalate resin has a melting point of 120° C. or higher and 180° C. or lower.

6 . The three-dimensional network structure according to claim 1 , wherein the three-dimensional network structure has a 40° C. compressive residual strain of 25% or lower.

7 . The three-dimensional network structure according to claim 1 , wherein the three-dimensional network structure has a 40° C. compressive residual strain of 15% or lower and a 70° C. compressive residual strain of 30% or lower.

8 . A method for manufacturing the three-dimensional network structure according to claim 1 , the method comprising:

an extrusion step of extruding, from a nozzle, the thermoplastic resin composition in a melted condition to form the continuous filament;

a molding step of molding the continuous filament extruded from the nozzle, into a three-dimensional network configuration so as to obtain a molded body; and

a heat treatment step of heat treating the molded body, wherein

the heat treatment step includes two stages,

a first stage of the heat treatment step includes heat treating the continuous filament at a temperature not higher than a melting point of the continuous filament, and

a second stage of the heat treatment step includes heat treating the continuous filament at a temperature lower than the temperature of the heat treating in the first stage of the heat treatment step.

9 . The method for manufacturing the three-dimensional network structure, according to claim 8 , wherein the thermoplastic resin composition contains a polybutylene adipate terephthalate resin having a melting point of 120° C. or higher and 180° C. or lower.