Power module and inverter module design to minimize parasitic inductance and optimize thermal performance

1 . A leg of a power converter, the leg comprising:

a first one of (a) a first power module and (b) a first die, the first one including a high side switch having a first terminal configured to be connected to a first direct current (DC) busbar having a first potential;

a second one of (a) a second power module and (b) a second die, the second one including a low side switch having a first terminal configured to be connected to a second DC busbar having a second potential that is different than the first potential;

an alternating current (AC) busbar disposed vertically (a) between the first one and the second one and (b) between the first DC busbar and the second DC busbar; and

a capacitor disposed vertically between the first and second DC busbars;

wherein the capacitor is disposed one of:

vertically above the first one; and

vertically below the second one.

2 . The leg of claim 1 wherein the AC busbar is:

disposed between a first vertically lower surface of the first one and a second vertically upper side of the second one; and

electrically connected to second terminals of the high side and low side switches.

3 . The leg of claim 2 wherein the AC busbar is configured to be electrically connected to a phase of an electric motor.

4 . The leg of claim 2 further comprising electrically insulative material disposed between:

the first vertically lower surface of the first one and the AC busbar; and

the second vertically upper surface of the second one and the AC busbar.

5 . The leg of claim 1 further comprising:

a first heat sink that is configured to draw heat away from the first one; and

a second heat sink configured to draw heat away from the second one.

6 . The leg of claim 5 wherein:

the first heat sink is disposed on a first vertically upper surface of the first one; and

the second heat sink is disposed on a second vertically lower surface of the second one.

7 . The leg of claim 5 wherein:

the first heat sink is disposed on a first vertically lower surface of the first one; and

the second heat sink is disposed on a second vertically upper surface of the second one.

8 . The leg of claim 5 further comprising:

a first heat sink disposed on a first vertically upper surface of the first one;

a second heat sink disposed on a first vertically lower surface of the first one;

a third heat sink disposed on a second vertically upper surface of the second one; and

a fourth heat sink disposed on a second vertically lower surface of the second one.

9 . The leg of claim 5 wherein the AC busbar includes:

a first electrically conductive portion that is disposed vertically above a first vertically upper surface of the first one;

a second electrically conductive portion that is disposed vertically below a second vertically lower surface of the second one; and

a third electrically conductive portion that is electrically connected to the first and second electrically conductive portions.

10 . The leg of claim 9 wherein the AC busbar is configured to be electrically connected to a phase of an electric motor.

11 . The leg of claim 9 further comprising electrically insulative material disposed between:

the first vertically upper surface of the first one and the first electrically conductive portion; and

the second vertically lower surface of the second one and the second electrically conductive portion.

12 . The leg of claim 1 wherein the capacitor is disposed at least partially horizontally beside the first and second ones.

13 . The leg of claim 1 wherein the AC busbar extends horizontally through an aperture through the capacitor.

14 . A system comprising:

a housing;

the leg of claim 1 , wherein the leg is disposed within the housing; and

coolant within the housing.

15 . The leg of claim 1 wherein the first and second DC busbars each include first and second copper layers directly bonded to a ceramic layer.

16 . The leg of claim 15 further comprising:

a first metal layer configured to electrically connect the first terminal of the high side switch to the first DC busbar;

a second metal layer configured to electrically connect a second terminal of the high side switch to an output busbar;

a third metal layer configured to electrically connect the first terminal of the low side switch to the second DC busbar; and

a fourth metal layer configured to electrically connect a second terminal of the low side switch to the AC busbar.

17 . The leg of claim 16 further comprising a spacer disposed vertically one of:

between the first DC busbar and the AC busbar; and

between the second DC busbar and the AC busbar.

18 . The leg of claim 17 wherein the spacer includes an internal coolant channel configured to receive a coolant.

19 . A leg of a power converter, the leg comprising:

a first one of (a) a first power module and (b) a first die, the first one including a high side switch having a first terminal configured to be connected to a first direct current (DC) busbar having a first potential;

a second one of (a) a second power module and (b) a second die, the second one including a low side switch having a first terminal configured to be connected to a second DC busbar having a second potential that is different than the first potential;

an alternating current (AC) busbar disposed vertically (a) between the first one and the second one and (b) between the first DC busbar and the second DC busbar;

a first heat sink that is configured to draw heat away from the first one; and

a second heat sink configured to draw heat away from the second one,

wherein the AC busbar includes:

a first electrically conductive portion that is disposed vertically above a first vertically upper surface of the first one;

a second electrically conductive portion that is disposed vertically below a second vertically lower surface of the second one; and

a third electrically conductive portion that is electrically connected to the first and second electrically conductive portions.

20 . The leg of claim 19 wherein the first and second DC busbars each include first and second copper layers directly bonded to a ceramic layer.