Shape thin substrates by curing shrinkable materials deposited with localized variations
Methods of curing a deformation in a substrate are provided. In some embodiments, the method includes identifying one or more areas on the substrate with deformation. The method further includes printing a first film on a first area of a surface of the substrate via inkjet printing, the first film being a material that polymerizes and contracts when cured. The method includes printing a second film on a second area of the surface of the substrate via inkjet printing, the second film being a material that polymerizes and contracts when cured. The method further includes curing the first film and the second film to induce a bend in the substrate. In some embodiments, the method includes inkjet printing a third film and a fourth film on the surface of the substrate.
1 . A method of curing a deformation in an optical device substrate, comprising:
printing a first film on a first area of an optical device of the optical device substrate via inkjet printing, the optical device substrate having a diameter, the first film being a material that polymerizes and contracts when cured;
printing a second film on a second area of the optical device of the optical device substrate via inkjet printing, the second film being a material that polymerizes and contracts when cured; and
curing the first film and the second film to induce a bend in the optical device substrate.
2 . The method of claim 1 , wherein the first film and the second film have different chemical compositions.
3 . The method of claim 1 , wherein the first film and the second film comprise acrylates.
4 . The method of claim 1 , wherein the first film is printed in localized areas of the optical device, and the second film is printed on remaining areas of the optical device.
5 . The method of claim 1 , wherein the curing is an ultraviolet cure.
6 . The method of claim 1 , wherein the curing is a thermal cure.
7 . The method of claim 1 , wherein the first film induces a greater bend in the optical device substrate than the second film after the curing.
8 . The method of claim 1 , wherein the first area and the second area are alternating, parallel columns.
9 . The method of claim 1 , wherein the first film and the second film comprise monomers, crosslinkers, or photoinitiators.
10 . The method of claim 1 , wherein the first film has a larger modulus than the second film after the curing.
11 . The method of claim 1 , further comprising identifying one or more areas on the optical device substrate with deformation.
12 . A method of curing a deformation in an optical device substrate, comprising:
measuring the optical device substrate for deformation;
printing a first film on a first area of an optical device of the optical device substrate via inkjet printing, the first film being a material that polymerizes and contracts when cured;
printing a second film on a second area of the optical device of the optical device substrate via inkjet printing, the second film being a material that polymerizes and contracts when cured; and
curing the first film and the second film to induce a bend in the optical device substrate.
13 . The method of claim 12 , wherein the first film and the second film have different chemical compositions.
14 . A method of curing a deformation in an optical device substrate, comprising:
identifying one or more areas on an optical device of the optical device substrate with deformation;
printing a first film over a first area of the optical device of the optical device substrate via inkjet printing, the first film being a material that polymerizes and contracts when cured;
printing a second film over a second area of the optical device of the optical device substrate via inkjet printing, the second film being a material that polymerizes and contracts when cured;
printing a third film over a third area of the optical device of the optical device substrate via inkjet printing, the third film being a material that polymerizes and contracts when cured;
printing a fourth film over a fourth area of the optical device of the optical device substrate via inkjet printing, the fourth film being a material that polymerizes and contracts when cured; and
curing of the first film, the second film, the third film, and the fourth film to induce a bend in the optical device substrate.
15 . The method of claim 14 , wherein the first film and the second film have different chemical compositions; and the third film and the fourth film have different chemical compositions.
16 . The method of claim 14 , wherein the first film, the second film, the third film, and the fourth film have different chemical compositions.
17 . The method of claim 14 , further comprising a first curing of the first film and the second film to induce a bend in the optical device substrate prior to the printing the third film and the printing the fourth film.
18 . The method of claim 14 , wherein the third area is adjacent the first area, and the fourth area is adjacent the second area.
19 . The method of claim 14 , wherein the first film and the second film are printed on a first surface of the optical device substrate, and the third film and the fourth film are printed on a second surface of the optical device substrate.
20 . The method of claim 14 , wherein the first film, the second film, the third film, and the fourth film are printed on a first surface of the optical device substrate.
21 . The method of claim 1 , wherein the diameter of the optical device substrate is from about 100 mm to about 750 mm.
22 . The method of claim 1 , wherein the optical device of the optical device substrate is a waveguide combiner.
23 . The method of claim 1 , wherein the optical device of the optical device substrate is a micro-lens array.
24 . The method of claim 1 , wherein the optical device of the optical device substrate is a flat optical device.
25 . The method of claim 1 , wherein the optical device substrate comprises silicon (Si), silicon nitride (SiN), silicon dioxide (SiO 2 ), fused silica, quartz, silicon carbide (SiC), germanium (Ge), silicon germanium (SiGe), indium phosphide (InP), gallium arsenide (GaAs), gallium oxide (GaO), diamond, lithium niobate (LiNbO 3 ), gallium nitride (GaN), sapphire, tantalum oxide (Ta 2 O 5 ), titanium dioxide (TiO 2 ), or combinations thereof.