Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method
A method for producing an electronic device includes a first step of pasting a support to an organic substrate having a thickness of 1000 μm or less, with a temporary fixing material interposed therebetween, to obtain a laminated body; a second step of heating the temporary fixing material of the laminated body; a third step of mounting a semiconductor chip on the organic substrate of the laminated body that has been subjected to the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material; and a fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminated body that has been subjected to the fourth step.
1 . A method for producing an electronic device, the method comprising:
forming a laminated body including a temporary fixing material located between a support and an organic substrate having a thickness of 1000 μm or less;
heating the temporary fixing material of the laminated body;
mounting a semiconductor chip on the organic substrate of the laminated body after heating the temporary fixing material;
sealing the semiconductor chip mounted on the organic substrate with a sealing material; and
peeling the support and the temporary fixing material from the organic substrate of the laminated body after sealing the semiconductor chip,
wherein the temporary fixing material comprises a thermoplastic resin, a thermosetting resin, a filler, and a curing accelerator, and either contains no silicone-based release agent or has a content of a silicone-based release agent of 10% by mass or less based on a total amount of the temporary fixing material,
the filler is an inorganic and/or organic filler, and a content of the filler in the temporary fixing material is 5-300 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
the thermoplastic resin consists of a (meth)acrylic copolymer having a crosslinkable epoxy group, a Tg of −50° C. to 50° C., and a weight average molecular weight of 100000 to 400000,
the thermosetting resin consists of an epoxy resin,
the temporary fixing material further comprises an epoxy resin curing agent that cures the epoxy resin, the epoxy resin curing agent consisting of a phenol resin,
the combined content of the thermoplastic resin, the thermosetting resin, the filler, the curing accelerator, and the epoxy resin curing agent is 90% by mass or more based on the total amount of the temporary fixing material,
the content of the thermosetting resin in the temporary fixing material is 10 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
the curing accelerator consists of an imidazole,
the content of the curing accelerator in the temporary fixing material is 0.01 to 5.0 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermosetting resin, and
wherein the temporary fixing material has a shear viscosity of 100 to 10000 Pa·s at 60° C., an elastic modulus of 10 to 1000 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 1 hour at 170° C., and a 5% weight reduction temperature of 300° C. or higher after being heated for 30 minutes at 130° C. and for 1 hour at 170° C.
2 . The method according to claim 1 , wherein the organic substrate is a coreless substrate.
3 . The method according to claim 1 , wherein the support is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.
4 . The method according to claim 1 , wherein the support is attached to the organic substrate in a tape form when the laminated body is formed.
5 . The method according to claim 1 , wherein the laminated body is formed using a support tape, the support tape comprising a support film as the support and a temporary fixing material layer provided on the support film and formed from the temporary fixing material.
6 . A resin composition for temporarily fixing a support for substrate conveyance to an organic substrate, the resin composition comprising a thermoplastic resin, a thermosetting resin, a filler, a curing accelerator, and either containing no silicone-based release agent or having a content of a silicone-based release agent of 10% by mass or less based on a total amount of the resin composition,
wherein the filler is an inorganic and/or organic filler, and a content of the filler in the resin composition is 5-300 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
the thermoplastic resin consists of a (meth)acrylic copolymer having a crosslinkable epoxy group, a Tg of −50° C. to 50° C., and a weight average molecular weight of 100000 to 400000,
the thermosetting resin consists of an epoxy resin,
the resin composition for temporary fixing further comprises an epoxy resin curing agent that cures the epoxy resin, the epoxy resin curing agent consisting of a phenol resin,
the combined content of the thermoplastic resin, the thermosetting resin, the filler, the curing accelerator, and the epoxy resin curing agent is 90% by mass or more based on the total amount of the resin composition,
the content of the thermosetting resin in the resin composition is 10 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
the curing accelerator consists of an imidazole,
the content of the curing accelerator in the resin composition is 0.01 to 5.0 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermosetting resin, and
wherein when the resin composition is formed into a film shape, the film has a shear viscosity at 60° C. of 100 to 10000 Pa·s, an elastic modulus of 10 to 1000 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 1 hour at 170° C., and a 5% weight reduction temperature of 300° C. or higher after being heated for 30 minutes at 130° C. and for 1 hour at 170° C.
7 . A support tape for substrate conveyance, comprising:
a support film for conveying an organic substrate; and
a temporary fixing material layer provided on the support film for temporarily fixing the organic substrate and the support film,
wherein the temporary fixing material layer comprises a thermoplastic resin, a thermosetting resin, a filler, a curing accelerator, and either contains no silicone-based release agent or has a content of a silicone-based release agent of 10% by mass or less based on a total amount of the temporary fixing material layer,
the filler is an inorganic and/or organic filler, and a content of the filler in the temporary fixing material layer is 5-300 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
the thermoplastic resin consists of a (meth)acrylic copolymer having a crosslinkable epoxy group, a Tg of −50° C. to 50° C., and a weight average molecular weight of 100000 to 400000,
the thermosetting resin consists of an epoxy resin,
the temporary fixing material layer further comprises an epoxy resin curing agent that cures the epoxy resin, the epoxy resin curing agent consisting of a phenol resin,
the combined content of the thermoplastic resin, the thermosetting resin, the curing accelerator, the filler and the epoxy resin curing agent is 90% by mass or more based on the total amount of the temporary fixing material layer,
the content of the thermosetting resin in the temporary fixing material layer is 10 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
the curing accelerator consists of an imidazole,
the content of the curing accelerator in the temporary fixing material layer is 0.01 to 5.0 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermosetting resin, and
wherein the temporary fixing material layer has a shear viscosity at 60° C. of 100 to 10000 Pa·s, an elastic modulus of 10 to 1000 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 1 hour at 170° C., and a 5% weight reduction temperature of 300° C. or higher after being heated for 30 minutes at 130° C. and for 1 hour at 170° C.
8 . The support tape according to claim 7 , wherein the support film is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.
9 . A method for producing an electronic device, the method comprising:
forming a laminated body including a temporary fixing material located between a support and an organic substrate having a thickness of 1000 μm or less;
heating the temporary fixing material of the laminated body;
mounting a semiconductor chip on the organic substrate of the laminated body after heating the temporary fixing material;
sealing the semiconductor chip mounted on the organic substrate with a sealing material; and
peeling the support and the temporary fixing material from the organic substrate of the laminated body after sealing the semiconductor chip,
wherein the temporary fixing material comprises a thermoplastic resin, a thermosetting resin, and a curing accelerator, and either contains no silicone-based release agent or has a content of a silicone-based release agent of 10% by mass or less based on a total amount of the temporary fixing material,
the thermoplastic resin consists of a (meth)acrylic copolymer having a crosslinkable epoxy group, a Tg of −50° C. to 50° C., and a weight average molecular weight of 100000 to 400000,
the thermosetting resin consists of an epoxy resin,
the temporary fixing material further comprises an epoxy resin curing agent that cures the epoxy resin, the epoxy resin curing agent consisting of a phenol resin,
the combined content of the thermoplastic resin, the thermosetting resin, the curing accelerator, and the epoxy resin curing agent is 90% by mass or more based on the total amount of the temporary fixing material,
the content of the thermosetting resin in the temporary fixing material is 10 to 60 parts by mass with respect to 100 parts by mass of the thermoplastic resin,
the curing accelerator consists of an imidazole,
the content of the curing accelerator in the temporary fixing material is 0.01 to 5.0 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermosetting resin, and
wherein the temporary fixing material has a shear viscosity of 100 to 10000 Pa·s at 60° C., an elastic modulus of 10 to 1000 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 1 hour at 170° C., and a 5% weight reduction temperature of 300° C. or higher after being heated for 30 minutes at 130° C. and for 1 hour at 170° C.
10 . The method according to claim 9 , wherein the organic substrate is a coreless substrate.
11 . The method according to claim 9 , wherein the support is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.
12 . The method according to claim 9 , wherein the support is attached to the organic substrate in a tape form when the laminated body is formed.
13 . The method according to claim 9 , wherein the laminated body is formed using a support tape, the support tape comprising a support film as the support and a temporary fixing material layer provided on the support film and formed from the temporary fixing material.