IP Library Granted Patent US 12698419
Granted Patent B2
US 12698419 · App. 16/753,235 · Granted Aug 4, 2026

Temperature-changeable adhesive sheet and temperature-changeable adhesive sheet manufacturing method using same

Inventors: Hui Je Lee (Daejeon, KR); Yoonkyung Kwon (Daejeon, KR); Hyun Jee Yoo (Daejeon, KR); Kyung Yul Bae (Daejeon, KR)
Assignee: XINMEI FONTANA HOLDING (HONG KONG) LIMITED
C09J7/29C08K5/0025C08K5/01C08L9/00C08L33/08C08L83/04C09J7/20C09J7/383C09J11/06C09J109/00C09J123/16C09J133/08C09J133/10C09J183/04B32B2307/7246C08L2205/00C09J2203/326C09J2301/208C09J2301/302C09J2301/312C09J2301/408C09J2409/00C09J2423/00C09J2433/00C09J2483/00H10K50/844
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Quick Facts
Patent No.
US 12698419
App. No.
16/753,235
Granted
Aug 4, 2026
Kind
B2
Abstract

A temperature-variable adhesive sheet, and a method for manufacturing a temperature-variable adhesive sheet using the same are provided. The adhesive sheet includes a first adhesive layer and a second adhesive layer consecutively provided on a barrier film, wherein initial adhesive strength between the second adhesive layer and a SUS304 substrate is 200 gf/in or less, and adhesive strength, after 20 minutes passed under a condition of 50° C. and 5 atmospheres, is 400 gf/in or greater.

Claims (13)

1 . An adhesive sheet comprising a first adhesive layer and a second adhesive layer consecutively provided on a barrier film, wherein the first adhesive layer is provided on a barrier layer of the barrier film,

wherein an initial adhesive strength between the second adhesive layer and a SUS304 substrate is 200 gf/in or less, and an adhesive strength between the second adhesive layer and a SUS304 substrate, after 20 minutes passed under a condition of 50° C. and 5 atmospheres, is 400 gf/in or greater,

wherein the first adhesive layer comprises a first adhesive composition comprising a copolymer of a diene and an olefin-based compound comprising one carbon-carbon double bond,

wherein the second adhesive layer comprises a second adhesive composition comprising;

a polymer comprising a polymerization unit of an alkyl (meth)acrylate, a hard comonomer and a crosslinkable monomer, wherein the polymer comprises 80-95 parts by weight of alkyl (meth)acrylate, 1-30 parts by weight of hard comonomer, and 1-40 parts by weight of crosslinkable monomer on the basis of 100 parts by weight of the polymer, wherein a total amount of the alkyl (meth)acrylate, the hard comonomer, and the crosslinkable monomer is 100 parts by weight, and

a polymer comprising a unit derived from a silicon-based hydrophobic monomer, wherein the polymer comprising a unit derived from a silicon-based hydrophobic monomer is included in 0.01 parts by weight to 10 parts by weight based on 100 parts by weight of the second adhesive composition

wherein the adhesive sheet has a moisture permeability (WVTR) of 10 g/m 2 ·24 h or less, as measured in accordance with ASTM F1249.

2 . The adhesive sheet of claim 1 , wherein the barrier film has a structure in which a base layer, a planarization layer and the barrier layer are laminated.

3 . The adhesive sheet of claim 1 , wherein the first adhesive composition further comprises a tackifier and a curable resin.

4 . An organic electronic device encapsulation product comprising the adhesive sheet of claim 1 .

5 . A method for manufacturing the adhesive sheet according to claim 1 comprising:

preparing the barrier film; and

sequentially forming the first adhesive layer and the second adhesive layer on the barrier layer of the barrier film to form the adhesive sheet, wherein the first adhesive layer is provided on the barrier layer of the barrier film.