IP Library Granted Patent US 12698870
Granted Patent B2
US 12698870 · App. 19/273,047 · Granted Aug 4, 2026

LED light bulb

Inventors: Tao Jiang (Jiaxing, CN); Ronghuan Yang (Jiaxing, CN); Zhikun Wang (Jiaxing, CN); Jlianjun Ding (Nanjing, CN); Chihshan Yu (Jiaxing, CN); Heng Zhao (Kunshan, CN); Nanyi Jiang (Jiaxing, CN)
Assignee: JIAXING SUPER LIGHTING ELECTRIC APPLICATION CO., LTD
F21K9/232F21K9/235F21K9/238F21V3/10H05B45/00F21Y2107/00F21Y2107/20F21Y2107/70F21Y2115/10
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Quick Facts
Patent No.
US 12698870
App. No.
19/273,047
Granted
Aug 4, 2026
Kind
B2
Abstract

A lighting device, including: a lamp housing and a lamp cap connected to each other and formed a closed space; at least one light-emitting diode filament disposed in the closed space; and a stem connected to the lamp cap and electrical conducted with the light-emitting diode filament, wherein the light-emitting diode filament includes: a chip strip structure; a light conversion unit wrapping the chip strip structure; and electrodes located at two ends of the chip strip structure respectively and electrically connected thereto, wherein at least part of the electrodes are wrapped in the light conversion unit; the chip strip structure includes a substrate with a first end and a second end, and a deposition segment located between the first end and the second end; and the deposition segment includes a plurality of deposition units with a connecting layer disposed therebetween, and a conductor layer electrically connects the deposition units.

Claims (35)

1 . An LED light bulb comprising:

a lamp housing;

a lamp cap connected to the lamp housing;

a driving circuit disposed in the lamp cap;

a stem disposed in the lamp housing and connected to the lamp cap;

two conductive brackets disposed in the lamp housing, the two conductive brackets having opposite polarities and electrically connected the driving circuit; and

an LED filament disposed in the lamp housing and electrically connected to the two conductive brackets, the LED filament comprising:

a chip strip structure comprising a substrate, a plurality of deposition units disposed on the substrate and arranged along a longitudinal direction of the substrate, a connecting layer disposed between the two adjacent deposition units and a conductor layer disposed on the connecting layer and electrically connected to the two adjacent deposition units;

a light conversion unit wrapping the chip strip structure; and

two electrodes disposed at two opposite ends of the substrate and electrically connected to the plurality of deposition units, the two electrodes further electrically connected to the two conductive brackets respectively,

wherein the connecting layer is disposed on the substrate and between every two adjacent deposition units, so that the plurality of deposition units form a continuous strip-shaped structure on the substrate;

wherein the deposition unit comprises:

a first semiconductor layer disposed on the substrate;

a light-emitting layer disposed on the first semiconductor layer;

a second semiconductor layer disposed on the light-emitting layer;

a first electrode disposed on the first semiconductor layer and spaced apart from the light-emitting layer; and

a second electrode disposed on the second semiconductor layer.

2 . The LED light bulb according to claim 1 , wherein a width of the connecting layer along a width direction of the substrate is equal to a width of the deposition unit along the width direction of the substrate.

3 . The LED light bulb according to claim 2 , wherein the substrate is made of light transparent material.

4 . The LED light bulb according to claim 3 , wherein a thickness of the substrate is 70-700 μm.

5 . The LED light bulb according to claim 3 , wherein the conductor layer is further disposed between the electrode and a deposition unit at an end of the substrate, the two electrodes electrically connected to the two deposition units at two end of the substrate through the conductor layer respective.

6 . The LED light bulb according to claim 5 , wherein the conductor layer is disposed on the substrate and the electrode is disposed on the conductor layer, such that the conductor layer is sandwiched between the substrate and the electrode.

7 . The LED light bulb according to claim 6 , wherein the light conversion unit wraps the chip strip structure, the conductor layer and a portion of each of the two electrodes.

8 . The LED light bulb according to claim 7 , wherein the light conversion unit comprises a first light conversion layer and the second light conversion layer, the second light conversion layer wraps the substrate, the plurality of deposition units and the conductor layer, and the first light conversion layer wraps the second light conversion layer and the portion of each of the two electrodes.

9 . The LED light bulb according to claim 8 , wherein the second light conversion layer further wraps the portion of each of the two electrodes.

10 . The LED light bulb according to claim 9 , wherein the light conversion unit further comprises a coating layer coating on an outside surface of the first light conversion layer, a color of the coating layer is different from a color of the first light conversion layer.

11 . The LED light bulb according to claim 10 , wherein the coating layer comprises a silica gel and titanium dioxide powder and further coats on a surface of each of the two electrodes.

12 . The LED light bulb according to claim 11 , wherein the conductor layer is a transparent conductive layer.

13 . The LED light bulb according to claim 3 , wherein the two electrodes electrically connected to the two deposition units at two end of the substrate through a lead wire respectively.

14 . The LED light bulb according to claim 13 , wherein the light conversion unit wraps the chip strip structure, the lead wire and a portion of each of the two electrodes.

15 . The LED light bulb according to claim 14 , wherein the light conversion unit comprises a first light conversion layer and a second light conversion layer, the second light conversion layer wraps the substrate, the plurality of deposition units and the conductor layer, and the first light conversion layer wraps the second light conversion layer the portion of each of the two electrodes.

16 . The LED light bulb according to claim 15 , wherein the second light conversion layer further wraps the portion of each of the two electrodes.

17 . The LED light bulb according to claim 16 , wherein the light conversion unit further comprises a coating layer coating on an outside surface of the first light conversion layer, a color of the coating layer is different from a color of the first light conversion layer.

18 . The LED light bulb according to claim 17 , wherein the coating layer comprises a silica gel and titanium dioxide powder and further coats on a surface of each of the two electrodes.

19 . The LED light bulb according to claim 18 , wherein the conductor layer is a transparent conductive layer.