Package devices and methods of manufacture
Package devices and methods of manufacture are discussed. In an embodiment, a method of manufacturing an integrated circuit device includes: forming an optical device layer; forming an optical layer on the optical device layer; after the forming the optical layer, forming a first opening in the optical layer; and embedding a reflective structure in the first opening.
1 . A method of manufacturing an integrated circuit device comprising:
forming an optical device layer, wherein the optical device layer comprises one or more optical devices;
forming an optical layer on the optical device layer;
after the forming the optical layer, forming a first opening in the optical layer;
embedding a reflective structure in the first opening, wherein after embedding the reflective structure in the first opening, the reflective structure protrudes from the first opening; and
after embedding the reflective structure in the first opening, planarizing the reflective structure, wherein a surface of the reflective structure is substantially level with a surface of the optical layer, wherein the surface of the optical layer faces away from the optical device layer.
2 . The method of claim 1 , further comprising bonding the optical device layer to a bulk silicon substrate on a side opposite the optical layer.
3 . The method of claim 1 , wherein the embedding the reflective structure further comprises placing a bonding material into the first opening and inserting the reflective structure into the bonding material.
4 . The method of claim 3 , further comprising thermally curing the bonding material after the inserting the reflective structure into the bonding material.
5 . The method of claim 1 , further comprising:
forming a photoresist layer over the optical layer prior to forming the first opening in the optical layer; and
imaging and developing the photoresist layer to form a second opening in the photoresist layer, wherein the second opening formed in the photoresist layer has sloped sidewalls and the forming the first opening in the optical layer comprises performing an etch through the second opening.
6 . The method of claim 1 , further comprising forming a first coupler in the optical layer prior to the forming the first opening, wherein the embedding the reflective structure comprises positioning a reflective coating of the reflective structure at a 40 to 60 degree angle from the first coupler.
7 . The method of claim 6 , wherein the first coupler is an edge coupler.
8 . The method of claim 1 , wherein the first opening extends through the optical layer and into the optical device layer.
9 . A method of manufacturing an optical device comprising:
forming an optical device structure over a first structure, the optical device structure comprising first optical components;
bonding a second structure to the optical device structure opposite the first structure;
removing the first structure and forming an optical interconnect structure where the first structure had been, wherein the optical interconnect structure comprises second optical components;
etching a first hole in the optical interconnect structure; and
embedding a design-in mirror in the first hole.
10 . The method of claim 9 , wherein the design-in mirror further comprises a reflective metal coating deposited over a silicon base.
11 . The method of claim 10 , wherein the design-in mirror is formed to be a trapezoidal prism prior to the embedding the design-in mirror in the first hole.
12 . The method of claim 9 , wherein the embedding the design-in mirror forms a first interface between the second optical components and a reflective coating of the design-in mirror, the first interface being at a 40 to 60 degree angle between the second optical components and the reflective coating.
13 . The method of claim 9 , wherein the first hole extends partially into the optical device structure.
14 . The method of claim 9 , wherein the first hole is filled with a bonding material prior to the embedding the design-in mirror in the first hole.
15 . The method of claim 14 , wherein the embedding the design-in mirror in the first hole displaces a portion of the bonding material forming filets around the design-in mirror outside the first hole.
16 . A method of manufacturing an optical device comprising:
forming an optical device layer over a semiconductor device;
forming a backside optical layer over the optical device layer, the backside optical layer including an optical component, wherein the optical component is configured for optical communications with the optical device layer;
forming an opening in the backside optical layer;
placing a bonding material in the opening;
after placing the bonding material in the opening, placing an intermediate optical structure in the opening, wherein the intermediate optical structure comprises a reflective surface, wherein the reflective surface is optically aligned with the optical component of the backside optical layer, wherein the intermediate optical structure protrudes from the opening; and
planarizing the intermediate optical structure.
17 . The method of claim 16 , wherein a surface of the intermediate optical structure is level with a surface of the backside optical layer.
18 . The method of claim 16 , wherein the opening extends completely through the backside optical layer.
19 . The method of claim 18 , wherein the opening extends into the optical device layer.
20 . The method of claim 16 , wherein the intermediate optical structure comprises a reflective coating on a silicon structure.