Electronic device
An electronic device includes a stretchable electronic component layer and a decorative component layer. The decorative component layer includes a first sub-layer and a second sub-layer. The first sub-layer is disposed on the stretchable electronic component layer. The second sub-layer is disposed on the first sub-layer. The first sub-layer is located between the second sub-layer and the stretchable electronic component layer. The second sub-layer has a decorative texture. A transmittance of the first sub-layer is less than a transmittance of the second sub-layer.
1 . An electronic device, comprising:
a stretchable electronic component layer; and
a decorative component layer, comprising:
a first sub-layer disposed on the stretchable electronic component layer; and
a second sub-layer disposed on the first sub-layer, wherein the first sub-layer is located between the second sub-layer and the stretchable electronic component layer, the second sub-layer has a decorative texture, and a transmittance of the first sub-layer is less than a transmittance of the second sub-layer.
2 . The electronic device as claimed in claim 1 , wherein a color of the first sub-layer and a color of the second sub-layer of the decorative component layer are different.
3 . The electronic device as claimed in claim 1 , wherein the transmittance of the first sub-layer of the decorative component layer falls in a range of 10% to 40%.
4 . The electronic device as claimed in claim 1 , wherein the transmittance of the second sub-layer of the decorative component layer is greater than 80%.
5 . The electronic device as claimed in claim 1 , wherein a thickness of the first sub-layer of the decorative component layer is K, a thickness of the second sub-layer of the decorative component layer is J, and K≤J.
6 . The electronic device as claimed in claim 1 , wherein the second sub-layer of the decorative component layer has a surface facing away from the stretchable electronic component layer, the decorative texture is formed on the surface, the surface has a height difference, the height difference is F, a thickness of the second sub-layer of the decorative component layer is J, and 2F≤J≤10F.
7 . The electronic device as claimed in claim 1 , further comprising:
a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer;
a flexible electronic component bonded to a bonding area of the stretchable electronic component layer; and
a protective layer disposed on the carrier layer, and covering the stretchable electronic component layer and a part of the flexible electronic component, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer and between the decorative component layer and the flexible electronic component,
wherein a thickness of the protective layer is B, a thickness of a flexible substrate of the flexible electronic component is E, and B≥2E.
8 . The electronic device as claimed in claim 1 , further comprising:
a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer;
a flexible electronic component bonded to a bonding area of the stretchable electronic component layer, wherein the flexible electronic component has a first perforation, and the first perforation is located outside the bonding area of the stretchable electronic component layer; and
a protective layer disposed on the carrier layer, and covering the stretchable electronic component layer and a part of the flexible electronic component, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer and between the decorative component layer and the flexible electronic component,
wherein a part of the protective layer fills into the first perforation of the flexible electronic component and connects with the carrier layer.
9 . The electronic device as claimed in claim 1 , further comprising:
a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer;
a flexible electronic component bonded to a bonding area of the stretchable electronic component layer, wherein the flexible electronic component has a second perforation, the bonding area of the stretchable electronic component layer has a bonding area perforation, and the second perforation of the flexible electronic component and the bonding area perforation of the stretchable electronic component layer are disposed correspondingly to each other; and
a protective layer disposed on the carrier layer, and covering the stretchable electronic component layer and a part of the flexible electronic component, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer and between the decorative component layer and the flexible electronic component,
wherein a part of the protective layer fills into the second perforation of the flexible electronic component and the bonding area perforation of the stretchable electronic component layer, and connects with the carrier layer.
10 . The electronic device as claimed in claim 1 , wherein a working area of the stretchable electronic component layer has a working area perforation, and the electronic device further comprises:
a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer; and
a protective layer disposed on the carrier layer, and covering the stretchable electronic component layer, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer,
wherein a part of the protective layer fills into the working area perforation of the stretchable electronic component layer and connects with the carrier layer.
11 . The electronic device as claimed in claim 1 , further comprising:
a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer; and
a sensing layer, wherein the carrier layer is located between the stretchable electronic component layer and the sensing layer,
wherein an air gap exists between the sensing layer and the carrier layer.
12 . The electronic device as claimed in claim 11 , wherein a surface of the carrier layer facing the sensing layer has a plurality of first micro-protrusions.
13 . The electronic device as claimed in claim 12 , wherein the sensing layer comprises an insulating substrate, and a surface of the insulating substrate facing the carrier layer has a plurality of second micro-protrusions.
14 . The electronic device as claimed in claim 13 , wherein a dimension of the first micro-protrusion of the carrier layer is smaller than a dimension of the second micro-protrusion of the sensing layer.
15 . The electronic device as claimed in claim 11 , wherein the sensing layer comprises an insulating substrate and an electrode disposed on the insulating substrate, and a surface impedance of the carrier layer falls in a range of 10 4 Ω/sq to 10 9 Ω/sq.
16 . The electronic device as claimed in claim 1 , wherein the sensing layer comprises an insulating substrate and an electrode embedded in the insulating substrate, and a surface impedance of the carrier layer falls in a range of 10 −3 Ω/sq to 10 3 Ω/sq.
17 . An electronic device, comprising:
a stretchable electronic component layer;
a decorative component layer disposed on the stretchable electronic component layer;
a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer;
a flexible electronic component bonded to a bonding area of the stretchable electronic component layer, wherein the flexible electronic component has a first perforation, and the first perforation is located outside the bonding area of the stretchable electronic component layer; and
a protective layer disposed on the carrier layer, and covering the stretchable electronic component layer and a part of the flexible electronic component, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer and between the decorative component layer and the flexible electronic component,
wherein a part of the protective layer fills into the first perforation of the flexible electronic component and connects with the carrier layer.