IP Library Granted Patent US 12700456
Granted Patent B2
US 12700456 · App. 18/625,800 · Granted Aug 4, 2026

Controlling pillar voltage using wordline boost voltage and select gate leakage during all levels programming of a memory device

Inventors: Sheyang Ning (San Jose, CA); Lawrence Celso Miranda (San Jose, CA); Jeffrey S. McNeil (Nampa, ID); Tomoko Ogura Iwasaki (San Jose, CA); Yeang Meng Hern (Singapore, SG); Lee-eun Yu (San Jose, CA); Albert Fayrushin (Boise, ID); Fulvio Rori (Boise, ID); Justin Bates (Boise, ID)
Assignee: Micron Technology, Inc.
G11C16/08G11C16/0483G11C16/10
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Quick Facts
Patent No.
US 12700456
App. No.
18/625,800
Granted
Aug 4, 2026
Kind
B2
Abstract

Control logic in a memory device initiates a program operation including a first phase including applying a ramping voltage level to a set of wordlines of a memory device to boost a set of pillar voltages and a second phase including applying a set of programming pulses to a wordline associated with one or more memory cells of the memory device to be programmed to a set of programming levels, wherein each programming level of the set of programming levels is programmed by each programming pulse. During the first phase of the program operation, a first voltage applied to a drain-side select line (SGD) is adjusted from a first SGD voltage level to a second SGD voltage level.

Claims (28)

1 . A memory device comprising:

a memory array comprising a plurality of memory cells; and

control logic, operatively coupled with the memory array, to perform operations comprising:

initiating a program operation comprising a first phase comprising applying a ramping voltage level to a set of wordlines of the memory device to boost a set of pillar voltages and a second phase comprising applying a set of programming pulses to a wordline associated with one or more memory cells of the memory array to be programmed to a set of programming levels, wherein each programming level of the set of programming levels is programmed by each programming pulse of the set of programming pulses; and

during the first phase of the program operation, adjusting a first voltage applied to a drain-side select line (SGD) from a first SGD voltage level to a second SGD voltage level.

2 . The memory device of claim 1 , wherein the first SGD voltage level is greater than the second SGD voltage level.

3 . The memory device of claim 1 , wherein adjusting the first voltage applied to the SGD causes SGD leakage.

4 . The memory device of claim 1 , the operations further comprising, during the first phase of program operation, adjusting a second voltage applied to a source-side select line (SGS) from a first SGS voltage level to a second SGS voltage level.

5 . The memory device of claim 4 , wherein the first SGS voltage level is greater than the second SGS voltage level.

6 . The memory device of claim 1 , the operations further comprising incrementing the ramping voltage level by a step voltage amount for a subset of the set of pillars.

7 . The memory device of claim 6 , wherein the ramping voltage level is not increased during boosting of a sixth pillar associated with a sixth programming level of the set of programming levels and a seventh pillar associated with a seventh programming level of the set of programming levels.

8 . A method comprising:

initiating a program operation comprising a first phase comprising applying a ramping voltage level to a set of wordlines of a memory device to boost a set of pillar voltages and a second phase comprising applying a set of programming pulses to a wordline associated with one or more memory cells of the memory device to be programmed to a set of programming levels, wherein each programming level of the set of programming levels is programmed by each programming pulse of the set of programming pulses; and

during the first phase of the program operation, adjusting a first voltage applied to a drain-side select line (SGD) from a first SGD voltage level to a second SGD voltage level.

9 . The method of claim 8 , wherein the first SGD voltage level is greater than the second SGD voltage level.

10 . The method of claim 8 , wherein adjusting the first voltage applied to the SGD causes SGD leakage.

11 . The method of claim 8 , further comprising, during the first phase of program operation, adjusting a second voltage applied to a source-side select line (SGS) from a first SGS voltage level to a second SGS voltage level.

12 . The method of claim 11 , wherein the first SGS voltage level is greater than the second SGS voltage level.

13 . The method of claim 8 , further comprising incrementing the ramping voltage level by a step voltage amount for a subset of the set of pillars.

14 . The method of claim 13 , wherein the ramping voltage level is not increased during boosting of a sixth pillar associated with a sixth programming level of the set of programming levels and a seventh pillar associated with a seventh programming level of the set of programming levels.

15 . A non-transitory computer-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to perform operations comprising:

initiating a program operation comprising a first phase comprising applying a ramping voltage level to a set of wordlines of a memory device to boost a set of pillar voltages and a second phase comprising applying a set of programming pulses to a wordline associated with one or more memory cells of a memory device to be programmed to a set of programming levels, wherein each programming level of the set of programming levels is programmed by each programming pulse of the set of programming pulses; and

during the first phase of the program operation, adjusting a first voltage applied to a drain-side select line (SGD) from a first SGD voltage level to a second SGD voltage level.

16 . The non-transitory computer-readable storage medium of claim 15 , wherein the first SGD voltage level is greater than the second SGD voltage level.

17 . The non-transitory computer-readable storage medium of claim 15 , wherein adjusting the first voltage applied to the SGD causes SGD leakage.

18 . The non-transitory computer-readable storage medium of claim 15 , the operations further comprising, during the first phase of program operation, adjusting a second voltage applied to a source-side select line (SGS) from a first SGS voltage level to a second SGS voltage level.

19 . The non-transitory computer-readable storage medium of claim 18 , wherein the first SGS voltage level is greater than the second SGS voltage level.

20 . The non-transitory computer-readable storage medium of claim 15 , further comprising incrementing the ramping voltage level by a step voltage amount for a subset of the set of pillars, wherein the ramping voltage level is not increased during boosting of a sixth pillar associated with a sixth programming level of the set of programming levels and a seventh pillar associated with a seventh programming level of the set of programming levels.