Manufacturing method of magnetic element

1 . A manufacturing method of a magnetic element, comprising:

forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core;

forming a first waist groove on the insulation layer by adopting a drilling process, wherein the number of the first waist groove is one or more;

forming a surface copper and a first hole copper respectively on a surface of the insulation layer and an inner surface of the first waist groove by adopting the metallization process;

dividing the surface copper into a first surface copper close to the magnetic core and a second surface copper away from the magnetic core, and dividing the first hole copper into a first sidewall copper close to the magnetic core and a second sidewall copper away from the magnetic core, by adopting the mechanically dividing process at an end of the first waist groove along a depth direction of the first waist groove;

pressing an insulation material into a gap between the first sidewall copper and the second sidewall copper, wherein the insulation material is higher than the first wiring layer to form a second insulation layer;

drilling a hole on the second insulation layer, and forming a first conductor and a third surface copper respectively in the hole and on the second insulation layer through the metallization process, wherein the first conductor is located above the second surface copper;

wherein

the first surface copper and the first sidewall copper serve as a first horizontal portion and a first vertical portion respectively and together form a first wiring layer wound flat around the magnetic core, and an insulation layer between the first wiring layer and the magnetic core is a first insulation layer;

the third surface copper, the second surface copper and the second sidewall copper serve as a second horizontal portion, a first transitional horizontal portion and a second vertical portion respectively, and form a second wiring layer flat wound around the magnetic core together with the first conductor.

2 . The manufacturing method according to claim 1 , before pressing an insulation material into a gap between the first sidewall copper and the second sidewall copper, further comprising:

dividing the second sidewall copper into a multi-segment structure through the mechanically dividing process, and connecting multiple segments of the first sidewall copper correspondingly with multiple segments of the third surface copper to form a multi-turn metal winding on the second winding layer.

3 . The manufacturing method according to claim 1 , before pressing an insulation material into a gap between the first sidewall copper and the second sidewall copper, further comprising:

dividing the first sidewall copper into a multi-segment structure through the mechanically dividing process, and connecting multiple segments of the first sidewall copper correspondingly with multiple segments of the first surface copper to form a multi-turn metal winding on the first winding layer.

4 . The manufacturing method according to claim 1 , further comprising:

forming a third insulation layer on an outer side of the second wiring layer; and

forming a third wiring layer on an outer side of the third insulation layer through the metallization process, wherein the third wiring layer comprises a third vertical portion and a third horizontal portion.

5 . The manufacturing method according to claim 1 , further comprising:

forming a fourth surface copper and a third sidewall copper respectively on upper and lower surfaces and on sides of the insulation layer with positions away from the surface copper and the first hole copper, wherein the fourth surface copper is coplanar with the surface copper, and the third sidewall copper is parallel to the first hole copper;

drilling a hole on the second insulation layer, and forming a second conductive cylinder and a fifth surface copper respectively in the hole and on the second insulation layer through the metallization process, wherein the second conductive cylinder and the fifth surface copper are located above the fourth surface copper, and the fifth surface copper is coplanar with the third surface copper;

pressing an insulation material onto the second wiring layer to form a third insulation layer; and

drilling a hole on the third insulation layer, and forming a third conductive cylinder and a sixth surface copper respectively in the hole and on a surface of the third insulation layer through the metallization process, wherein the third conductive cylinder is located above the fifth surface copper;

wherein the third sidewall copper, the fourth surface copper, the fifth surface copper and the sixth surface copper serve as a third vertical portion, a second transitional horizontal portion, a third transitional horizontal portion and a third horizontal portion respectively, and form a third wiring layer flat wound around the magnetic core together with the second conductive cylinder and the third conductive cylinder.

6 . The manufacturing method according to claim 1 , wherein the forming the insulation layer on the outer side of the magnetic core specifically comprises:

forming the insulation layer on the outer side of the magnetic core by performing spraying, dipping, electrophoresis, electrostatic spraying, chemical vapor deposition, physical vapor deposition or evaporation plating using an insulation material; or,

forming the insulation layer by injecting an insulation material on the outer side of the magnetic core; or,

processing an empty groove on a PCB core board, placing the magnetic core into the empty groove, making the magnetic core and the PCB core board located on a same horizontal plane, pressing an insulation material into a gap between the magnetic core and the PCB core board and making the insulation material higher than a surface of the PCB core board, so as to form the insulation layer by the PCB core board and the insulation material.

7 . A magnetic element, comprising:

a magnetic core; and

a metal wiring layer flat wound on a surface of at least one section of a magnetic column of the magnetic core;

the metal wiring layer comprises a first wiring layer and a second wiring layer located outside the first wiring layer, a first insulation layer is provided between the magnetic core and the first wiring layer, and a second insulation layer is provided between the first wiring layer and the second wiring layer;

wherein the first wiring layer comprises a first vertical portion and a first horizontal portion that are connected;

the second wiring layer comprises:

a second vertical portion and a second horizontal portion that are connected;

wherein the first vertical portion and the second vertical portion are formed by a mechanically dividing process.

8 . The magnetic element according to claim 7 , the second wiring layer further comprising a first transitional horizontal portion connected with the second horizontal portion and the second vertical portion, wherein the first transitional horizontal is coplanar with the first horizontal portion.

9 . The magnetic element according to claim 8 , the first transitional horizontal portion and the first horizontal portion are formed together by a metallization process and divided by the mechanically dividing process.

10 . The magnetic element according to claim 8 , the second wiring layer further comprising a first conductor configured for the connection of the second horizontal portion and the first transitional horizontal portion.

11 . The magnetic element according to claim 7 , at least part of the first vertical portion is divided by the mechanically dividing process so as to form a multi-turn winding.

12 . The magnetic element according to claim 7 , at least part of the second vertical portion is divided by the mechanically dividing process so as to form a multi-turn winding.

13 . The magnetic element according to claim 7 , the metal wiring layer further comprises a third wiring layer located outside the second wiring layer, and a third insulation layer is provided between the second wiring layer and the third wiring layers;

the third wiring layer comprises a third vertical portion and a third horizontal portion that are connected.

14 . The magnetic element according to claim 13 , wherein the third wiring layer further comprises: a second transitional horizontal portion and a third transitional horizontal portion;

wherein the second transitional horizontal portion is coplanar with the first horizontal portion, and the third transitional horizontal portion is coplanar with the second horizontal portion; the third vertical portion is connected with the second transitional horizontal portion; the second transitional horizontal portion is connected with the third transitional horizontal portion via a second conductor, and the third transitional horizontal portion is connected with the third horizontal portion via a third conductor.

15 . The magnetic element according to claim 7 , wherein the second wiring layer further comprises an additional vertical portion, and the second vertical portion and the additional vertical portion are parallel to each other and are connected with the second horizontal portion.

16 . The magnetic element according to claim 7 , wherein the metal wiring layer has at least a first metal winding and a second metal winding formed thereon;

at least part of the first metal winding is formed on the first wiring layer, and at least part of the second metal winding is formed on the second wiring layer; at least part of the first metal winding is covered by the second insulation layer, and at least part of the first metal winding is covered by the second metal winding; and at least part of the second insulation layer is covered by the second metal winding.

17 . The magnetic element according to claim 7 , wherein an equivalent thermal expansion coefficient of the first insulation layer from 170° C. to a room temperature is higher than that of the second insulation layer;

or, a decomposition temperature of the first insulation layer ranges from 170° C. to 260° C.;

or, a low-melting-point material is provided between the first insulation layer and the magnetic core, and a melting point of the low-melting-point material is lower than 200° C.