IP Library › Granted Patent US 12700549
Granted Patent B2
US 12700549 · App. 18/367,242 · Granted Aug 4, 2026

Capacitor and process for forming electrical connections therein

Inventors: Brandon K. Summey (Simpsonville, SC); Jeffrey Poltorak (Greenville, SC); Robert Andrew Ramsbottom (Simpsonville, SC); Kevin A. Agosto (Simpsonville, SC)
Assignee: Kemet Electronics Corporation
H01G9/012H01G9/0029H01G9/0425H01G9/08H01G9/15
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Quick Facts
Patent No.
US 12700549
App. No.
18/367,242
Granted
Aug 4, 2026
Kind
B2
Abstract

Provided herein is an improved capacitor. The capacitor comprises a capacitor body comprising an anode, a dielectric on the anode and a cathode on the dielectric. At least two anode wires are in electrical contact with the anode and extending from the capacitor body. At least one anode node, or an anode node remnant, wherein each anode wire of the anode wires is in electrical contact with at least one anode node or anode remnant. An encapsulant encases the capacitor body. At least a portion of the anode node, or anode node remnant, is in electrical connection with an external termination. A cathode external termination is in electrical contact with the cathode.

Claims (64)

1 . A capacitor comprising:

a capacitor body comprising an anode, a dielectric on said anode and a cathode on said dielectric;

at least two anode wires in electrical contact with said anode and extending from said capacitor body;

at least one anode node or an anode node remnant, wherein each anode wire of said anode wires is in electrical contact with said at least one said anode node or said anode remnant with one separate anode node in electrical contact with each said anode wire;

an encapsulant encasing said capacitor body;

at least a portion of each said at least on anode node or anode node remnant, is in electrical connection with an external termination; and

a cathode external termination in electrical contact with said cathode.

2 . The capacitor of claim 1 wherein said external termination is a metallization layer on said encapsulant wherein said metallization layer is in electrical contact with each said anode node or anode node remnant wherein said metallization layer is an external termination.

3 . The capacitor of claim 1 wherein said external termination is a leadframe portion.

4 . The capacitor of claim 1 wherein said electrical connection to said external termination comprises a conductive paste, solder, or other conforming conductive material.

5 . The capacitor of claim 1 wherein said anode comprises a metal.

6 . The capacitor of claim 5 wherein said metal is a valve metal selected from the group consisting of tantalum, aluminum, niobium, titanium, zirconium, hafnium, alloys thereof and a conductive oxide thereof.

7 . The capacitor of claim 1 wherein said anode is fluted.

8 . The capacitor of claim 1 wherein said cathode comprises manganese dioxide or a conductive polymer.

9 . The capacitor of claim 8 wherein said conductive polymer is selected from a polyaniline, a polypyrrole or a polythiophene.

10 . The capacitor of claim 9 wherein said polythiophene is poly-3,4-ethylenedioxythiophene.

11 . The capacitor of claim 1 comprising one anode node in electrical contact with multiple said anode wires.

12 . The capacitor of claim 1 comprising no more than 10 said anode wires.

13 . The capacitor of claim 12 comprising 3 to 5 said anode wires.

14 . The capacitor of claim 1 wherein said anode wires are parallel.

15 . The capacitor of claim 1 wherein said anode wires are coplanar.

16 . The capacitor of claim 1 wherein said anode wires extend from a common face of said capacitor body.

17 . The capacitor of claim 1 wherein said anode wires do not extend from a common face of said capacitor body.

18 . A method of forming a capacitor comprising:

forming a capacitor body comprising an anode, a dielectric on said anode and a cathode on said dielectric with at least two anode wires in electrical contact with said anode and extending from said capacitor body and with one separate anode node in electrical contact with each said anode wire;

electrically connecting each said at least one anode node to each anode wire of said anode wires and to an external termination; encapsulating said capacitor body and at least a portion of said anode wires and anode nodes,

forming a metallization layer, wherein said metallization layer is in electrical contact with each said anode node wherein said metallization layer is an external termination; and

forming a cathode external termination in electrical contact with said cathode.

19 . The method of forming a capacitor of claim 18 further comprising forming an encapsulant encasing said capacitor body wherein said metallization layer is on encapsulant surface.

20 . The method of forming a capacitor of claim 18 wherein said anode comprises a metal.

21 . The method of forming a capacitor of claim 20 wherein said metal is a valve metal selected from the group consisting of tantalum, aluminum, niobium, titanium, zirconium, hafnium, alloys thereof and a conductive oxide thereof.

22 . The method of forming a capacitor of claim 18 wherein said anode is fluted.

23 . The method of forming a capacitor of claim 18 wherein said cathode comprises manganese dioxide or a conductive polymer.

24 . The method of forming a capacitor of claim 18 wherein said cathode comprises manganese dioxide or a conductive polymer.

25 . The method of forming a capacitor of claim 24 wherein said conductive polymer is selected from a polyaniline, a polypyrrole or a polythiophene.

26 . The method of forming a capacitor of claim 25 wherein said polythiophene is poly-3,4-ethylenedioxythiophene.

27 . The method of forming a capacitor of claim 18 comprising one anode node in electrical contact with multiple said anode wires.

28 . The method of forming a capacitor of claim 18 comprising no more than 10 said anode wires.

29 . The method of forming a capacitor of claim 28 comprising 3 to 5 said anode wires.

30 . The method of forming a capacitor of claim 18 wherein said anode wires are parallel.

31 . The method of forming a capacitor of claim 18 wherein said anode wires are coplanar.

32 . The method of forming a capacitor of claim 18 wherein said anode wires extend from a common face of said capacitor body.

33 . The method of forming a capacitor of claim 18 wherein said anode wires do not extend from a common face of said capacitor body.

34 . A capacitor comprising:

a capacitor body comprising an anode, a dielectric on said anode and a cathode on said dielectric;

at least two anode wires in electrical contact with said anode and extending from said capacitor body;

at least one anode node or an anode node remnant, wherein each anode wire of said anode wires is in electrical contact with said at least one said anode node or said anode remnant;

an encapsulant encasing said capacitor body;

at least a portion of said at least on anode node or anode node remnant, is in electrical connection with an external termination; and

a cathode external termination in electrical contact with said cathode wherein at least one said anode node is a flexible anode node.

35 . The capacitor of claim 34 wherein said flexible anode node is in electrical contact with multiple said anode wires.

36 . The capacitor of claim 34 wherein said flexible anode node is in electrical contact with all said anode wires.

37 . A method of forming a capacitor comprising:

forming a capacitor body comprising an anode, a dielectric on said anode and a cathode on said dielectric with at least two anode wires in electrical contact with said anode and extending from said capacitor body;

electrically connecting at least one anode node to each anode wire of said anode wires: encapsulating said capacitor body and at least a portion of said anode wires and anode nodes,

forming a metallization layer, wherein said metallization layer is in electrical contact with each said anode node wherein said metallization layer is an external termination; and

forming a cathode external termination in electrical contact with said cathode wherein at least one said anode node is a flexible anode node.

38 . The method of forming a capacitor of claim 37 wherein said flexible anode node is in electrical contact with multiple said anode wires.

39 . The method of forming a capacitor of claim 37 wherein said flexible anode node is in electrical contact with all said anode wires.

40 . A method of forming a capacitor comprising:

forming a capacitor body comprising an anode, a dielectric on said anode and a cathode on said dielectric with at least two anode wires in electrical contact with said anode and extending from said capacitor body;

electrically connecting at least one anode node to each anode wire of said anode wires; encapsulating said capacitor body and at least a portion of said anode wires and anode nodes,

forming a metallization layer, wherein said metallization layer is in electrical contact with each said anode node wherein said metallization layer is an external termination; and

forming a cathode external termination in electrical contact with said cathode further comprising dicing said capacitor prior to said forming said metallization wherein said dicing forms at least one anode node remnant and said metallization is in electrical contact with said anode node remnant.