Connector assembly for sensor device

1 . A connector assembly comprising:

a first connector including a first substrate having conductive traces formed on or in the first substrate and a first electronic component mounted on a first component mount region of the first substrate, the conductive traces of the first connector comprising:

a plurality of first traces and a plurality of second traces, the first electronic component positioned between the plurality of first traces and the plurality of second traces, the plurality of first traces configured to connect to a sensor panel and the plurality of second traces configured to connect to a first external substrate or component; and

a second connector including a second substrate having conductive traces formed on or in the second substrate and a second electronic component mounted on a second component mount region of the second substrate, the conductive traces of the second connector comprising:

a plurality of third traces and a plurality of fourth traces, the second electronic component positioned between the plurality of third traces and the plurality of fourth traces, the plurality of third traces configured to connect to the same sensor panel and the plurality of fourth traces configured to connect to a second external substrate or component,

wherein the first connector and the second connector have different profiles from each other as seen from a top plan view,

wherein the plurality of first traces and the plurality of third traces are configured to connect to adjacent portions of the sensor panel.

2 . The connector assembly of claim 1 , wherein the first external substrate or component and the second external substrate or component are the same external substrate or component.

3 . The connector assembly of claim 2 , wherein the first and second external substrates or components comprise a circuit board.

4 . The connector assembly of claim 1 , wherein the first substrate comprises a first portion and a second portion of a single substrate, the first traces are formed on or in the first portion and the second traces are formed on or in the second portion.

5 . The connector assembly of claim 1 , wherein the first substrate comprises a first portion and a second portion on separate substrates, the first traces are formed on or in the first portion and the second traces are formed on or in the second portion.

6 . The connector assembly of claim 1 , wherein the first substrate and the second substrate comprise flexible substrates.

7 . The connector assembly of claim 6 , wherein the flexible substrates are arranged such that a contour length of the second connector is greater than a contour length of the first connector, while a height of the second connector is equal to a height of the first connector.

8 . The connector assembly of claim 6 , wherein at least a portion of the first substrate is narrower than a width of the first electronic component.

9 . The connector assembly of claim 1 , wherein the first electronic component comprises a charge-to-digital convertor.

10 . The connector assembly of claim 1 , wherein the first traces have a pitch between adjacent traces of no more than about 60 microns.

11 . A sensor system comprising:

a sensor panel;

a circuit board coupled to the sensor panel;

a first connector including a first substrate, a die mounted on a first die mount region of the first substrate, first input pins formed at a first input pin region of the first substrate and connected to the sensor panel, and first output pins formed at a first output pin region of the first substrate and connected to the circuit board, the first input pins and the first output pins spaced apart along a length of the first substrate, a width of the first input pin region being narrower than a width of the first die mount region; and

a second connector including a second substrate, a die mounted on a second die mount region of the second substrate, second input pins formed at a second input pin region of the second substrate and connected to the sensor panel, and second output pins formed at a second output pin region of the second substrate and connected to the circuit board, the second input pins and the second output pins spaced apart along a length of the second substrate, a portion of the first die mount region overlapping a portion of the second die mount region,

wherein the first input pins of the first connector and the second input pins of the second connector are positioned adjacent to each other.

12 . The sensor system of claim 11 , wherein the first substrate and second substrate comprise flexible substrates.

13 . The sensor system of claim 12 , wherein a length of the first connector is greater than a length of the second connector.

14 . The sensor system of claim 12 , wherein a width of the second input pin region being narrower than a width of the second die mount region such that, when projected along a same direction where the portion of the first die mount region and the portion of the second die mount region overlaps, the first input pin region and the second input pin region do not overlap.

15 . The sensor system of claim 11 , wherein the first input pins of the first connector and the second input pins of the second connector are positioned next to and in close proximity to each other, a spacing between a pin of the first input pins closest to the second input pins and a pin of the second input pins closest to the first input pins is in a range of 10 microns to 60 microns.

16 . The sensor system of claim 11 , further comprises a spacer between the first connector and the second connector.

17 . A connector assembly comprising:

a first connector including a first substrate having conductive traces formed on or in the first substrate and a first electronic component mounted on a first component mount region of the first substrate, the conductive traces of the first connector comprising:

a plurality of first input traces and a plurality of first output traces, the first electronic component positioned between the plurality of first input traces and the plurality of first output traces, the plurality of first input traces configured to connect to a sensor panel and the plurality of first output traces configured to connect to a first external substrate or component; and

a second connector including a second substrate having conductive traces formed on or in the second substrate and a second electronic component mounted on a second component mount region of the second substrate, the conductive traces of the second connector comprising:

a plurality of second input traces and a plurality of second output traces, the second electronic component positioned between the plurality of second input traces and the plurality of second output traces, the plurality of second input traces configured to connect to the same sensor panel and the plurality of second output traces configured to connect to a second external substrate or component,

wherein a length of the second connector is greater than a length of the first connector, the first substrate includes a first input pin region at ends of the first input traces, a width of the first input pin region being narrower than a width of the first component mount region, and

wherein the plurality of first input traces and the plurality of second input traces are configured to connect to adjacent portions of the sensor panel.

18 . The connector assembly of claim 17 , wherein the first substrate and the second substrate comprise flexible substrates.

19 . The connector assembly of claim 17 , wherein the first electronic component comprises a charge-to-digital convertor.

20 . The connector assembly of claim 17 , wherein the first traces have a pitch between adjacent traces of no more than about 60 microns.