Laser irradiation head and laser irradiation device
A laser irradiation head includes: a semiconductor laser module including a semiconductor laser element and a lens; a heat sink having a flow path of a refrigerant; and a first pipe connector that a first pipe for supplying the refrigerant to the flow path is attachable to and detachable from. The heat sink has an outer surface including a first area and a second area being in a relationship of intersecting with the first area, the semiconductor laser module is screwed to the heat sink in the first area, and the first pipe connector is screwed to the heat sink in the second area.
1 . A laser irradiation head comprising:
a semiconductor laser module including a semiconductor laser element and a lens;
a heat sink having a flow path of a refrigerant; and
a first pipe connector that a first pipe for supplying the refrigerant to the flow path is attachable to and detachable from,
wherein the heat sink has an outer surface including a first area and a second area being in a relationship of intersecting with the first area,
the semiconductor laser module is screwed to the heat sink in the first area,
the first pipe connector is screwed to the heat sink in the second area,
the semiconductor laser module is configured to emit laser light, in a direction along the first area, toward a side opposite to the second area, and
the first pipe connector extends along a direction intersecting the second area, and is configured such that the first pipe is attachable to and detachable from the first pipe connector from a side opposite to the heat sink in the direction intersecting the second area.
2 . The laser irradiation head according to claim 1 , further comprising:
a second pipe connector that a second pipe for discharging the refrigerant from the flow path is attachable to and detachable from,
wherein the second pipe connector is screwed to the heat sink in the second area.
3 . The laser irradiation head according to claim 1 ,
wherein the heat sink includes a body portion having the first area and the second area, and a lid portion,
the body portion has a recessed portion including the flow path and opening opposite the first area, and
the lid portion is attached to the body portion to close an opening portion of the recessed portion.
4 . The laser irradiation head according to claim 3 ,
wherein the body portion includes a bottom wall portion and a side wall portion defining the recessed portion, and a protrusion portion protruding from the bottom wall portion into the recessed portion, and
the bottom wall portion, the side wall portion, and the protrusion portion are integrally formed.
5 . The laser irradiation head according to claim 4 ,
wherein the semiconductor laser module is screwed to the side wall portion in the first area.
6 . The laser irradiation head according to claim 1 ,
wherein the semiconductor laser module further includes a housing accommodating the semiconductor laser element, and a support member supporting the lens.
7 . The laser irradiation head according to claim 6 ,
wherein the housing and the support member are directly screwed to the heat sink in the first area.
8 . The laser irradiation head according to claim 7 ,
wherein the heat sink has a third surface and a fourth surface being the first area,
the fourth surface is located at a lower position than the third surface,
the housing is disposed on the third surface, and
the support member is disposed on the fourth surface.
9 . A laser irradiation device comprising:
the laser irradiation head according to claim 1 ;
the first pipe having flexibility and connected to the first pipe connector;
a refrigerant supply source configured to supply the refrigerant to the flow path through the first pipe; and
a moving mechanism configured to move the laser irradiation head.
10 . A laser irradiation head comprising:
a semiconductor laser module including a semiconductor laser element and a lens;
a heat sink having a flow path of a refrigerant;
a first pipe connector that a first pipe for supplying the refrigerant to the flow path is attachable to and detachable from; and
an installation member disposed between the heat sink and the semiconductor laser module,
wherein the heat sink has an outer surface including a first area and a second area being in a relationship of intersecting with the first area,
the semiconductor laser module is screwed to the heat sink in the first area,
the first pipe connector is screwed to the heat sink in the second area,
the semiconductor laser module further includes a housing accommodating the semiconductor laser element, and a support member supporting the lens, and
the housing and the support member are screwed to the heat sink in the first area with the installation member interposed therebetween.
11 . The laser irradiation head according to claim 10 ,
wherein the installation member has a first surface and a second surface parallel to the first area,
the second surface is located at a lower position than the first surface,
the housing is disposed on the first surface, and
the support member is disposed on the second surface.
12 . The laser irradiation head according to claim 10 , further comprising:
a Peltier element disposed between the heat sink and the installation member.