IP Library Granted Patent US 12700712
Granted Patent B2
US 12700712 · App. 17/914,456 · Granted Aug 4, 2026

Quantum cascade laser element and quantum cascade laser device

Inventors: Atsushi Sugiyama (Hamamatsu, JP); Shinichi Furuta (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
H01S5/02461H01S5/04254H01S5/0654H01S5/2205H01S5/223H01S5/3402H01S5/34313H01S5/12H01S5/2224H01S5/2275H01S2301/166
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Quick Facts
Patent No.
US 12700712
App. No.
17/914,456
Granted
Aug 4, 2026
Kind
B2
Abstract

A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion along a width direction of a semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion. A surface of the first portion has a first inclined surface inclined with respect to the side surface to go away from the side surface as going away from the semiconductor substrate, and a second inclined surface located opposite to the semiconductor substrate with respect to the first inclined surface and inclined with respect to a center line to approach the center line as going away from the semiconductor substrate. The metal layer extends over the first inclined surface and the second inclined surface.

Claims (24)

1 . A quantum-cascade laser element comprising:

a semiconductor substrate;

a semiconductor laminate formed on the semiconductor substrate to include a ridge portion that is configured to include an active layer having a quantum-cascade structure and that extends along a light waveguide direction;

an embedding layer including a first portion formed on a side surface of the ridge portion, and a second portion extending from an edge portion of the first portion on a side of the semiconductor substrate along a width direction of the semiconductor substrate; and

a metal layer formed at least a top surface of the ridge portion and on the first portion,

wherein when viewed in the light waveguide direction, a surface of the first portion on a side opposite to the ridge portion includes:

a first inclined surface inclined with respect to the side surface of the ridge portion to go away from the side surface of the ridge portion as going away from the semiconductor substrate; and

a second inclined surface located on a side opposite to the semiconductor substrate with respect to the first inclined surface and inclined with respect to a center line to approach the center line as going away from the semiconductor substrate, the center line passing through a center of the ridge portion and being parallel to a thickness direction of the semiconductor substrate, wherein the second inclined surface is farther from the substrate than the first inclined surface while being on a same side of the semiconductor substrate, and

the metal layer extends over the first inclined surface and the second inclined surface so as to include a surface that extends along the first inclined surface and the second inclined surface and overlaps with the first inclined surface and the second inclined surface in a width direction of the ridge portion that is perpendicular to the center line.

2 . The quantum-cascade laser element according to claim 1 ,

wherein the second inclined surface is inclined with respect to the side surface of the ridge portion to approach the side surface of the ridge portion as going away from the semiconductor substrate.

3 . The quantum-cascade laser element according to claim 1 ,

wherein when viewed in the light waveguide direction, the side surface of the ridge portion is inclined with respect to the center line to approach the center line as going away from the semiconductor substrate.

4 . The quantum-cascade laser element according to claim 1 ,

wherein when viewed in the width direction of the semiconductor substrate, a part of the metal layer on the first inclined surface overlaps the active layer.

5 . The quantum-cascade laser element according to claim 1 ,

wherein, in the thickness direction of the semiconductor substrate, a surface of the second portion on a side opposite to the semiconductor substrate is located between a surface of the active layer on a side opposite to the semiconductor substrate and a surface of the active layer on a side of the semiconductor substrate.

6 . The quantum-cascade laser element according to claim 1 ,

wherein a thickness of the first portion is thinner than a thickness of the second portion.

7 . The quantum-cascade laser element according to claim 1 ,

wherein the first portion protrudes from the top surface of the ridge portion to a side opposite to the semiconductor substrate in the thickness direction of the semiconductor substrate.

8 . A quantum-cascade laser device comprising:

the quantum-cascade laser element according to claim 1 ; and

a drive unit that drives the quantum-cascade laser element.