IP Library Granted Patent US 12701308
Granted Patent B2
US 12701308 · App. 18/490,818 · Granted Aug 4, 2026

Tamper disablement system

Inventors: Thomas E. Blake, III (Novi, MI); Grzegorz Ciosk (Tychy, PL); Gregory Ratcliffe (Taylor, MI)
Assignee: ZF Friedrichshafen AG
H04N23/52H05K5/0208H05K5/0247
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Quick Facts
Patent No.
US 12701308
App. No.
18/490,818
Granted
Aug 4, 2026
Kind
B2
Abstract

A tamper disablement system is disclosed. The tamper disablement system can include a conductive layer having a first terminal and a second terminal. The tamper disablement system can also include an enclosure contact in electrical connection with the first terminal and the second terminal to form a closed-loop circuit and a controller. The controller is configured transmit an electrical signal via the conductive layer and detect the electrical signal within the closed-loop circuit, wherein the controller is configured to transmit a terminate signal when the controller detects a change in electrical properties of the electrical signal.

Claims (31)

1 . A tamper disablement system, comprising:

a conductive layer having a first terminal and a second terminal;

an enclosure contact in electrical connection with the first terminal and the second terminal to form a closed-loop circuit;

a lens assembly, the lens assembly including a base portion and a lens barrel portion, wherein the base portion includes the enclosure contact; and

a controller that is configured to transmit an electrical signal via the conductive layer and detect the electrical signal within the closed-loop circuit, wherein the controller is configured to transmit a terminate signal when the controller detects a change in electrical properties of the electrical signal.

2 . The tamper disablement system as recited in claim 1 , further comprising a switch that is configured to transition between an open state and closed state, wherein the terminate signal causes the switch to transition from the open state to the closed state.

3 . The tamper disablement system as recited in claim 2 , further comprising a fuse, wherein the controller is further configured to provide an electrical current to the fuse when the switch is transitioned to the closed state, wherein the fuse disables functionality of an image sensor when the fuse receives the electrical current.

4 . The tamper disablement system as recited in claim 3 , further comprising a printed circuit board assembly, the printed circuit board assembly including the fuse.

5 . The tamper disablement system as recited in claim 4 , wherein the printed circuit board assembly comprises a multilayer substrate.

6 . The tamper disablement system as recited in claim 5 , wherein the multilayer substrate comprises at least one dielectric layer and at least one conductive layer.

7 . The tamper disablement system as recited in claim 6 , wherein the at least one dielectric layer includes the fuse.

8 . The tamper disablement system as recited in claim 1 , further comprising an electronic control unit operably connected to the controller, wherein the electronic control unit disables functionality of an image sensor in response to receiving the terminate signal.

9 . A tamper disablement system, comprising:

a conductive layer having a first terminal and a second terminal;

an enclosure contact in electrical connection with the first terminal and the second terminal to form a closed-loop circuit;

a lens assembly, the lens assembly including the enclosure contact; and

a controller that is configured to transmit an electrical signal via the conductive layer and detect the electrical signal within the closed-loop circuit, wherein the controller is configured to transmit a terminate signal when the controller detects a change in electrical properties of the electrical signal.

10 . The tamper disablement system as recited in claim 9 , further comprising a switch that is configured to transition between an open state and closed state, wherein the terminate signal causes the switch to transition from the open state to the closed state.

11 . The tamper disablement system as recited in claim 10 , further comprising a fuse, wherein the controller is further configured to provide an electrical current to the fuse when the switch is transitioned to the closed state, wherein the fuse disables functionality of an image sensor when the fuse receives the electrical current.

12 . The tamper disablement system as recited in claim 11 , further comprising a printed circuit board assembly, the printed circuit board assembly including the fuse.

13 . The tamper disablement system as recited in claim 12 , wherein the printed circuit board assembly comprises a multilayer substrate.

14 . The tamper disablement system as recited in claim 13 , wherein the multilayer substrate comprises at least one dielectric layer and at least one conductive layer.

15 . The tamper disablement system as recited in claim 14 , wherein the at least one dielectric layer includes the fuse.

16 . The tamper disablement system as recited in claim 9 , further comprising an electronic control unit operably connected to the controller, wherein the electronic control unit disables functionality of an image sensor in response to receiving the terminate signal.

17 . A tamper disablement system, comprising:

a conductive layer having a first terminal and a second terminal;

an enclosure contact in electrical connection with the first terminal and the second terminal to form a closed-loop circuit;

a lens assembly, the lens assembly including the enclosure contact; and

a controller that is configured to transmit an electrical signal via the conductive layer and detect the electrical signal within the closed-loop circuit, wherein the controller is configured to provide an electrical current to a fuse that disables functionality of an image sensor.

18 . The tamper disablement system as recited in claim 17 , further comprising a printed circuit board assembly that includes the fuse, the printed circuit board assembly comprising a multilayer substrate.

19 . The tamper disablement system as recited in claim 18 , wherein the fuse is disposed within at least one layer of the multilayer substrate.