Multifunctional heatsink
An image capture device that includes a housing; a heat generating component enclosed by internal surfaces of the housing; and a first heatsink and a second heatsink that are each simultaneously and thermally connected with the heat generating component. One or both of the first and second heatsinks positioned on an external surface of the housing.
1 . An image capture device, comprising:
a housing;
a circuit board comprising a heat generating component;
a primary heatsink positioned between the housing and the circuit board, wherein the primary heatsink is free of contact with the circuit board; and
a gasket that connects the primary heatsink and the circuit board and electromagnetically insulates the heat generating component and other components of the image capture device.
2 . The image capture device of claim 1 , wherein further comprising:
a secondary heatsink thermally connected with the heat generating component or the primary heatsink, the secondary heatsink positioned on an external surface of the housing.
3 . The image capture device of claim 2 , wherein the secondary heatsink is configured as an interconnect mechanism.
4 . The image capture device of claim 2 , wherein the secondary heatsink extends along multiple of the external surfaces of the housing and through a channel of the housing to the heat generating component or the primary heatsink, and wherein at least some of the housing physically separates the secondary heatsink and the primary heatsink so that heat is dissipated from the heat generating component to the external surface of the housing.
5 . The image capture device of claim 4 , wherein the secondary heatsink comprises fins that extend from the external surface of the housing.
6 . The image capture device of claim 2 , wherein the secondary heatsink is thermally connected with an image sensor that is configured to generate heat.
7 . An image capture device, comprising:
a heat generating component;
an internal heatsink thermally connected with the heat generating component and configured to thermally interface with an interconnect mechanism, the interconnect mechanism located external of the image capture device and configured to dissipate heat from the heat generating component and/or the internal heatsink; and
a conductor configured to thermally connect the interconnect mechanism and the internal heatsink.
8 . The image capture device of claim 7 , further comprising:
an audio component integrated with the interconnect mechanism.
9 . The image capture device of claim 8 , wherein the interconnect mechanism includes arms that fold about hinges and are configured to connect with a mount, and wherein the audio component is integrated at a location of one of the arms when the one of the arms is in a folded position and open to an external environment when the one of the arms in an open position.
10 . The image capture device of claim 7 , further comprising:
a housing that encloses the heat generating component and the internal heatsink.
11 . The image capture device of claim 10 , wherein the conductor is integrated with the housing.
12 . The image capture device of claim 7 , wherein the interconnect mechanism comprises two or more flanges that are rotatable relative to each other.
13 . The image capture device of claim 7 , wherein the interconnect mechanism is rotatable outside of an external surface of the image capture device.
14 . The image capture device of claim 7 , wherein the interconnect mechanism is configured to connect with an external accessory.
15 . An image capture device, comprising:
a housing;
a heat generating component;
a first heatsink connected with the heat generating component;
a second heatsink located between the housing and the first heatsink; and
a gasket located between and interfaced with the first heatsink and the second heatsink.
16 . The image capture device of claim 15 , further comprising:
a thermal interface material positioned between the gasket and the first heatsink and/or second heatsink.
17 . The image capture device of claim 15 , wherein the heat generating component comprises one or more of a processor, a system on a chip, a sensor, a battery, or any combination thereof.
18 . The image capture device of claim 15 , wherein the housing encloses the heat generating component, the first heatsink, the second heatsink, and/or the gasket.
19 . The image capture device of claim 18 , wherein the heat generating component is configured to connect with a third heatsink.
20 . The image capture device of claim 15 , further comprising:
a lens extended from the housing.