Speaker module structure and electronic device including the same
A speaker module structure according to various embodiments may include a first structure, a second structure configured to couple to the first structure, and a speaker coupled to at least one of the first structure or the second structure, wherein the second structure comprises at least one groove configured to form a resonance space by coupling between the first structure and the second structure, the resonance space is connected to the speaker and has an adsorption material injected therein, and when the first structure and the second structure are coupled, one end of the groove comprises an opening formed in a closed loop comprising a part of the first structure and a part of the second structure.
1 . A speaker module structure comprising:
a first structure;
a second structure configured to couple to the first structure to form a resonance space;
a speaker connected to the resonance space and coupled to at least one of the first structure or the second structure; and
an opening connected to the resonance space,
wherein at least one of the first structure or the second structure comprises at least one groove configured to form the resonance space,
wherein an adsorption material is disposed in the resonance space,
wherein the opening is configured for injecting the adsorption material into the resonance space, and
wherein the opening, configured for injecting the adsorption material into the resonance space, is formed by a coupling structure between the first structure and the second structure.
2 . The speaker module structure of claim 1 , further comprising:
a first sealing member configured to close the opening.
3 . The speaker module structure of claim 2 , wherein the first sealing member is disposed along a peripheral portion of the opening.
4 . The speaker module structure of claim 2 , further comprising:
a second sealing member configured to surround the first sealing member.
5 . The speaker module structure of claim 4 , wherein the second sealing member comprises at least one of a eutectic bond or a polymer adhesive.
6 . The speaker module structure of claim 1 , further comprising:
a sound absorption sheet disposed on at least one surface of the first structure or the second structure in the resonance space.
7 . The speaker module structure of claim 6 , wherein the sound absorption sheet comprises at least one of polyurethane, rubber, or silicone.
8 . The speaker module structure of claim 1 , wherein the opening comprises a “T”-shape.
9 . The speaker module structure of claim 8 ,
wherein a first part of the opening formed by the first structure comprises a horizontal portion of the “T”-shape and a first part of a vertical portion of the “T”-shape that is connected to the horizontal portion, and
wherein a second part of the opening formed by the second structure comprises a second part of the vertical portion that is connected to the first part of the vertical portion.
10 . The speaker module structure of claim 1 , wherein a space compensation material is disposed in a remaining space adjacent to the opening that remains after the adsorption material is injected into the resonance space.
11 . The speaker module structure of claim 10 , wherein the space compensation material comprises at least one of zeolite, sponge, cotton, or foamed resin.
12 . An electronic device comprising:
a speaker assembly including:
a first carrier,
a second carrier configured to couple to the first carrier to form a resonance space,
a speaker connected to the resonance space and coupled to at least one of the first carrier or the second carrier, and
an opening connected to the resonance space,
wherein at least one of the first carrier or the second carrier comprises at least one groove configured to form the resonance space,
wherein an adsorption material is disposed in the resonance space,
wherein the opening is configured for injecting the adsorption material into the resonance space, and
wherein the opening, configured for injecting the adsorption material into the resonance space, is formed by a coupling structure between the first carrier and the second carrier.
13 . The electronic device of claim 12 , wherein the speaker assembly further includes a first sealing member configured to close the opening.
14 . The electronic device of claim 13 , wherein the first sealing member is disposed along a peripheral portion of the opening.
15 . The electronic device of claim 13 , wherein the speaker assembly further includes a second sealing member configured to surround the first sealing member.
16 . The electronic device of claim 15 , wherein the second sealing member comprises at least one of a eutectic bond or a polymer adhesive.
17 . The electronic device of claim 12 , wherein the speaker assembly further includes a sound absorption sheet disposed on at least one surface of the first carrier or the second carrier in the resonance space.
18 . The electronic device of claim 17 , wherein the sound absorption sheet comprises at least one of polyurethane, rubber, or silicone.
19 . The electronic device of claim 12 , wherein the opening comprises a “T”-shape.
20 . The electronic device of claim 19 ,
wherein a first part of the opening formed by the first carrier comprises a horizontal portion of the “T”-shape and a first part of a vertical portion of the “T”-shape that is connected to the horizontal portion, and
wherein a second part of the opening formed by the second carrier comprises a second part of the vertical portion that is connected to the first part of the vertical portion.
21 . The electronic device of claim 12 , wherein a space compensation material is disposed in a remaining space adjacent to the opening that remains after the adsorption material is injected into the resonance space.
22 . The electronic device of claim 21 , wherein the space compensation material comprises at least one of zeolite, sponge, cotton, or foamed resin.