Efficient thermal management for vertical power delivery
Assemblies, systems, and methods are provided for dissipating heat from a PCB assembly. The PCB assembly may include a PCB comprising a first thermally conductive structure. A first heat generating component may be connected to the PCB and may be vertically disposed with respect to the PCB. The PCB may be disposed on a first side of the first heat generating component. The first thermally conductive structure may be configured to conduct heat laterally and cross-sectionally through the first thermally conductive structure toward a heat sink. A second thermally conductive structure may be disposed on a second side of the first heat generating component. The second thermally conductive structure may be configured to conduct heat laterally and cross-sectionally through the second thermally conductive structure into a heat sink. A heat sink configured to dissipate heat may be disposed between the first thermally conductive structure and the second thermally conductive structure.
1 . A system for dissipating heat from a printed circuit board (PCB) assembly comprising:
a first thermally conductive structure directly contacting a first side of a first heat generating component;
a second thermally conductive structure directly contacting a second side of the first heat generating component; and
a heat sink disposed between the first thermally conductive structure and the second thermally conductive structure,
wherein the heat sink comprises a first planar portion, a second planar portion, and fins extending therebetween,
wherein the first thermally conductive structure is configured to draw heat from the first side of the first heat generating component and conduct the heat from the first side of the first heat generating component laterally and cross-sectionally through the first thermally conductive structure toward the first planar portion of the heat sink,
wherein the second thermally conductive structure is disposed fully below a surface of the second side of the first heat generating component and fully below the heat sink,
wherein the second thermally conductive structure is configured to draw heat from the second side of the first heat generating component and conduct the heat from the second side of the first heat generating component laterally and cross-sectionally through the second thermally conductive structure toward the second planar portion of the heat sink, and
wherein the heat sink is configured to dissipate the heat from the first side of the first heat generating component and the heat from the second side of the first heat generating component.
2 . The system of claim 1 , wherein the first thermally conductive structure is at least partially embedded in a PCB.
3 . The system of claim 2 , wherein the first thermally conductive structure comprises:
a first thermal plane configured for conducting the heat from the first side of the first heat generating component laterally through the first thermally conductive structure;
a second thermal plane disposed proximate the first planar portion of the heat sink, wherein the second thermal plane is configured for conducting the heat from the first side of the first heat generating component toward the first planar portion of the heat sink; and
a plurality of thermal vias extending through a thickness of the PCB and connecting the first thermal plane to the second thermal plane.
4 . The system of claim 3 , wherein the first thermal plane comprises copper.
5 . The system of claim 3 , wherein the second thermal plane comprises a plurality of thermally conductive layers of graphene and copper in alternating layers.
6 . The system of claim 1 , wherein the second thermally conductive structure comprises a composite structure including a plurality of thermally conductive layers.
7 . The system of claim 6 , wherein at least one layer of the plurality of thermally conductive layers comprises graphene.
8 . The system of claim 6 , wherein the second thermally conductive structure comprises a support structure, wherein the support structure comprises a planar material attached to the composite structure to stabilize the composite structure.
9 . The system of claim 1 , wherein a surface of the first thermally conductive structure distal from the second thermally conductive structure is configured to receive a second heat generating component.
10 . The system of claim 9 , wherein the first thermally conductive structure is configured to be in thermal communication with the second heat generating component via a plurality of solder bumps.
11 . The system of claim 9 , wherein the heat sink is a first heat sink, wherein the system further comprises a second heat sink disposed on an opposite side of the second heat generating component with respect to the first thermally conductive structure, wherein the second heat sink is in thermal communication with the second heat generating component.
12 . The system of claim 1 , wherein the first heat generating component is a power supply, wherein a second heat generating component is a graphics processing unit (GPU), and wherein the PCB assembly is configured for vertical power delivery.
13 . A PCB assembly comprising:
a PCB comprising a first thermally conductive structure;
a first heat generating component connected to the PCB and vertically disposed with respect to the PCB, wherein the PCB is disposed on a first side of the first heat generating component, and wherein the first thermally conductive structure is directly contacting the first side of the heat generating component;
a second thermally conductive structure directly contacting a second side of the first heat generating component; and
a heat sink disposed between the first thermally conductive structure and the second thermally conductive structure,
wherein the heat sink comprises a first planar portion, a second planar portion, and fins extending therebetween,
wherein the first thermally conductive structure is configured to draw heat from the first side of the first heat generating component and conduct the heat from the first side of the first heat generating component laterally and cross-sectionally through the first thermally conductive structure toward the first planar portion of the heat sink,
wherein the second thermally conductive structure is disposed fully below a surface of the second side of the first heat generating component and fully below the heat sink,
wherein the second thermally conductive structure is configured to draw heat from the second side of the first heat generating component and conduct the heat from the second side of the first heat generating component laterally and cross-sectionally through the second thermally conductive structure toward the second planar portion of the heat sink, and
wherein the heat sink is configured to dissipate the heat from the first side of the first heat generating component and the heat from the second side of the first heat generating component.
14 . The PCB assembly of claim 13 , wherein the first thermally conductive structure comprises:
a first thermal plane configured for conducting the heat from the first side of the first heat generating component laterally through the first thermally conductive structure;
a second thermal plane disposed proximate the first planar portion of the heat sink, wherein the second thermal plane is configured for conducting the heat from the first side of the first heat generating component toward the first planar portion of the heat sink; and
a plurality of thermal vias extending through a thickness of the PCB and connecting the first thermal plane to the second thermal plane.
15 . The PCB assembly of claim 13 , wherein the second thermally conductive structure comprises a composite structure including a plurality of thermally conductive layers.
16 . The PCB assembly of claim 13 , wherein the first heat generating component is a power supply, wherein the power supply is disposed on a first side of the PCB, wherein the PCB assembly further comprises a GPU disposed on a second side of the PCB, such that the PCB assembly is configured for vertical power delivery.
17 . The PCB assembly of claim 16 , wherein the heat sink is a first heat sink, wherein the PCB assembly further comprises a second heat sink disposed on an opposite side of the GPU with respect to the first thermally conductive structure.
18 . A method of manufacturing a PCB assembly comprising:
providing a PCB, wherein the PCB comprises a first thermally conductive structure;
connecting a first heat generating component to the PCB, wherein the first heat generating component is vertically disposed with respect to the PCB, wherein the PCB is disposed on a first side of the first heat generating component, and wherein the first thermally conductive structure is directly contacting the first side of the heat generating component;
disposing a second thermally conductive structure on a second side of the heat generating component such that the second thermally conductive structure is directly contacting the second side of the heat generating component; and
attaching a heat sink between the first thermally conductive structure and the second thermally conductive structure,
wherein the heat sink comprises a first planar portion, a second planar portion, and fins extending therebetween,
wherein the first thermally conductive structure is configured to draw heat from the first side of the first heat generating component and conduct the heat from the first side of the first heat generating component laterally and cross-sectionally through the first thermally conductive structure toward the first planar portion of the heat sink,
wherein the second thermally conductive structure is disposed fully below a surface of the second side of the first heat generating component and fully below the heat sink,
wherein the second thermally conductive structure is configured to draw heat from the second side of the first heat generating component and conduct the heat from the second side of the first heat generating component laterally and cross-sectionally through the second thermally conductive structure toward the second planar portion of the heat sink, and
wherein the heat sink is configured to dissipate the heat from the first side of the first heat generating component and the heat from the second side of the first heat generating component.
19 . The method of claim 18 , wherein providing the PCB comprises embedding the first thermally conductive structure within the PCB by embedding a first thermal plane, a second thermal plane, and a plurality of thermal vias through a thickness of the PCB to connect the first thermal plane to the second thermal plane.
20 . The method of claim 18 , wherein the first heat generating component is a power supply, wherein the power supply is disposed on a first side of the PCB, wherein the PCB assembly further comprises a GPU disposed on a second side of the PCB, such that the PCB assembly is configured for vertical power delivery.