Printed circuit board

1 . A printed circuit board comprising:

a first wiring portion including a plurality of first wirings;

a first integrated circuit chip connected to one side of the first wiring portion, the first integrated circuit chip configured to convert N signals into one signal, wherein N is a natural number;

a second integrated circuit chip connected to an opposite side of the first wiring portion, the second integrated circuit chip configured to convert one signal into N signals;

a second-first wiring portion connected to the first integrated circuit chip, the second-first wiring portion including a plurality of second-first wirings; and

a second-second wiring portion connected to the second integrated circuit chip, the second-second wiring portion including a plurality of second-second wirings,

wherein X and Y1 satisfy Y1/N<X, in which X is the number of the plurality of first wirings and Y1 is the number of the plurality of second-first wirings.

2 . The printed circuit board of claim 1 , wherein X and Y2 satisfy Y2/N<X, in which Y2 is the number of the plurality of second-second wirings.

3 . The printed circuit board of claim 1 , wherein at least one wiring, among the plurality of first wirings, is open, such that the first integrated circuit chip and the second integrated circuit chip are not connected to each other through the at least one wiring.

4 . The printed circuit board of claim 3 , wherein, when X, Y1, and Z satisfy Y1/N≤X-Z, in which Z is the number of open first wirings, among the plurality of first wirings.

5 . The printed circuit board of claim 1 , wherein, at least two wirings, among the plurality of first wirings, are shorted to each other, such that the shorted wirings does not serve as a path between the first integrated circuit chip and the second integrated circuit chip.

6 . The printed circuit board of claim 1 , further comprising:

a first insulating portion,

wherein the first wiring portion, the second-first wiring portion, and the second-second wiring portion are respectively disposed on or in the first insulating portion.

7 . The printed circuit board of claim 6 , wherein the first integrated circuit chip and the second integrated circuit chip are respectively disposed on the first insulating portion.

8 . The printed circuit board of claim 6 , wherein

the first insulating portion includes a plurality of first insulating layers, and a cavity penetrating at least a portion of the plurality of first insulating layers, and

the first integrated circuit chip is disposed in the cavity.

9 . The printed circuit board of claim 8 , further comprising:

a connection member connecting the first integrated circuit chip and the second-first wiring portion to each other; and

another connection member connecting the first integrated circuit chip and the first wiring portion to each other.

10 . The printed circuit board of claim 6 , wherein

the first insulating portion includes a core layer having a through-portion, and

the first integrated circuit chip and the second integrated circuit chip are disposed in the through-portion.

11 . The printed circuit board of claim 10 , wherein

the first wiring portion includes a plurality of first vias penetrating at least a portion of the first insulating portion to connect the plurality of first wirings and the first integrated circuit chip or the second integrated circuit chip to each other, and

the first integrated circuit chip and the plurality of first wirings, and the second integrated circuit chip and the plurality of first wirings are respectively connected to each other through the first vias.

12 . The printed circuit board of claim 1 , wherein

the first integrated circuit chip includes a demultiplexer (DEMUX) circuit, and

the second integrated circuit chip includes a multiplexer (MUX) circuit.

13 . The printed circuit board of claim 1 , further comprising:

a first semiconductor chip connected to the second-first wiring portion; and

a second semiconductor chip connected to the second-second wiring portion.

14 . The printed circuit board of claim 13 , wherein

the first semiconductor chip and the first integrated circuit chip are connected to each other through the second-first wiring portion to have a shortest path therebetween, and

the second semiconductor chip and the second integrated circuit chip are connected to each other through the second-second wiring portion to have a shortest path therebetween.

15 . A printed circuit board comprising:

a first insulating portion including a plurality of first insulating layers, and a plurality of cavities respectively penetrating a portion of the plurality of first insulating layers;

a first integrated circuit chip mounted in one cavity, among the plurality of cavities, the first integrated circuit chip including a demultiplexer (DEMUX) circuit;

a second integrated circuit chip mounted in another cavity, among the plurality of cavities, the second integrated circuit chip including a multiplexer (MUX) circuit;

a second insulating portion disposed across a portion of the first integrated circuit chip and a portion of the second integrated circuit chip; and

a first wiring portion disposed on or in the second insulating portion, the first wiring portion connecting the first integrated circuit chip and the second integrated circuit chip to each other,

wherein the first wiring portion includes a plurality of first wirings, and

at least one wiring, among the plurality of first wirings, is open, or at least two wirings, among the plurality of first wirings, are shorted to each other, such that the open or shorted wirings do not serve as a path between the first integrated circuit chip and the second integrated circuit chip.

16 . The printed circuit board of claim 15 , further comprising:

a first semiconductor chip disposed across another portion of the first integrated circuit chip and a first portion of the first insulating portion; and

a second semiconductor chip disposed across another portion of the second integrated circuit chip and a second portion of the first insulating portion.

17 . A printed circuit board comprising:

a first insulating portion including a plurality of first insulating layers, and a plurality of cavities respectively penetrating a portion of the plurality of first insulating layers;

a first integrated circuit chip disposed in one cavity, among the plurality of cavities;

a second integrated circuit chip disposed in another cavity, among the plurality of cavities;

a second insulating portion disposed across a portion of the first integrated circuit chip and a portion of the second integrated circuit chip; and

a wiring portion disposed on or in the second insulating portion, the wiring portion including a plurality of wirings to connect the first integrated circuit chip and the second integrated circuit chip to each other,

wherein signal transmission between the first integrated circuit chip and the second integrated circuit chip is performed by bypassing a defective wiring among the plurality of wirings to a dummy wiring among the plurality of wirings through lane shifting.

18 . The printed circuit board of claim 17 , wherein the signal transmission between the first integrated circuit chip and the second integrated circuit chip through other wirings other than the defective wiring among the plurality of wirings is maintained.

19 . The printed circuit board of claim 17 , wherein one or more wirings among the plurality of wirings are disposed in a region between the defective wiring and the dummy wiring.

20 . The printed circuit board of claim 17 , wherein

the wiring portion includes a plurality of first vias penetrating at least a portion of the first insulating portion to connect the plurality of wirings and the first integrated circuit chip or the second integrated circuit chip to each other, and

the first integrated circuit chip and the plurality of wirings, and the second integrated circuit chip and the plurality of wirings are respectively connected to each other through the first vias.