Printed circuit board, manufacturing method thereof, and battery pack including the same
A printed circuit board includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer. When welding a metal tab onto the solder resist layer, a welding portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welding portion.
1 . A printed circuit board comprising:
an inner layer;
a first insulating layer disposed on an upper part of the inner layer;
a first copper foil layer disposed on an upper part of the first insulating layer;
a solder resist layer disposed on an upper part of the first copper foil layer and defining a gap extending from an upper surface of the solder resist layer to a lower surface of the solder resist layer; and
a metal tab disposed on the upper surface of the solder resist layer,
wherein the metal tab includes a welding portion that extends from the upper surface of the solder resist layer through the gap so as to electrically couples the metal tab and the first copper foil layer.
2 . The printed circuit board according to claim 1 , wherein:
the gap is defined by a distance that the metal tab and the first copper foil layer are spaced apart from each other.
3 . The printed circuit board according to claim 1 , wherein:
a part of the solder resist layer or all of the solder resist layer is configured to be removed during the welding, so as to form the gap.
4 . The printed circuit board according to claim 1 , wherein:
the gap is in a range of 50 μm to 200 μm.
5 . The printed circuit board according to claim 1 , wherein:
the solder resist layer covers an entire surface of the first copper foil layer.
6 . The printed circuit board according to claim 1 , wherein:
the solder resist layer covers a part of the first copper foil layer.
7 . The printed circuit board according to claim 6 , wherein:
the solder resist layer covers an outer edge part of the first copper foil layer.
8 . The printed circuit board according to claim 7 , wherein:
an outer perimeter of the solder resist layer is larger than an outer perimeter of the first copper foil layer.
9 . The printed circuit board according to claim 1 , wherein:
an area of the solder resist layer is smaller than or equal to an area of the metal tab.
10 . The printed circuit board according to claim 1 , wherein:
an area of the first copper foil layer is smaller than an area of the metal tab.
11 . A battery pack comprising the printed circuit board as set forth in claim 1 .
12 . A manufacturing method of a printed circuit board, the method comprising the steps of:
disposing a first insulating layer on an upper part of an inner layer;
disposing a first copper foil layer on an upper part of the first insulating layer;
disposing a solder resist layer on an upper part of the first copper foil layer; and
welding a metal tab of the solder resist layer such that a welding portion of the metal tab extends from an upper part of the solder resist layer through a gap defined as an opening between the upper part of the solder resist layer and a lower part of the solder resist layer,
wherein the welding portion electrically couples the metal tab and the first copper foil layer.
13 . The manufacturing method of a printed circuit board according to claim 12 , wherein:
the gap is defined by a distance that the metal tab and the first copper foil layer are spaced apart from each other.
14 . The manufacturing method of a printed circuit board according to claim 12 , wherein:
in the welding of the metal tab, a part of the solder resist layer or all of the solder resist layer is removed to form the gap.
15 . The manufacturing method of a printed circuit board according to claim 12 , wherein:
the gap is in a range of 50 μm to 200 μm.
16 . The manufacturing method of a printed circuit board according to claim 12 ,
wherein:
the solder resist layer covers an entire surface of the first copper foil layer.
17 . The manufacturing method of a printed circuit board according to claim 12 ,
wherein:
the solder resist layer covers a part of the first copper foil layer.
18 . The manufacturing method of a printed circuit board according to claim 17 ,
wherein:
the solder resist layer covers an outer edge part of the first copper foil layer.