Circuit board module and method for manufacturing same
A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.
1 . An electronic device comprising:
a housing comprising a front side and a rear side; and
a circuit board module, provided in the housing between the front side and the rear side, the circuit board module comprising:
a first printed circuit board (PCB);
a second PCB comprising an inlet;
an interposer configured to electrically connect the first PCB and the second PCB, and providing a space between the first PCB and the second PCB; and
a filler provided in the space and configured to dissipate heat,
wherein the inlet is configured such that the filler is injectable through the inlet,
wherein the electronic device further comprises a second opening on at least one of the first PCB, the second PCB, or the interposer, the second opening being configured to allow air to be exhausted from the space while the filler is being injected into the space, and
wherein the second opening is at a position at which no filler is provided.
2 . The electronic device of claim 1 , wherein the first PCB comprises a first side and a second side opposite the first side,
wherein the second side of the first PCB faces the second PCB,
wherein the filler is provided on at least a portion of the second side of the first PCB,
wherein the electronic device further comprises a heat source provided on a portion of the first side of the first PCB, and
wherein the portion of the first side of the first PCB where the heat source is provided is opposite to the at least the portion of the second side of the first PCB wherein the filler is provided.
3 . The electronic device of claim 2 , further comprising:
a support member provided between the front side and the rear side; and
a display provided between the front side and the support member,
wherein the circuit board module is provided between the support member and the rear side, and
wherein the first side of the first PCB faces the support member.
4 . The electronic device of claim 2 , wherein the filler comprises a thermal interface material (TIM) configured to dissipate heat generated by the heat source.
5 . The electronic device of claim 2 , wherein the heat source comprises at least one of a power management integrated circuit, a power amplifier, an application processor, a communication processor, a charger integrated circuit, a display driver integrated circuit, or a communication circuit.
6 . The electronic device of claim 1 , further comprising:
at least one component provided on the second side of the first PCB and that generates heat.
7 . The electronic device of claim 1 , further comprising:
a sealing member at least partially covering the inlet.
8 . The electronic device of claim 7 , wherein the sealing member comprises an insertion area configured to allow a nozzle for injecting the filler to be inserted into the inlet.
9 . The electronic device of claim 8 , wherein the insertion area is configured to be expanded when pressure is applied, and configured to be restored and substantially seal the inlet when the pressure is removed.
10 . The electronic device of claim 8 , wherein the insertion area is slit-shaped.
11 . The electronic device of claim 8 , wherein the sealing member comprises a deformation-resistant area on a top surface thereof configured to prevent deformation of the sealing member, and
wherein the deformation-resistant area overlaps the insertion area or is provided adjacent to the insertion area.
12 . The electronic device of claim 1 , further comprising a first opening configured to allow air to be introduced into the space therethrough.
13 . The electronic device of claim 12 , wherein the first opening and the second opening are provided on the second PCB.