Solder reflow apparatus and method of manufacturing an electronic device

1 . A method of manufacturing an electronic device, the method comprising:

providing a substrate having a plurality of mounting regions on which electronic components are mounted respectively;

forming a plurality of vapor passage holes that penetrate the substrate entirely from a bottom surface of the substrate to a top surface of the substrate;

disposing the electronic components on the substrate via bumps;

heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state;

supplying at least a portion of the second heat transfer fluid in the vapor state through at least one of the plurality of vapor passage holes of the substrate; and

soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state,

wherein the plurality of vapor passage holes are formed in a cutting region that is disposed around the plurality of mounting regions.

2 . The method of claim 1 , wherein the forming the plurality of vapor passage holes comprises:

forming a first set of the plurality of vapor passage holes in a first region of the substrate; and

forming a second set of the plurality of vapor passage holes in a second region of the substrate.

3 . The method of claim 2 , wherein the first set of the plurality of vapor passage holes has a diameter of a first size, and the second set of the plurality of vapor passage holes has a diameter of a second size smaller than the first size.

4 . The method of claim 1 , wherein the soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state comprises:

loading the substrate on which the electronic components are disposed into a vapor generating chamber that accommodates the first heat transfer fluid.

5 . The method of claim 1 , wherein the disposing the electronic components on the substrate via the bumps comprises:

printing a solder paste on substrate pads of the substrate;

forming solders on input/output pads of the electronic components; and

disposing the electronic components on the substrate such that the solders are interposed between the input/output pads and the solder paste.

6 . The method of claim 1 , further comprising:

after soldering the bumps, forming a molding member on the substrate to cover the electronic components.

7 . The method of claim 6 , further comprising cutting the substrate along the cutting region that is disposed around the plurality of mounting regions.

8 . A method of manufacturing an electronic device, the method comprising:

forming a plurality of vapor passage holes that penetrate a substrate entirely from a bottom surface of the substrate to a top surface of the substrate, the substrate having a plurality of mounting regions on which electronic components are mounted respectively;

disposing the electronic components on the substrate via bumps;

loading the substrate on which the electronic components are disposed into a vapor generating chamber that accommodates a first heat transfer fluid;

heating the first heat transfer fluid to generate a second heat transfer fluid in a vapor state within the vapor generating chamber;

supplying the second heat transfer fluid in the vapor state through at least one of the plurality of vapor passage holes; and

soldering the bumps using the second heat transfer fluid in the vapor state,

wherein the plurality of vapor passage holes are formed in a cutting region that is disposed around the plurality of mounting regions.

9 . The method of claim 8 , wherein the forming the plurality of vapor passage holes comprises:

forming a first set of the plurality of vapor passage holes in a first region of the substrate; and

forming a second set of the plurality of vapor passage holes in a second region of the substrate.

10 . The method of claim 9 , wherein the first set of the plurality of vapor passage holes has a diameter of a first size, and the second set of the plurality of vapor passage holes has a diameter of a second size smaller than the first size.

11 . The method of claim 8 , wherein the disposing the electronic components on the substrate via the bumps comprises:

printing a solder paste on substrate pads of the substrate;

forming solders on input/output pads of the electronic components; and

disposing the electronic components on the substrate such that the solders are interposed between the input/output pads and the solder paste.

12 . The method of claim 11 , further comprising cutting the substrate along the cutting region that is disposed around the plurality of mounting regions.

13 . The method of claim 8 , wherein the first heat transfer fluid comprises a Galden solution.

14 . A method of manufacturing an electronic device, the method comprising:

forming a plurality of vapor passage holes that penetrate a substrate entirely from a bottom surface of the substrate to a top surface of the substrate, the substrate having a plurality of mounting regions on which electronic components are mounted respectively;

printing a solder paste on substrate pads of the substrate;

forming solders on input/output pads of the electronic components and

disposing the electronic components on the substrate such that the solders are interposed between the input/output pads and the solder paste;

loading the substrate on which the electronic components are disposed into a vapor generating chamber that accommodates a first heat transfer fluid;

heating the first heat transfer fluid to generate a second heat transfer fluid in a vapor state within the vapor generating chamber;

supplying the second heat transfer fluid in the vapor state through at least one of the plurality of vapor passage holes;

soldering the solders using the second heat transfer fluid in the vapor state,

wherein the plurality of vapor passage holes are formed in a cutting region that is disposed around the plurality of mounting regions.