Integrated separator devices for hardware component separation
Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.
1 . An apparatus, comprising:
a processor carrier having an inner edge and an outer edge, the inner edge defining an aperture; and
a component separator rotatably coupled to the processor carrier, the component separator including a shaft, the shaft extending along a straight line from a first end of the shaft to a second end of the shaft, the first end at a beginning of a first portion of the component separator, the first portion wider than a diameter of the shaft, the second end at a beginning of a second portion of the component separator, the second portion wider than the diameter of the shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.
2 . The apparatus of claim 1 , wherein the shaft has a first length, the shaft is to be within a sleeve of the processor carrier, and the sleeve has a second length.
3 . The apparatus of claim 2 , wherein the aperture is to receive a processor, the processor carrier including a snap tab extending from a surface of the processor carrier between the inner edge and the outer edge, the snap tab to engage with the processor; and
wherein the sleeve of the processor carrier is adjacent the snap tab.
4 . The apparatus of claim 2 , wherein the first length is substantially equal to the second length.
5 . The apparatus of claim 2 , wherein the first length corresponding to the shaft is to define an axis of rotation of the component separator.
6 . The apparatus of claim 5 , wherein the first portion of the component separator includes a head and the second portion of the component separator includes a blade.
7 . The apparatus of claim 6 , wherein the head and the shaft are to rotate relative to the axis of rotation, and the blade is to rotate tangentially about the axis of rotation.
8 . The apparatus of claim 6 , wherein the head is associated with a height, the height to be less than a distance from the inner edge to the outer edge of the processor carrier.
9 . The apparatus of claim 1 , wherein the first portion of the component separator is wider than the shaft to prevent the component separator from moving linearly towards the center of the processor carrier.
10 . The apparatus of claim 1 , wherein the component separator includes a slot to drive rotation of the component separator relative to the processor carrier.
11 . The apparatus of claim 1 , wherein the component separator includes a protrusion to drive rotation of the component separator relative to the processor carrier.
12 . The apparatus of claim 1 , wherein the second portion of the component separator includes a blade tip that is to fit between a processor coupled to the processor carrier and a heatsink coupled to the processor, the heatsink coupled to the processor via an adhesive bond, and wherein, during rotation of the component separator, the component separator applies a force to the processor in a first direction that is away from the heatsink to break the adhesive bond.
13 . The apparatus of claim 1 , wherein the shaft defines an axis of rotation of the component separator, and a width of the component separator is a distance measured from a first edge of the component separator to a second edge of the component separator, the first edge to be a furthest edge from the axis of rotation in a first direction that is perpendicular to the axis of rotation, the second edge to be a furthest edge from the first edge in a second direction that is opposite and parallel to the first direction, the width to be approximately 5.5 millimeters.
14 . A method comprising:
providing a carrier to receive a processor, the carrier including a frame defining an opening;
integrating a clip onto the frame;
providing a separator device including a straight shaft between a head and a wedge, the wedge having a length that extends along a plane containing a line corresponding to a central axis of the shaft, the head longitudinally aligned with an elongate length of the shaft such that the line passes through the head;
integrating a drive into the head of the separator device, the drive defined by surfaces that are to interface with a rotation tool; and
coupling the separator device and the carrier by positioning the shaft of the separator device within the clip.
15 . The method of claim 14 , wherein the clip includes a passageway having a first diameter, and the shaft is associated with a second diameter that corresponds to the first diameter such that the shaft is rotatably coupled to the carrier.
16 . The method of claim 14 , wherein the clip of the carrier is associated with a clip width and the shaft of the separator device is associated with a shaft length, the shaft length to be substantially equal to the clip width, the positioning of the shaft in the clip including positioning the shaft length within the clip width.
17 . The method of claim 14 , wherein the carrier includes a snap tab extending from the frame, the snap tab is to retain the processor; and the integrating of the clip onto the frame includes integrating the clip adjacent the snap tab.
18 . The method of claim 17 , including:
attaching the processor to the frame by positioning the processor within the frame such that the snap tab engages with the processor; and
positioning the separator device such that, during rotation of the separator device, the separator device applies a force to the processor in a first direction that is away from a heatsink coupled to the processor.
19 . An apparatus comprising:
a frame defining an aperture to receive a semiconductor component; and
a separator device to be coupled to the frame, the separator device including:
a first end portion including a blade;
a second end portion having surfaces to interface with a rotation tool; and
a shaft extending in a straight line along a central axis, the shaft extending from the first end portion to the second end portion, the first end portion being wider than a diameter of the shaft in a direction perpendicular to the central axis, the second end portion being wider than the diameter of the shaft in a direction perpendicular to the central axis.
20 . The apparatus of claim 19 , wherein the frame includes a clip, and the shaft of the separator device is within the clip of the frame.
21 . The apparatus of claim 20 , wherein the shaft is associated with a shaft length, the shaft length to correspond to a width of a passageway defined by the clip of the frame.
22 . The apparatus of claim 19 , wherein the blade is to fit between the semiconductor component and a heatsink coupled to the semiconductor component, the heatsink coupled to the semiconductor component via an adhesive bond.
23 . The apparatus of claim 22 , wherein the blade is to force the semiconductor component to move away from the heatsink to break the adhesive bond when the separator device is rotated relative to the frame.
24 . The apparatus of claim 19 , wherein the first end portion includes a stop protruding from a side of the blade, the stop to inhibit rotation of the separator device in a first direction while permitting rotation of the separator device in a second direction opposite the first direction.
25 . The apparatus of claim 19 , wherein the second end portion has a shape that is non-symmetrical about an axis of rotation, the axis of rotation colinear with the central axis of the shaft, the shape including an arced portion and a corner defined between two planar portions.