Active condensation management for sub-ambient cooling device
Embodiments herein describe active condensation management for a sub-ambient cooling device. In an example, the sub-ambient cooling device includes first and second TEC systems arranged in a stacked configuration, where the first TEC system is positioned between an integrated circuit device and the second TEC system, an IC-facing surface of the second TEC system has features (e.g., channels and ribs) that control a location at which condensation occurs and that direct the condensation to a catch basin positioned within a gap between the TEC systems. The features may be designed to function in multiple orientations, which may be useful to permit a cooled device to operate upright or on its side. The sub-ambient cooling device may include an enclosure to define/restrict a volume of space to be dehumidified.
1 . An environmental control system (ECS) for an integrated circuit (IC) device, comprising:
first and second thermo-electric cooler (TEC) systems arranged in a stacked configuration such that the first TEC system is positioned between the IC device and the second TEC system;
wherein an IC-facing surface of the second TEC system has first, second, and third recessed channels;
wherein a wall between the first and second recessed channels defines a first rib; and
wherein a wall between the first and third recessed channels defines a second rib.
2 . The ECS of claim 1 , wherein:
the first TEC system comprises a first cold plate, a first fluid container, and a first TEC disposed therebetween;
the second TEC system comprises a second cold plate, a second fluid container, and a second TEC disposed therebetween;
a heat pipe having a first end disposed within an opening of the first cold plate and a second end disposed within an opening of the second cold plate; and
the IC-facing surface of the second TEC system corresponds to an IC-facing surface of the second cold plate.
3 . The ECS of claim 1 , wherein:
the first recessed channel is configured such that a surface of the first recessed channel is cooler than the IC-facing surface of the second TEC system when the second TEC system is operating.
4 . The ECS of claim 1 , wherein the first and second ribs are configured to drip water that condenses on a surface of the first recessed channel, away from the IC-facing surface of the second TEC system when the IC-facing surface is oriented horizontally.
5 . The ECS of claim 4 , wherein the second and third recessed channels are configured to preclude the water from flowing from the first and second ribs to the IC-facing surface of the second TEC system when the IC-facing surface is oriented horizontally.
6 . The ECS of claim 1 , wherein:
the first recessed channel extends to an opening in a second surface of the second TEC system;
the second surface is adjacent to the IC-facing surface;
the second surface has a fourth recessed channel;
the fourth recessed channel has a contour of the opening; and
a wall between the fourth recessed channel and the opening defines a third rib.
7 . The ECS of claim 6 , wherein the third rib is configured to drip water that condenses on a surface of the first recessed channel, away from the second surface, when the IC-facing surface and the first recessed channel are oriented vertically.
8 . The ECS of claim 6 , wherein the fourth recessed channel is configured to preclude water from flowing from the third rib to the second surface, when the IC-facing surface and the first recessed channel are oriented vertically.
9 . The ECS of claim 6 , further comprising a catch basin configured to catch and retain water that drips from the first and second ribs when the IC-facing surface is oriented horizontally, and to catch and retain water that drips from the third rib when the IC-facing surface and the first recessed channel are oriented vertically.
10 . The ECS of claim 9 , wherein the catch basin is removeably and slideably disposed within a gap between the first and second TEC systems.
11 . The ECS of claim 1 , further comprising:
an enclosure configured to enclose the first and second TEC systems therein, wherein the enclosure has an opening dimensioned to fit over the IC device.
12 . The ECS of claim 11 , wherein:
the first and second TEC systems have respective fluid inlets and fluid outlets; and
the enclosure further has corresponding fluid inlet pipe openings and fluid outlet pipe openings.
13 . The ECS of claim 1 , wherein the first and second TEC system have respective fluid inlets and fluid outlets, further comprising:
a heat exchanger system comprising a fluid pump and a heat exchanger;
fluid inlet pipes configured to provide fluid inlet paths from the heat exchanger system to the fluid inlets of the first and second TEC systems; and
fluid outlet pipes configured to provide fluid outlet paths from the fluid outlets of the first and second TEC systems to the heat exchanger system.
14 . A computing device, comprising:
a circuit card; and
an environmental control system disposed over an integrated circuit (IC) device of the circuit card, comprising first and second thermo-electric cooler (TEC) systems arranged in a stacked configuration such that the first TEC system is positioned between the IC device and the second TEC system;
wherein an IC-facing surface of the second TEC system has first, second, and third recessed channels;
wherein a wall between the first and second recessed channels defines a first rib; and
wherein a wall between the first and third recessed channels defines a second rib.
15 . The computing device of claim 14 , wherein:
the first recessed channel is configured such that a surface of the first recessed channel is cooler than the IC-facing surface of the second TEC system when the second TEC system is operating;
the first and second ribs are configured to drip water that condenses on the surface of the first recessed channel, away from the IC-facing surface of the second TEC system, when the IC-facing surface is oriented horizontally; and
the second and third recessed channels are configured to preclude the water from flowing from the first and second ribs to the IC-facing surface of the second TEC system, when the IC-facing surface is oriented horizontally.
16 . The computing device of claim 14 , wherein:
the first recessed channel extends to an opening in a second surface of the second TEC system;
the second surface is adjacent to the IC-facing surface;
the second surface has a fourth recessed channel;
the fourth recessed channel has a contour of the opening; and
a wall between the fourth recessed channel and the opening defines a third rib.
17 . The computing device of claim 16 , wherein:
the third rib is configured to drip water that condenses on a surface of the first recessed channel, away from the second surface when the IC-facing surface and the first recessed channel are oriented vertically; and
the fourth recessed channel is configured to preclude the water from flowing from the third rib to the second surface when the IC-facing surface and the first recessed channel are oriented vertically.
18 . The computing device of claim 16 , further comprising a catch basin configured to catch and retain water that drips from the first and second ribs when the IC-facing surface is oriented horizontally, and to catch and retain water that drips from the third rib when the IC-facing surface and the first recessed channel are oriented vertically.