IP Library Granted Patent US 12701676
Granted Patent B2
US 12701676 · App. 18/435,111 · Granted Aug 4, 2026

Thermal conductive element and electronic device

Inventor: Cong Zeng (Beijing, CN)
Assignee: LENOVO (BEIJING) LIMITED
H05K7/20472G06F1/1616G06F1/1652G06F1/1681
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Quick Facts
Patent No.
US 12701676
App. No.
18/435,111
Granted
Aug 4, 2026
Kind
B2
Abstract

A thermal conductive element includes a thermal conductive sheet and a target piece. The target piece is configured to be disposed in a target area of the thermal conductive sheet, and the target piece makes a target part of the thermal conductive sheet deform to form a first protrusion.

Claims (38)

1 . An electronic device, comprising:

a first device body;

a second device body; and

a hinge-connection element located between the first device body and the second device body and including a first workpiece, a second workpiece, and a third workpiece, the first workpiece and the third workpiece respectively arranged on two opposite sides of the second workpiece and configured to rotate relative to the second workpiece, so as to adapt to a switch posture of the electronic device between the unfolded state and the folded state, wherein:

when the first device body and the second device body connected through the hinge-connection element are in the unfolded state, a deformed portion of a thermal conductive element of the electronic device forms at least one first protrusion; and

when the first device body and the second device body connected through the hinge-connection element are in the folded state in which the first device body and the second device body are parallel to each other, the deformed portion of the thermal conductive element forms a second protrusion.

2 . The electronic device of claim 1 , wherein, when the electronic device switches from the unfolded state to the folded state, the at least one first protrusion recovers to become a part of the second protrusion.

3 . The electronic device of claim 1 , wherein the at least one first protrusion is accommodated in a first space formed by the electronic device when the electronic device is in the unfolded state; and

the second protrusion is accommodated in a second space formed by the electronic device when the electronic device is in the folded state.

4 . The electronic device of claim 1 , wherein the at least one first protrusion of the thermal conductive element is formed by a force provided by a target piece located in a target area.

5 . The electronic device of claim 4 , wherein;

the deformed portion is recovered to form the second protrusion by a force of the first device body and the second device body, and the force applied to the deformed portion is a reaction force for the force provided by the target piece; and/or

the at least one first protrusion includes two first protrusions symmetrically arranged on left and right sides of the target area.

6 . The electronic device of claim 2 , wherein the electronic device includes a flexible display screen.

7 . The electronic device of claim 6 , wherein, when the at least one first protrusion recovers to become a part of the second protrusion, a middle part of the thermal conductive sheet forms a smooth curved surface that matches the flexible display screen.

8 . A thermal conductive element, comprising:

a thermal conductive sheet; and

a target piece, wherein the target piece is configured to be disposed in a target area of the thermal conductive sheet by fixing the target piece in a stretched state to the target area of the thermal conductive sheet through a pair of rubber strips, and the target piece makes a target part of the thermal conductive sheet deform to form a first protrusion.

9 . The thermal conductive element of claim 8 , wherein the first protrusion is acted upon by a force from the target piece.

10 . The thermal conductive element of claim 9 , wherein, when the target piece is subjected to a reaction force greater than an action force provided by the target piece, the deformation of the target part of the thermal conductive sheet begins to recover; and

when the target piece is subjected to a reaction force smaller than an action force provided by the target piece, the deformation of the target part of the thermal conductive sheet begins to form the first protrusion.

11 . The thermal conductive element of claim 10 , wherein the thermal conductive sheet further comprises:

a first attaching area, a first part of the thermal conductive sheet corresponding to the first attaching area; and

a second attaching area, a second part of the thermal conductive sheet corresponding to the second attaching area, wherein:

the target area is located between the first attaching area and the second attaching area, and the target part is inside a middle part, which is a part between the first part and the second part and is larger than the target part; and

the middle part is deformed to form a second protrusion by a force exerted by the first part and the second part, and a force received by the middle part serves as a reaction force for the action force provided by the target piece.

12 . The thermal conductive element of claim 11 , wherein each of the first attaching area and the second attaching area is disposed with a respective film for bonding to a corresponding area of a device body of an electronic device.

13 . The thermal conductive element of claim 8 , wherein: the target piece is an elastic film; and/or the thermal conductive sheet is one of a graphite film or a metal foil.

14 . The thermal conductive element of claim 8 , wherein the target piece makes the target part of the thermal conductive sheet deform to form more than one first protrusion.

15 . The thermal conductive element according to claim 8 , wherein the target piece and the thermal conductive sheet are different materials.

16 . An electronic device, comprising:

a flexible display screen;

a first device body;

a second device body; and

a hinge-connection element located between the first device body and the second device body, wherein:

when the first device body and the second device body connected through the hinge-connection element are in an unfolded state, a deformed portion of a thermal conductive element of the electronic device forms at least one first protrusion;

when the first device body and the second device body connected through the hinge-connection element are in a folded state in which the first device body and the second device body are parallel to each other, the deformed portion of the thermal conductive element forms a second protrusion; and

when the at least one first protrusion recovers to become a part of the second protrusion, a middle part of the thermal conductive sheet forms a smooth curved surface that matches the flexible display screen.