IP Library › Granted Patent US 12701677
Granted Patent B2
US 12701677 · App. 18/544,770 · Granted Aug 4, 2026

Thermal management system

Inventors: Brett Heher (Pittsburgh, PA); John D. Walker (Erie, PA)
Assignee: Transportation IP Holdings, LLC
H05K7/20509B33Y80/00H05K7/20127B33Y10/00
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Quick Facts
Patent No.
US 12701677
App. No.
18/544,770
Granted
Aug 4, 2026
Kind
B2
Abstract

A thermal management system may include a solid state heat pump thermally coupled with a component and a first thermal management assembly thermally coupled with the heat pump. The first thermal management assembly may conduct the thermal energy between the component and an external environment via the heat pump. The system may include a second thermal management assembly thermally coupled with the component to conduct the thermal energy between the component and the external environment. The first thermal management assembly can conduct a first portion of the thermal energy between the component and the external environment via the solid state heat pump. The second thermal management assembly may conduct a second portion of the thermal energy between the component and the external environment. These portions of thermal energy can create convection movement of a working fluid between the thermal management assemblies.

Claims (50)

1 . A system, comprising:

a thermal spreader thermally coupled with a component;

a solid state heat pump thermally coupled with the component via the thermal spreader;

a first thermal management assembly and a second thermal management assembly;

wherein the second thermal management assembly is thermally coupled with the solid state heat pump, the second thermal management assembly configured to conduct thermal energy between the component and an external environment via the solid state heat pump; and

wherein the first thermal management assembly is thermally coupled with the thermal spreader, the first thermal management assembly configured to conduct the thermal energy between the component and the external environment via the thermal spreader,

wherein the second thermal management assembly and the first thermal management assembly are partially thermally isolated from each other by a thermally insulative divider wall such that a first portion of the thermal energy is conducted between the component and the external environment via the second thermal management assembly and the solid state heat pump, and a second portion of the thermal energy is conducted between the component and the external environment via the first thermal management assembly and the thermal spreader,

the first portion and the second portion of the thermal energy being at different temperatures to create convection movement of a working fluid between the first thermal management assembly and the second thermal management assembly.

2 . The system of claim 1 , wherein the second thermal management assembly and the first thermal management assembly are partially thermally isolated from each other by one or more of a spatial gap or a thermally insulative body that permits flow of the working fluid between the second thermal management assembly and the first thermal management assembly.

3 . The system of claim 2 , wherein the second thermal management assembly and the first thermal management assembly are partially thermally isolated from each other by the spatial gap, and further comprising one or more stiffening bridges connecting the second thermal management assembly and the first thermal management assembly across the spatial gap.

4 . The system of claim 1 , wherein each of the second thermal management assembly and the first thermal management assembly is a heat sink having one or more fins, pins, or honeycomb structures that dissipate the thermal energy to the external environment or that receive the thermal energy from the external environment.

5 . The system of claim 1 , wherein the solid state heat pump, the thermal spreader, the second thermal management assembly, and the first thermal management assembly are configured to operate to cool the component.

6 . The system of claim 1 , wherein the solid state heat pump, the thermal spreader, the second thermal management assembly, and the first thermal management assembly are configured to operate to heat the component.

7 . The system of claim 1 , wherein the thermal spreader is disposed between the component and both the second thermal management assembly and the first thermal management assembly, and the solid state heat pump is disposed between the thermal spreader and the second thermal management assembly.

8 . The system of claim 1 , wherein one or both of the second thermal management assembly or the first thermal management assembly includes conduits through which the working fluid flows between the second thermal management assembly and the first thermal management assembly due to the convection movement of the working fluid.

9 . The system of claim 8 , wherein one or more of the conduits are larger in or at the second thermal management assembly or the first thermal management assembly than in or at another of the second thermal management assembly or the first thermal management assembly.

10 . The system of claim 1 , wherein the component is a second component, and the solid state heat pump is thermally coupled with the second component and one or more additional components by the thermal spreader.

11 . The system of claim 1 , wherein the thermal spreader is an additively manufactured body.

12 . The system of claim 1 , wherein the solid state heat pump is disposed between the second thermal management assembly and the first thermal management assembly, and the first thermal management assembly is disposed between the solid state heat pump and the component.

13 . The system of claim 1 , wherein the solid state heat pump, the second thermal management assembly, the first thermal management assembly, and the thermal spreader define a thermal management device, and further comprising one or more additional ones of the thermal management device with the thermal management devices arranged in one or more three dimensional structures.

14 . A method comprising:

additively manufacturing the system according to claim 1 .

15 . A system, comprising:

a solid state heat pump thermally coupled with a component;

a first thermal management assembly and a second thermal management assembly:

wherein the second thermal management assembly is thermally coupled with the solid state heat pump, the second thermal management assembly configured to conduct thermal energy between the component and an external environment via the solid state heat pump; and

wherein the first thermal management assembly is thermally coupled with the component, the first thermal management assembly configured to conduct the thermal energy between the component and the external environment,

wherein the second thermal management assembly is configured to conduct a first portion of the thermal energy between the component and the external environment via the solid state heat pump, the first thermal management assembly configured to conduct a second portion of the thermal energy between the component and the external environment,

wherein the first portion and the second portion of the thermal energy create convection movement of a working fluid between the first thermal management assembly and the second thermal management assembly, and

wherein the second thermal management assembly and the first thermal management assembly are partially thermally isolated from each other by an insulative wall.

16 . The system of claim 15 , further comprising a thermal spreader thermally coupled with the component and disposed between the component and the second thermal management assembly, the heat pump disposed between the thermal spreader and the first thermal management assembly.

17 . A system, comprising:

a solid state heat pump thermally coupled with a component;

a first thermal management assembly and a second thermal management assembly;

wherein the second thermal management assembly is thermally coupled with the solid state heat pump, the second thermal management assembly configured to conduct thermal energy between the component and an external environment via the solid state heat pump;

wherein the first thermal management assembly is thermally coupled with the component, the first thermal management assembly configured to conduct the thermal energy between the component and the external environment;

wherein the second thermal management assembly is configured to conduct a first portion of the thermal energy between the component and the external environment via the solid state heat pump, the first thermal management assembly configured to conduct a second portion of the thermal energy between the component and the external environment;

wherein the first portion and the second portion of the thermal energy create convection movement of a working fluid between the first thermal management assembly and the second thermal management assembly;

wherein the system further comprises a thermal spreader thermally coupled with the component and disposed between the component and the second thermal management assembly, the heat pump disposed between the thermal spreader and the first thermal management assembly; and

wherein the thermal spreader includes a cantilevered beam with the heat pump disposed between the beam and the first thermal management assembly.

18 . The system of claim 17 , further comprising a fastener extending through the beam and into a receptacle in the first thermal management assembly, the fastener securing the heat pump between the thermal spreader and the first thermal management assembly.

19 . A system, comprising:

a thermal spreader thermally coupled with a component;

a solid state heat pump thermally coupled with the component via the thermal spreader;

a first thermal management assembly and a second thermal management assembly;

wherein the second thermal management assembly is thermally coupled with the solid state heat pump, the second thermal management assembly configured to conduct thermal energy between the component and an external environment via the solid state heat pump; and

wherein the first thermal management assembly is thermally coupled with the thermal spreader, the first thermal management assembly configured to conduct the thermal energy between the component and the external environment via the thermal spreader,

wherein the second thermal management assembly and the first thermal management assembly are partially thermally isolated from each other by a thermally insulative divider wall such that a first portion of the thermal energy is conducted between the component and the external environment via the second thermal management assembly and the solid state heat pump, and a second portion of the thermal energy is conducted between the component and the external environment via the first thermal management assembly and the thermal spreader, the first portion and the second portion of the thermal energy being at different temperatures to create convection movement of a working fluid between the first thermal management assembly and the second thermal management assembly;

wherein the solid state heat pump is disposed between the second thermal management assembly and the first thermal management assembly, and the first thermal management assembly is disposed between the solid state heat pump and the component; and

wherein the system further comprises a thermally insulative divider wall disposed between the second thermal management assembly and the first thermal management assembly.