Electronic system liquid cooling apparatus with sustained heat output for energy re-use
A method is described. The method includes monitoring a combined workload of electronic devices that are being cooled by a secondary loop. The method includes flowing a first portion of secondary fluid through the secondary loop's heat exchanger and bypassing a second portion of the secondary fluid through the secondary loop's heat exchanger. The method includes, in response to an increase in the combined workload of the electronic devices, adjusting a first setting of a valve to increase the first portion and decrease the second portion. The method includes, in response to a decrease in the combined workload of the electronic devices, adjusting a second setting of the valve to decrease the first portion and increase the second portion.
1 . An apparatus, comprising:
a pump;
a plurality of cold plates through which fluid pumped by the pump is to flow, the cold plates to receive heat from respective electronic devices;
a heat exchanger to receive a first portion of the fluid after the fluid flows through the cold plates;
a bypass around the heat exchanger, the bypass to receive a second portion of the fluid after the fluid flows through the cold plates;
a valve, the valve downstream of an intake of the bypass and upstream of an intake of the heat exchanger; and
at least one programmable circuit communicatively coupled to the valve, one or more of the at least one programmable circuit to determine a valve setting based on power consumption of one or more of the electronic devices, the valve setting defining a degree to which the valve is open, the first portion of the fluid and the second portion of the fluid defined based on the valve setting.
2 . The apparatus of claim 1 , wherein the valve setting is a first valve setting, the first valve setting defining a first amount of the first portion of the fluid and a second amount of the second portion of the fluid, and one or more of the at least one programmable circuit is to:
detect an increase in the power consumption of a first one of the electronic devices; and
adjust the first valve setting to a second valve setting to cause the first amount of the first portion of the fluid to increase and the second amount of the second portion of the fluid to decrease.
3 . The apparatus of claim 2 , wherein one or more of the at least one programmable circuit is to:
detect a decrease in the power consumption of the first one of the electronic devices; and
adjust the second valve setting to the first valve setting to cause the first amount of the first portion of the fluid to decrease and the second amount of the second portion of the fluid to increase.
4 . The apparatus of claim 1 , wherein one or more of the at least one programmable circuit is to cause a temperature of the first portion of the fluid to remain above a minimum threshold for a plurality of different power consumptions of the electronic devices.
5 . The apparatus of claim 1 , wherein one or more the at least one programmable circuit is a component of one of the electronic devices.
6 . The apparatus of claim 1 , wherein the electronic devices are within a same rack.
7 . The apparatus of claim 1 , wherein the pump is to maintain a flow rate to cool the respective electronic devices, the flow rate based on operation of the respective electronic devices at maximum power.
8 . A data center, comprising:
a plurality of racks including electronic systems, the respective electronic systems including electronic devices that are cooled by respective cold plates;
a plurality of secondary loop heat exchangers to receive respective first portions of secondary loop fluid from respective ones of the cold plates, the plurality of secondary loop heat exchangers including a first secondary loop heat exchanger;
fluidic bypasses around corresponding ones of the secondary loop heat exchangers to receive respective second portions of the secondary loop fluid, the fluidic bypasses including a first fluidic bypass, the first portions of the secondary loop fluid and the second portions of the secondary loop fluid determined from respective settings of respective valves, the valves including a first valve, the first valve downstream of an intake of the first fluidic bypass and upstream of an intake of the first secondary loop heat exchanger;
a primary loop including a primary heat exchanger, a pump, and respective fluidic channels that flow through the plurality of secondary loop heat exchangers, the primary heat exchanger to provide a source of heat; and
at least one programmable circuit to determine the respective settings of the valves and a pump rate of the pump based on power consumption of the respective electronic devices of corresponding ones of the racks so that the heat remains above a threshold, the respective settings of the valves defining a degree to which the valves are open.
9 . The data center of claim 8 , wherein the settings of the respective valves include a first valve setting for the first valve, the first valve setting defining a first amount of the first portion of the secondary loop fluid associated with the first secondary loop heat exchanger and a second amount of the second portion of the secondary loop fluid associated with the first fluidic bypass, and one or more of the at least one programmable circuit is to:
detect an increase in the power consumption for a subset of the electronic devices, wherein the heat of the electronic devices in the subset is transferred to the primary loop by the first secondary loop heat exchanger; and
adjust the first valve setting to a second valve setting to cause the first amount of the first portion of the secondary loop fluid to increase and the second amount of the second portion of the secondary loop fluid to decrease.
10 . The data center of claim 9 , wherein one or more of the at least one programmable circuit is to:
detect a decrease in the power consumption for the subset of the electronic devices; and
adjust the second valve setting to the first valve setting to cause the first amount of the first portion of the secondary loop fluid to decrease and the second amount of the second portion of the secondary loop fluid to increase.
11 . The data center of claim 8 , wherein one or more of the at least one programmable circuit is to cause the pump rate to decrease responsive to a decrease in the power consumption of the respective electronic devices across the plurality of racks.
12 . The data center of claim 11 , wherein one or more of the at least one programmable circuit is to cause the pump rate to increase responsive to an increase in the power consumption of the respective electronic devices across the plurality of racks.
13 . The data center of claim 8 , wherein one or more of the at least one programmable circuit is to cause the heat to remain above the threshold across a range of power consumptions across the plurality of racks.
14 . The data center of claim 8 , wherein one or more of the at least one programmable circuit is a component of one of the electronic devices.
15 . A machine-readable storage medium comprising machine-readable instructions to cause at least one programmable circuit to at least:
monitor a power consumption of one or more electronic devices that are being cooled by a secondary loop;
cause a first portion of secondary fluid to flow through a heat exchanger and bypassing a second portion of the secondary fluid around the heat exchanger;
in response to an increase in the power consumption of the one or more of electronic devices, adjust a first setting of a valve to increase a first amount of the first portion of the secondary fluid and decrease a second amount of the second portion of the secondary fluid, the valve located downstream of an intake of a bypass of the heat exchanger and upstream of an intake of the heat exchanger; and
in response to a decrease in the power consumption of the one or more electronic devices, adjust a second setting of the valve to decrease the first amount of the first portion of the secondary fluid and increase the second amount of the second portion of the secondary fluid.
16 . The machine-readable storage medium of claim 15 , wherein the adjustment of the first setting of the valve is to cause the secondary fluid to reach a temperature above a threshold.
17 . The machine-readable storage medium of claim 16 , wherein the adjustment of the second setting of the valve is to cause the secondary fluid to reach the temperature above the threshold.
18 . The machine-readable storage medium of claim 15 , wherein the machine-readable instructions are to cause one or more of the at least one programmable circuit to monitor the power consumption of the one or more electronic devices and one or more other electronic devices that are being cooled by another secondary loop.
19 . The machine-readable storage medium of claim 18 , wherein the secondary loop is a first secondary loop, the heat exchanger is a first heat exchanger, and the machine-readable instructions are to cause one or more of the at least one programmable circuit to cause a rate of fluid flow through the first heat exchanger and a second heat exchanger of the other secondary loop to decrease responsive to a decrease in the power consumption of the one or more electronic devices that are being cooled by the first secondary loop and the one or more other electronic devices that are being cooled by the other secondary loop.
20 . The machine-readable storage medium of claim 19 , wherein the machine-readable instructions are to cause one or more of the least one programmable circuit to cause the rate of fluid flow through the first heat exchanger of the first secondary loop and the second heat exchanger of the other secondary loop to increase responsive to an increase in the power consumption of the one or more electronic devices that are being cooled by the first secondary loop and the one or more other electronic devices that are being cooled by the other secondary loop.
21 . The machine-readable storage medium of claim 15 , wherein the machine-readable instructions are to cause a flow rate of the secondary loop to be maintained to cool the electronics devices, the flow rate based on operation of the respective electronic devices at maximum power.