IP Library › Granted Patent US 12701831

Granted Patent B2

US 12701831 · App. 17/119,136 · Granted Aug 4, 2026

Light emitting diode package and light emitting apparatus comprising the same

Inventors: Yuriy Bilenko (Gyeonggi-do, KR); Ki Yon Park (Gyeonggi-do, KR)

Assignee: Seoul Viosys Co., Ltd.

H10H20/8506 H10H20/855 H10H20/036

View Patent ↗

Loading inventors, assignments & file history…

Monitor This Case

Get email alerts when status or documents change.

Order Certified Copies

Most orders are placed with the USPTO same day — all within 24 business hours.

Order via The Patent Place →

Pre-filled with this patent's details

Quick Facts

Patent No.: US 12701831
App. No.: 17/119,136
Granted: Aug 4, 2026
Kind: B2

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

A light emitting diode package includes a main frame including a base frame and a middle frame disposed on the base frame, a holding frame disposed on the middle frame, a light emitting diode chip disposed on the base frame, and a window secured by the main frame and the holding frame. The middle frame includes a middle frame open portion exposing the light emitting diode chip. The holding frame includes a holding frame open portion at least partially overlapping with the middle frame open portion on a plane. The holding frame open portion has an area decreasing in a direction away from the main frame.

Claims (64)

1 . A light emitting apparatus comprising:

one or more light emitting diode packages, at least one light emitting diode package comprising:

a main frame comprising a base frame and a middle frame disposed on the base frame;

a holding frame secured to the middle frame;

a coupler that physically couples the holding frame to the middle frame;

a light emitting diode chip disposed on the base frame; and

a window secured by the main frame and the holding frame, wherein the window includes an upper window surface having a curvature opposite the base frame, a vertical flat surface, and a lower flat surface opposite the upper window surface,

wherein:

the middle frame comprises an uppermost surface and a middle frame open portion exposing the light emitting diode chip;

the middle frame open portion has an upper opening at the uppermost surface that is farthest from the base frame,

the holding frame comprises a holding frame open portion exposing the middle frame open portion and the light emitting diode chip, a lowermost surface adjoined to the uppermost surface of the middle frame, and an uppermost surface that is farthest from the main frame;

the holding frame open portion having a lower opening at the lowermost surface of the holding frame and an upper opening at the uppermost surface of the holding frame;

the holding frame comprises a holding frame beveled surface between the bottommost surface of the holding frame and the uppermost surface of the holding frame and the beveled surface forms an acute included angle with the uppermost surface of the holding frame;

the holding frame beveled surface is inclined towards the light emitting diode chip from a plane of the uppermost surface of the holding frame;

an area of the lower opening of the holding frame is greater than an area of the upper opening of the holding frame and is greater than an area of the upper opening of the middle frame; and

an area of the uppermost surface of the middle frame is larger than an area of the lowermost surface of the holding frame.

2 . The light emitting apparatus according to claim 1 , wherein the holding frame open region has an area gradually decreasing as a distance from the main frame increases.

3 . The light emitting apparatus according to claim 1 , wherein the middle frame comprises: a middle frame lower surface on which the middle frame adjoins the base frame and at which the middle frame is in contact with the base frame; and a middle frame step below the uppermost surface of the middle frame, and wherein the middle frame open region has a smaller area at the middle frame lower surface than at the uppermost surface of the middle frame.

4 . A light emitting diode package comprising:

a main frame comprising a base frame and a middle frame disposed on the base frame;

a holding frame disposed on the middle frame;

a coupler that physically couples the holding frame to the middle frame;

a light emitting diode chip disposed on the base frame; and

a window secured by the main frame and the holding frame,

wherein the middle frame comprises an uppermost surface and a middle frame open portion exposing the light emitting diode chip,

wherein the middle frame open portion has an upper opening at the uppermost surface that is farthest from the base frame,

wherein the holding frame comprises a holding frame open portion exposing the middle frame open portion and the light emitting diode chip, a lowermost surface adjoined to the uppermost surface of the middle frame, and an uppermost surface that is farthest from the main frame,

wherein the holding frame open portion has a lower opening at the lowermost surface of the holding frame and an upper opening at the uppermost surface of the holding frame and the holding frame open portion has an area gradually decreasing as a distance from the main frame increases,

wherein an area of the lower opening of the holding frame is greater than an area of the upper opening of the holding frame and is greater than an area of the upper opening of the middle frame open portion,

wherein a width of the upper opening region of the holding frame is less than a maximum width of the window,

wherein the window includes an upper window curved surface opposite the base frame, a flat vertical surface, and a flat lower surface facing the base frame;

wherein the middle frame includes a middle frame step below the uppermost surface of the middle frame, and the middle frame step is formed of a horizontal surface and a vertical surface in contact with the horizontal surface, wherein the horizontal surface directly contacts the flat lower surface respectively, of the window; and

wherein the holding frame comprises a beveled surface between the bottommost surface of the holding frame and the uppermost surface of the holding frame, the beveled surface forms an acute included angle with the uppermost surface of the holding frame and includes at least two different inclined angles.

5 . The light emitting diode package according to claim 4 , wherein the uppermost surface of the middle frame has a first area and the lowermost surface of the holding frame has a second area, and the first area is larger than the second area.

6 . The light emitting diode package according to claim 4 , wherein the main frame is integrally formed with the base frame.

7 . The light emitting diode package according to claim 4 ,

wherein the middle frame open portion is one of multiple middle frame open portions disposed adjacent each other on a same plane;

wherein the light emitting diode chip is one of multiple light emitting diode chips disposed exposed through a corresponding one of the multiple middle frame open regions; and

wherein the window is one of multiple windows covering a corresponding one of the middle frame open portions,

wherein the holding frame is one of multiple holding frames securing a corresponding one of the multiple windows.

8 . The light emitting diode package according to claim 4 , wherein the beveled surface of the holding frame is inclined towards the light emitting diode chip from a plane of the uppermost surface of the holding frame.

9 . The light emitting diode package according to claim 4 , wherein the at least two different inclined angles is less than 90 degrees, the angles defined between the uppermost surface of the holding and the beveled surface.

10 . The light emitting diode package according to claim 9 , wherein an area of the uppermost surface of the holding frame is larger than an area of the holding frame lowermost surface.

11 . The light emitting diode package according to claim 4 ,

wherein the middle frame open portion has a tapered shape.

12 . The light emitting diode package according to claim 11 , wherein the window has a maximum width at the middle frame step.

13 . The light emitting diode package according to claim 11 , wherein the window has a semi-ellipsoid shape and a maximum diameter of the window is at the middle frame step.

14 . The light emitting diode package according to claim 11 , wherein a distance from a distal end of the upper window curved surface to the uppermost surface of the middle frame upper surface is greater than a distance from the uppermost surface of the middle frame the flat lower surface of the window.

15 . The light emitting diode package according to claim 14 , wherein the distance from the uppermost surface of the middle frame to the flat lower surface of the window is smaller than a distance from an upper end of the light emitting diode chip to the uppermost surface of the middle frame.

16 . A method of manufacturing a light emitting diode package, comprising:

providing a main frame comprising a base frame and a middle frame disposed on the base frame;

providing a holding frame disposed on the middle frame;

providing a coupler that physically couples the holding frame to the middle frame;

disposing a light emitting diode chip on the base frame; and

providing a window secured by the main frame and the holding frame,

wherein the middle frame comprises an uppermost surface and a middle frame open portion exposing the light emitting diode chip,

wherein the middle frame open portion has an upper opening at the uppermost surface that is farthest from the base frame,

wherein a width of the upper opening of the holding frame is less than a maximum width of the window,

wherein the window includes an upper window curved surface opposite the base frame, a flat vertical surface, and a flat lower surface facing the base frame;