Display substrate, display panel, display apparatus, and method of fabricating display substrate

1 . A display substrate, comprising a respective encapsulated unit and a separation structure substantially surrounding the respective encapsulated unit;

wherein the respective encapsulated unit comprises:

a color conversion layer comprising one or more color conversion blocks;

a respective encapsulating block in an encapsulating layer encapsulating the one or more color conversion blocks; and

a base substrate on a side of the color conversion layer away from the respective encapsulating block, and on a side of the color conversion layer away from the encapsulating layer;

wherein the encapsulating layer is at least partially absent in a peripheral region around the respective encapsulated unit; and

the color conversion layer is on a side of the base substrate closer to the encapsulating layer, and on a side of the encapsulating layer closer to the base substrate;

wherein the display substrate further comprises a plurality of light emitting elements on a side of the encapsulating layer away from the base substrate;

wherein the separation structure comprises a first residual encapsulating layer comprising a ring substantially surrounding the respective encapsulated unit; and

the first residual encapsulating layer is at least partially absent in the peripheral region around the respective encapsulated unit.

2 . The display substrate of claim 1 , wherein the base substrate is at least partially uncovered.

3 . The display substrate of claim 1 , wherein the respective encapsulated unit further comprises:

a respective first inter layer block in a first inter layer on the base substrate; and

a respective second inter layer block in a second inter layer on a side of the first inter layer away from the base substrate.

4 . The display substrate of claim 3 , wherein the first inter layer and the second inter layer comprise insulating materials of different etch selectivity; and

the first inter layer comprises a material having a higher etch selectivity with respect to a material of the second inter layer.

5 . The display substrate of claim 4 , wherein each of the first inter layer and the second inter layer is at least partially absent in the peripheral region around the respective encapsulated unit.

6 . The display substrate of claim 1 , wherein the first residual encapsulating layer and the encapsulating layer are in a same layer.

7 . The display substrate of claim 1 , wherein the separation structure further comprises a stacked structure on a side of the ring of the first residual encapsulating layer away from the respective encapsulated unit; and

the stacked structure substantially surrounds the ring of the first residual encapsulating layer.

8 . The display substrate of claim 7 , wherein the stacked structure comprises:

a first residual layer; and

a second residual layer on a side of the first residual layer away from the base substrate.

9 . The display substrate of claim 8 , wherein an orthographic projection of the second residual encapsulating layer on the base substrate covers an orthographic projection of the first residual layer on the base substrate; and

in a cross-section along a plane perpendicular to a surface of the base substrate and intersecting the respective encapsulated unit and the first residual encapsulating layer, the second residual layer has a width greater than a width of the first residual layer.

10 . The display substrate of claim 8 , wherein the stacked structure further comprises a second residual encapsulating layer on a side of the second residual layer away from the first residual layer; and

the first residual encapsulating layer, the second residual encapsulating layer, and the encapsulating layer are in a same layer.

11 . The display substrate of claim 10 , wherein an orthographic projection of the second residual encapsulating layer on the base substrate covers an orthographic projection of the first residual layer on the base substrate; and

in a cross-section along a plane perpendicular to a surface of the base substrate and intersecting the respective encapsulated unit and the first residual encapsulating layer, the second residual encapsulating layer has a width greater than a width of the first residual layer.

12 . The display substrate of claim 1 , further comprising a light emitting element substrate comprising the plurality of light emitting elements and a sealant layer;

wherein the sealant layer attaches the light emitting element substrate and the respective encapsulated unit together.

13 . A display panel, comprising the display substrate of claim 1 , and a transistor substrate comprising a plurality of thin film transistors.

14 . The display panel of claim 13 , comprising a plurality of islands spaced apart from each other and on the transistor substrate;

wherein a respective island of the plurality of islands comprises the respective encapsulated unit.

15 . The display panel of claim 14 , wherein the respective island further comprises a plurality of contact pins and the plurality of light emitting elements;

a respective light emitting element of the plurality of light emitting elements is electrically connected to at least one of the plurality of contact pads;

the transistor substrate comprises a plurality of thin film transistors and a plurality of contract pads;

at least one contact pad of the plurality of contact pads is electrically connected to a thin film transistor of the plurality of thin film transistors; and

a respective contact pin of the plurality of contact pins is electrically connected to an individual contact pad of the plurality of contact pads.

16 . A display apparatus, comprising the display panel of claim 13 , and one or more integrated circuits connected to the display panel.

17 . A method of fabricating a display substrate, comprising forming a respective encapsulated unit and forming a separation structure substantially surrounding the respective encapsulated unit;

wherein forming the respective encapsulated unit comprises:

forming a color conversion layer comprising one or more color conversion blocks;

forming a respective encapsulating block in an encapsulating layer encapsulating the one or more color conversion blocks; and

forming a base substrate on a side of the color conversion layer away from the respective encapsulating block, and on a side of the color conversion layer away from the encapsulating layer;

wherein the encapsulating layer is at least partially absent in a peripheral region around the respective encapsulated unit; and

the color conversion layer is on a side of the base substrate closer to the encapsulating layer, and on a side of the encapsulating layer closer to the base substrate;

wherein the display substrate further comprises a plurality of light emitting elements on a side of the encapsulating layer away from the base substrate;

wherein the separation structure comprises a first residual encapsulating layer comprising a ring substantially surrounding the respective encapsulated unit;

the first residual encapsulating layer is at least partially absent in the peripheral region around the respective encapsulated unit; and

the first residual encapsulating layer and the encapsulating layer are in a same layer.

18 . The method of claim 17 , comprising:

forming a first inter material layer on a base substrate;

forming a second inter material layer on a side of the first inter material layer away from the base substrate, wherein the first inter layer and the second inter layer comprise insulating materials of different etch selectivity;

forming a photoresist layer on a side of the second inter material layer away from the first inter material layer; and

etching the first inter material layer and the second inter material layer using an etchant, thereby forming a stacked structure, a first inter layer, and a second inter layer;

wherein the stacked structure comprises:

a first residual layer; and

a second residual layer on a side of the first residual layer away from the base substrate.

19 . A display substrate, comprising a respective encapsulated unit and a separation structure substantially surrounding the respective encapsulated unit;

wherein the separation structure comprises a stacked structure having a first residual layer and a second residual layer stacked on each other;

an orthographic projection of the second residual encapsulating layer on a base substrate covers an orthographic projection of the first residual layer on the base substrate;

in a cross-section along a plane perpendicular to a surface of the base substrate and intersecting the respective encapsulated unit, the first residual layer, and the second residual layer, the second residual layer has a width greater than a width of the first residual layer; and

the second residual layer is on a side of the first residual layer away from the base substrate;

wherein the respective encapsulated unit comprises:

a color conversion layer comprising one or more color conversion blocks; and

a respective encapsulating block in an encapsulating layer encapsulating the one or more color conversion blocks;

wherein the encapsulating layer is at least partially absent in the peripheral region around the respective encapsulated unit;

wherein the color conversion substrate further comprises the base substrate on a side of the color conversion layer away from the respective encapsulating block; and

the color conversion layer is on a side of the base substrate closer to the encapsulating layer, and on a side of the encapsulating layer closer to the base substrate;

wherein the display substrate further comprises a plurality of light emitting elements on a side of the encapsulating layer away from the base substrate.

20 . The display substrate of claim 19 , wherein the respective encapsulated unit further comprises:

a respective first inter layer block in a first inter layer on the base substrate; and

a respective second inter layer block in a second inter layer on a side of the first inter layer away from the base substrate;

wherein the first residual layer and the first inter layer are in a same layer; and

the second residual layer and the second inter layer are in a same layer;

wherein the encapsulating layer is in a same layer as a first residual encapsulating layer and a second residual encapsulating layer.