IP Library Granted Patent US 12701842
Granted Patent B2
US 12701842 · App. 18/579,026 · Granted Aug 4, 2026

Multi-ink layered printed electrode for wrap around electrodes

Inventors: Sean Matthew Garner (Elmira, NY); Sijan Khan (Ithaca, NY); Richard Curwood Peterson (Elmira Heights, NY); Lu Zhang (Taipei, TW); Ying Zheng (Horseheads, NY)
Assignee: CORNING INCORPORATED
H10H20/857H10W90/00H10H20/0364
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Quick Facts
Patent No.
US 12701842
App. No.
18/579,026
Granted
Aug 4, 2026
Kind
B2
Abstract

In the present invention, metal nanoparticles are obtained by subjecting a composition for manufacturing metal nanoparticles to a thermal reaction, the composition including (A) a metal oxalate, (B) an amine compound, and (C) a hydroxy fatty acid. The metal nanoparticles are readily dispersed in a polar solvent or a solvent mixture having a high ratio of a polar solvent.

Claims (39)

1 . A method of manufacturing an electrode, the method comprising:

printing a metal precursor ink onto a contact pad on a substrate;

drying the metal precursor ink;

printing a nanoparticle ink on the metal precursor ink; and

consolidating the metal precursor ink and the nanoparticle ink such that metal from the precursor ink and metal from the nanoparticle ink fuse together.

2 . The method of claim 1 , wherein the steps of printing the metal precursor ink and printing the nanoparticle ink are performed by one of an aerosol printer, a pad printer, an ink jet printer, and a spray printer.

3 . The method of claim 1 , wherein the step of drying the metal precursor ink is under ambient conditions.

4 . The method of claim 1 , wherein the step of drying the metal precursor ink is performed at a temperature up to 150° C.

5 . The method of claim 1 , wherein the step of consolidating the metal precursor ink and the nanoparticle ink is at a temperature of less than or equal to 250° C.

6 . The method of claim 1 , wherein the step of consolidating the metal precursor ink and the nanoparticle ink is performed using a laser.

7 . The method of claim 1 , wherein the contact pad includes two contact pads, one being a display contact pad extending from a microLED array on the substrate and one being a rear surface contact pad on an opposite side of the substrate from the microLED array.

8 . The method of claim 7 , further comprising the step of providing a wraparound electrode to contact both the display contact pad and the rear surface contact pad.

9 . The method of claim 1 , wherein the substrate is glass.

10 . The method of claim 1 , wherein a metal in the metal precursor ink and in the nanoparticle ink is silver.

11 . The method of claim 1 , wherein a metal in the metal precursor ink and in the nanoparticle ink is copper.

12 . The method of claim 1 , wherein a metal in the metal precursor ink and a metal in in the nanoparticle ink are the same.

13 . The method of claim 1 , wherein a metal in the metal precursor ink and a metal in in the nanoparticle ink are different.

14 . An array substrate comprising:

a substrate;

a microLED array on a front surface of the substrate and including a display contact pad;

a metal precursor ink electrically contacting the display contact pad; and

a nanoparticle ink electrically contacting the metal precursor ink on the display contact pad.

15 . The array substrate of claim 14 , further comprising:

a rear surface contact pad on a rear surface of the substrate opposite to the front surface;

the metal precursor ink electrically contacting the rear surface contact pad; and

the nanoparticle ink electrically contacting the metal precursor ink on the rear surface contact pad.

16 . The array substrate of claim 15 , further comprising a wraparound electrode to contact the nanoparticle ink on the display contact pad and the rear surface contact pad.

17 . The array substrate of claim 14 , wherein a metal in the metal precursor ink and in the nanoparticle ink is silver.

18 . The array substrate of claim 14 , wherein a metal in the metal precursor ink and in the nanoparticle ink is copper.

19 . The array substrate of claim 14 , wherein the substrate is glass.

20 . The array substrate of claim 14 , wherein a metal in the metal precursor ink and a metal in in the nanoparticle ink are the same.

21 . The array substrate of claim 14 , wherein a metal in the metal precursor ink and a metal in in the nanoparticle ink are different.

22 . An electrode comprising:

a metal precursor ink electrically contacting a contact pad; and

a nanoparticle ink electrically contacting the metal precursor ink on the contact pad.

23 . The electrode of claim 22 , wherein a metal in the metal precursor ink and in the nanoparticle ink is silver.

24 . The electrode of claim 22 , wherein a metal in the metal precursor ink and in the nanoparticle ink is copper.

25 . The electrode of claim 22 , wherein a metal in the metal precursor ink and a metal in in the nanoparticle ink are the same.

26 . The electrode of claim 22 , wherein a metal in the metal precursor ink and a metal in in the nanoparticle ink are different.