Method of packaging and integration for multi-layer system

1 . A method of packaging micro-LEDs onto a substrate, comprising:

microfabricating one or more micro-LEDs on an optically transparent microdevice substrate with an epitaxial layer between the microdevice substrate and an active layer for light generation;

aligning a test substrate with one or more test electrodes to connect each of the one or more electrodes to one of the one or more micro-LEDs;

injecting a current through each test electrode, capturing brightness information from each micro-LED, and creating a map of each healthy and defective micro-LED based on the captured brightness information;

removing the test substrate with one or more test electrodes;

coating a photo-sensitive polymer on the microdevice substrate;

exposing a pattern into the photo-sensitive polymer through optically patterning to remove the photo-sensitive polymer around all defective micro-LEDs;

forcing a receiver substrate with one or more pads towards the microdevice substrate such that at least one of the pads penetrates the photo-sensitive polymer and makes electrical contact with one of the healthy micro-LEDs, and the photo-sensitive polymer fills any gap between the micro-LED and the receiver substrate;

curing the photo-sensitive polymer surrounding one of the healthy micro-LEDs in contact with one of the pads, bonding the one of the healthy micro-LEDs to the receiver substrate and achieving lift-off of the micro-LED from the microdevice substrate; and

moving the microdevice substrate away from the receiver substrate.

2 . The method of claim 1 , further comprising covering one or more sidewalls of each micro-LED with a reflective layer.

3 . The method of claim 1 , further comprising achieving liftoff by passing a laser beam through the microdevice substrate to be absorbed at an interface between the bonded one of the healthy micro-LEDs and the microdevice substrate.

4 . The method of claim 3 , further comprising directing the laser beam off a fast-scanning mirror and guiding the laser beam through optical elements focusing the laser beam on the interface.

5 . The method of claim 3 , further comprising reflecting the laser beam through two or more mirrors to focus on interfaces between the microdevice substrate and multiple of the one or more healthy micro-LEDs.

6 . The method of claim 1 , further comprising repeating the coating, exposing, forcing, and curing steps to bond one or more remaining healthy micro-LEDs to a second receiver substrate.

7 . The method of claim 6 , further comprising repeating bonding of healthy micro-LEDs to receiver substrates until a required resolution of micro-LEDs is achieved for a resolution requirement of a display.

8 . The method of claim 7 , further comprising bonding one type of micro-LEDs in a row and leaving a neighboring space open for a repair process.

9 . The method of claim 8 , further comprising achieving a full-color display by bonding a second type of micro-LEDs in a second row, a third type of micro-LEDs in a third row, and repeating the three row pattern across the full-color display.

10 . The method of claim 7 , further comprising bonding mono-color emitting micro-LEDs of the same mono-color throughout the full-color display, and applying a color conversion layer to achieve a full color display.

11 . The method of claim 10 , further comprising:

planarizing the full-color display above the mono-color emitting micro-LEDs;

filling space between the mono-color emitting micro-LEDs with an optically black material;

coating a reflective layer on top of each of the mono-color emitting micro-LEDs and the optically black material;

directionally etching the reflective layer from the top of the mono-color emitting micro-LEDs and the top of the optically black material; and

filling the color conversion layer on top of each mono-color emitting micro-LED and between the reflective layer remaining on the sides of the optically black material.

12 . The method of claim 10 , further comprising:

forming the color conversion layer on a glass substrate by:

coating and patterning an optically black material on the glass substrate positioned to fit around individual mono-color emitting micro-LEDs of the display;

coating a reflective layer on the black material and glass substrate;

directionally etching the reflective layer to remove it from the glass substrate and top of the optically black material, and leave it on sidewalls of the optically black material; and

filling spaces above the glass substrate and between the reflective-layer coated sidewalls of the optically black material with color-conversion materials;

aligning and bonding the color conversion layer above the mono-color emitting micro-LEDs.

13 . The method of claim 12 , further comprising including an optical layer on the glass substrate beneath the optically black material and color-conversion materials.

14 . The method of claim 12 , further comprising including multiple optical layers on the glass substrate beneath the optically black material and color-conversion materials.

15 . The method of claim 14 , further comprising fabricating optical elements on a side of the glass substrate opposite from a side nearest the color-conversion materials.

16 . The method of claim 1 , further comprising:

fabricating one or more driving circuits on a laser transparent substrate;

coating the photo-sensitive polymer on the laser transparent substrate;

aligning the laser transparent substrate opposite the receiver substrate such that at least one of the one or more driving circuits contacts one or more of the one or more pads;

curing the photo-sensitive polymer surrounding one of the driving circuits in contact with one of the pads, bonding the one of the driving circuits to the receiver substrate and achieving lift-off of the driving circuit from the laser transparent substrate; and

moving the laser transparent substrate away from the receiver substrate.

17 . The method of claim 1 , further comprising for each bonding micro-LED, leaving a neighboring pad open for a repair process.

18 . The method of claim 17 , further comprising:

testing the bonded micro-LEDs and detecting one or more failed micro-LEDs; and

repeating the coating, exposing, forcing, and curing steps to bond one or more remaining healthy micro-LEDs to the open neighboring pad of a detected failed micro-LED.

19 . The method of claim 18 , further comprising removing from the receiver substrate a detected failed micro-LED that has short-circuited.

20 . The method of claim 17 , further comprising:

microfabricating one or more repair micro-LEDs on an optically transparent repair substrate;

coating the photo-sensitive polymer on the repair substrate;

forcing the receiver substrate with one or more pads towards the repair substrate such that the neighboring pad of a failed micro-LED makes electrical contact with one of the repair micro-LEDS;

curing the photo-sensitive polymer surrounding one of the repair micro-LEDs in contact with then neighboring pad, bonding the one of the repair micro-LEDs to the receiver substrate and achieving lift-off of the repair micro-LED from the repair substrate; and

moving the repair substrate away from the receiver substrate.