Contact apparatus for arranging semiconductor devices

1 . A method comprising:

feeding packaged semiconductor devices in a direction of travel along a track extending between an input end to an output end of the track, in which each of the packaged semiconductor devices has a body of a molding material and a pair spaced apart opposing edges and a top surface; and

moving a pad back and forth orthogonally relative to a portion of the track between retracted and extended positions, in which the pad has a contact surface extending longitudinally in a direction parallel to the direction of travel and, when in the extended position, the contact surface engages the top surface of a plurality of respective packaged semiconductor devices within the portion of the track; and

wherein the contact surface of the pad has a length in the direction of travel that is at least two times a length between opposing edges of a given one of packaged semiconductor devices, and moving the pad to the extended position causes the contact surface to concurrently engage at least two of the packaged semiconductor devices.

2 . The method of claim 1 , wherein moving the pad to the extended position causes the contact surface to concurrently engage at least four of the packaged semiconductor devices within the portion of the track.

3 . The method of claim 1 , wherein the portion of the track is located proximal the output end of the track, in which each of the packaged semiconductor devices is picked up from the output end.

4 . A method comprising:

feeding packaged semiconductor devices in a direction of travel along a track extending between an input end to an output end of the track, in which each of the packaged semiconductor devices has a body of a molding material and a pair spaced apart opposing edges and a top surface;

moving a pad back and forth orthogonally relative to a portion of the track between retracted and extended positions, in which the pad has a contact surface extending longitudinally in a direction parallel to the direction of travel and, when in the extended position, the contact surface engages the top surface of a plurality of respective packaged semiconductor devices within the portion of the track; and

wherein the engagement between the contact surface of the pad and the packaged semiconductor devices dislodges mold flash from at least one edge of the packaged semiconductor devices and/or arranges the packaged semiconductor devices end-to-end within the portion of the track.

5 . The method of claim 4 , wherein the contact surface of the pad has a length in the direction of travel that is at least two times a length between opposing edges of a given one of packaged semiconductor devices, and moving the pad to the extended position causes the contact surface to concurrently engage at least two of the packaged semiconductor devices.

6 . The method of claim 5 , wherein moving the pad to the extended position causes the contact surface to concurrently engage at least four of the packaged semiconductor devices within the portion of the track.

7 . A method comprising:

feeding packaged semiconductor devices in a direction of travel along a track extending between an input end to an output end of the track, in which each of the packaged semiconductor devices has a body of a molding material and a pair spaced apart opposing edges and a top surface;

moving a pad back and forth orthogonally relative to a portion of the track between retracted and extended positions, in which the pad has a contact surface extending longitudinally in a direction parallel to the direction of travel and, when in the extended position, the contact surface engages the top surface of a plurality of respective packaged semiconductor devices within the portion of the track; and

wherein the pad is coupled to a shaft extending axially from a pneumatic cylinder, and moving the pad includes:

actuating the pneumatic cylinder to force the shaft axially to move the pad to one of the retracted or extended positions responsive to a control signal.

8 . The method of claim 7 , wherein at least one spring is coupled between the pad and a shaft support at a distal end of the pneumatic cylinder, and moving the pad further includes:

releasing the pneumatic cylinder to enable the at least one spring to force the pad to the other of the retracted or extended positions.

9 . The method of claim 7 , wherein a valve is coupled between the pneumatic cylinder a source of pressurized fluid and the valve is controlled to provide for flow of fluid into or out of the pneumatic cylinder responsive to the control signal.

10 . The method of claim 7 , wherein the contact surface of the pad has a length in the direction of travel that is at least two times a length between opposing edges of a given one of packaged semiconductor devices, and moving the pad to the extended position causes the contact surface to concurrently engage at least two of the packaged semiconductor devices.

11 . The method of claim 10 , wherein moving the pad to the extended position causes the contact surface to concurrently engage at least four of the packaged semiconductor devices within the portion of the track.

12 . A method comprising:

feeding packaged semiconductor devices in a direction of travel along a track extending between an input end to an output end of the track, in which each of the packaged semiconductor devices has a body of a molding material and a pair spaced apart opposing edges and a top surface;

moving a pad back and forth orthogonally relative to a portion of the track between retracted and extended positions, in which the pad has a contact surface extending longitudinally in a direction parallel to the direction of travel and, when in the extended position, the contact surface engages the top surface of a plurality of respective packaged semiconductor devices within the portion of the track; and

wherein moving the pad includes moving at least a distal end portion of the pad through a slit in a cover that is spaced apart from and extends over the track.

13 . The method of claim 12 , wherein the contact surface of the pad has a length in the direction of travel that is at least two times a length between opposing edges of a given one of packaged semiconductor devices, and moving the pad to the extended position causes the contact surface to concurrently engage at least two of the packaged semiconductor devices.

14 . The method of claim 13 , wherein moving the pad to the extended position causes the contact surface to concurrently engage at least four of the packaged semiconductor devices within the portion of the track.

15 . A method comprising:

moving a pad of a contact apparatus between extended and retracted positions above a track as packaged semiconductor units travel along the track between input and output ends of the track, in which the pad is positioned above the track and has a contact surface configured to engage surfaces of an adjacent plurality of the packaged semiconductor units on a portion of the track located opposite the pad when the pad is in the extended position; and

wherein engagement between the contact surface of the pad and the packaged semiconductor units dislodges mold flash from the packaged semiconductor devices and/or arranges the packaged semiconductor devices end-to-end within the portion of the track.

16 . A method comprising:

moving a pad of a contact apparatus between extended and retracted positions above a track as packaged semiconductor units travel along the track between input and output ends of the track, in which the pad is positioned above the track and has a contact surface configured to engage surfaces of an adjacent plurality of the packaged semiconductor units on a portion of the track located opposite the pad when the pad is in the extended position; and

wherein the contact surface of the pad has a length extending in a longitudinal direction of the track that is at least a length of two adjacent packaged semiconductor devices and the moving the pad to the extended position causes the contact surface to concurrently engage at least two adjacent packaged semiconductor devices.

17 . A method comprising:

moving a pad of a contact apparatus between extended and retracted positions above a track as packaged semiconductor units travel along the track between input and output ends of the track, in which the pad is positioned above the track and has a contact surface configured to engage surfaces of an adjacent plurality of the packaged semiconductor units on a portion of the track located opposite the pad when the pad is in the extended position, wherein the contact surface of the pad has a length in the direction of travel that is at least two times a length between opposing edges of a given one of packaged semiconductor devices, and moving the pad to the extended position causes the contact surface to concurrently engage at least two of the packaged semiconductor devices.

18 . The method of claim 17 , wherein moving the pad to the extended position causes the contact surface to concurrently engage at least four of the packaged semiconductor devices within the portion of the track.

19 . The method of claim 17 , wherein the portion of the track is located proximal the output end of the track, in which each of the packaged semiconductor devices is picked up from the output end.

20 . A method comprising:

moving a pad of a contact apparatus between extended and retracted positions above a track as packaged semiconductor units travel along the track between input and output ends of the track, in which the pad is positioned above the track and has a contact surface configured to engage surfaces of an adjacent plurality of the packaged semiconductor units on a portion of the track located opposite the pad when the pad is in the extended position, wherein moving the pad includes moving at least a distal end portion of the pad through a slit in a cover that is spaced apart from and extends over the track.

21 . The method of claim 20 , wherein the contact surface of the pad has a length extending in a longitudinal direction of the track that is at least a length of two adjacent packaged semiconductor devices and the moving the pad to the extended position causes the contact surface to concurrently engage at least two adjacent packaged semiconductor devices.