Substrate handling system background
A substrate handling system, that includes (i) a vacuum booster for generating a pulse of first vacuum flow; (ii) a reference vacuum source for producing a reference vacuum flow; and (iii) an vacuum flow control unit that is configured to: (a) combine, during a boost period, the first and reference vacuum flows to provide a combined vacuum flow that is provided, via conduits, to upper vacuum openings of a chuck, and (b) provide the reference vacuum flow to the upper vacuum openings during a substrate fastening period, wherein the chuck and the vacuum booster are spaced apart from each other and are mechanically coupled to a stage.
1 . A substrate handling system, comprising:
a vacuum booster for generating a pulse of first vacuum flow;
a reference vacuum source for producing a reference vacuum flow;
a vacuum flow control unit configured to:
(a) combine, during a boost period, the first vacuum flow and the reference vacuum flow to provide a combined vacuum flow that is provided, via conduits, to upper vacuum openings of a chuck, and
(b) provide the reference vacuum flow to the upper vacuum openings during a substrate fastening period, wherein the chuck and the vacuum booster are spaced apart from each other and are mechanically coupled to a stage.
2 . The substrate handling system of claim 1 , wherein the vacuum flow control unit comprises one or more sensors for monitoring a pressure level of at least one of the pulse of first vacuum flow and the reference vacuum flow.
3 . The substrate handling system of claim 1 , wherein the conduits interface with spaced apart regions of the chuck.
4 . The substrate handling system of claim 1 , further comprising a feedback system to adjust the at least one of the pulse of first vacuum flow and the reference vacuum flow based on real-time substrate handling conditions using a feedback system.
5 . The substrate handling system of claim 1 , wherein the reference vacuum source is adjustable to vary the reference vacuum flow.
6 . The substrate handling system of claim 1 , wherein the reference vacuum source is configured to provide the reference vacuum flow having a first vacuum value during a first substrate straightening period that precedes the boost period and is configured to provide the reference vacuum flow of a second vacuum value during the boost period.
7 . The substrate handling system of claim 6 , wherein the reference vacuum source is configured to provide the reference vacuum flow of a third value during a first post-boost period, wherein the first value exceeds the third value.
8 . The substrate handling system of claim 7 , wherein the reference vacuum source is configured to provide the reference vacuum flow having a fourth vacuum value during a second post-boost period, wherein the third value exceeds the fourth value.
9 . The substrate handling system of claim 1 , wherein the reference vacuum source comprises a venturi pump that configured to receive a pressurized vacuum flow and is configured to output the reference vacuum flow to multiple supply branches in parallel.
10 . The substrate handling system of claim 9 , wherein the vacuum flow control unit comprises vacuum flow regulators and vacuum flow valves that are configured to select a value of the reference vacuum flow to be provided to the conduits.
11 . A method for handling a substrate with a substrate handling system, the method comprising:
generating a pulse of first vacuum flow using a vacuum booster;
producing a reference vacuum flow using a reference vacuum source; and
using a vacuum flow control unit to:
combine, during a boost period, the first and reference vacuum flows to provide a combined vacuum flow;
provide the combined vacuum flow, via conduits, to upper vacuum openings of a chuck; and
provide the reference vacuum flow to the upper vacuum openings during a substrate fastening period.
12 . The method of claim 11 , further comprising monitoring a pressure level of at least one of the pulse of first vacuum flow and the reference vacuum flow using one or more sensors.
13 . The method of claim 11 , further comprising interfacing the conduits with spaced apart regions of the chuck.
14 . The method of claim 11 , further comprising adjusting the at least one of the pulse of first vacuum flow and the reference vacuum flow based on real-time substrate handling conditions using a feedback system.
15 . The method of claim 11 , further comprising adjusting the reference vacuum source to vary the reference vacuum flow.
16 . The method of claim 11 , further comprising providing the reference vacuum flow having a first vacuum value during a first substrate straightening period that precedes the boost period and providing the reference vacuum flow of a second vacuum value during the boost period.
17 . The method of claim 16 , further comprising providing the reference vacuum flow of a third value during a first post-boost period, wherein the first value exceeds the third value.
18 . The method of claim 17 , further comprising providing the reference vacuum flow having a fourth vacuum value during a second post-boost period, wherein the third value exceeds the fourth value.
19 . The method of claim 11 , wherein the reference vacuum source comprises a venturi pump, further comprising receiving a pressurized vacuum flow and outputting the reference vacuum flow to multiple supply branches in parallel using the venturi pump.
20 . The method of claim 19 , further comprising selecting a value of the reference vacuum flow to be provided to the conduits using vacuum flow regulators and vacuum flow valves included in a vacuum flow control unit.